Abstract: A display bonding device includes a stage configured to place an adhesive tape and an adherend thereon, a pressure head configured to press the adhesive tape onto the adherend with a pressure surface having a tapered shape or a curved shape which is tilted with respect to the stage, and a movement mechanism configured to move the pressure head toward the adhesive tape through a pressure rod which is coupled to the pressure head. The pressure head is configured to rotate around the pressure rod.

Abstract: Disclosed is a board reinforcing structure for reinforcing a circuit board in which an electronic component is mounted on a first surface, the electronic component having an electrode arranged in a rectangular-shaped region on the first surface. The board reinforcing structure includes a reinforcing member bonded to positions corresponding to corner parts of four corners of the rectangular-shaped region on a second surface provided on a side opposite to the first surface of the circuit board. In the board reinforcing structure, corresponding one of notches is formed in the reinforcing member at a position corresponding to one of the corner parts of the four corners of the rectangular-shaped region, and at least two apexes of the reinforcing member directed to an outside are formed to shape a contour thereof with the one of the notches.

Abstract: A disclosed circuit board includes a substrate, a plurality of electrode pads formed on the substrate, and a groove formed between adjacent electrode pads on the substrate. Further, the electrode pads are surrounded by the groove to have an air space between the adjacent electrode pads.

Abstract: A mount structure for mounting an electronic component on a circuit board includes a stress relieving unit including a center portion having a smaller cross section than a cross section of ends of the stress relieving unit; a first joint portion configured to join one end of the stress relieving unit onto an electrode pad of the electronic component; a second joint portion configured to join the other end of the stress relieving unit onto a connecting pad of the circuit board. Hollow spaces are provided between plural joint structures each of which includes the first joint portion, the stress relieving unit, and the second joint portion.

Abstract: Disclosed is a mounting structure for mounting an electronic component on a circuit board. The mounting structure includes an interposer provided between the electronic component and the circuit board; and a plurality of spiral conductors formed in the interposer. The plurality of spiral conductors have one end thereof bonded to corresponding one of external connection terminals of the electronic component and the other end thereof bonded to corresponding one of electrodes of the electronic component.

Abstract: A packaging structure for mounting an electronic component on a printed circuit board is provided, which includes an external connecting terminal of the electronic component connected to an electrode pad of the printed circuit board; a through-hole penetrating through the printed circuit board, the through-hole formed in a periphery of an electronic component mounting area; and a clamping member including a middle portion extending through the through-hole, and a first end portion and a second end portion extending from the middle portion. The first end portion and the second end portion are bent such that the electronic component and the printed circuit board are sandwiched and clamped by the first end portion and the second end portion.

Abstract: An apparatus for forming a solder dam on a lead of an electronic component is disclosed. The apparatus for forming a solder dam includes a wire material that transfers an ink that prevents adhesion of a solder to the lead; a wire material conveying device that conveys the wire material along a surface of the lead; and an ink supply device that supplies the ink to the wire material.

Abstract: An apparatus for forming a solder dam on each lead of an electronic device includes a mask having one or more slits; and forming means that forms the solder dam made of non-metal material on the lead of the electronic device through the slits of the mask.

Abstract: A method of forming a solder dam on a lead of an electronic component includes forming the looped solder dam surrounding a target lead, to which the solder dam is to be formed, of a plurality of leads connected to the electronic component, by fitting a C-shaped fitted member to the target lead at a predetermined location.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.

Abstract: A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

Abstract: A printed wiring board includes a first conductive paste forming a wiring pattern, and a second conductive paste including kneaded first conductive material and second conductive material whose particles are finer than those of the first conductive material.

Abstract: A surface acoustic wave device includes a piezoelectric substrate, an interdigital transducer (IDT) formed on the piezoelectric substrate, an interconnection electrode that is provided on the piezoelectric substrate and is connected to the IDT, the IDT being made of a metal identical to that of the IDT, an inorganic insulation layer that is provided on the piezoelectric substrate so that at least the interconnection electrode is exposed, an insulative resin layer that is located on an interface between the inorganic insulation layer and a portion of the interconnection electrode exposed from the inorganic insulation layer and is formed so as to cover a side surface of the interconnection electrode, and a metal layer that is provided on the interconnection electrode and the insulative resin layer.

Abstract: A conductor is at least partially exposed on the surface of a body. A wiring is formed for connection to the conductor. The conductor is made of a Zn—Al alloy. Heat is then applied to the conductor and the wiring. A chemical reaction is accelerated between the conductor and the wiring based on the heat treatment. This allows oxygen to get released out of the conductor and the wiring. Deoxidation is thus realized on the joint surfaces of the conductor and the wiring. Electric resistance is decreased. Electric conduction can thus be established between the conductor and the wiring.

Abstract: An acoustic wave device includes a substrate; an acoustic wave element provided on the substrate; a terminal that is provided on the substrate and is electrically coupled to the acoustic wave element; a first insulating layer that is provided on the substrate and has a first opening at a region thereof overlapped with at least a part of the terminal; a second insulating layer that has an second opening at a region thereof overlapped with at least a part of the first opening and is provided on the first insulating layer and the acoustic wave element so that a cavity is formed above the acoustic wave element; a third insulating layer that has a third opening including the region where the first opening and the second opening are overlapped with each other, and is provided on the second insulating layer; a metal post that is electrically coupled to the terminal and is provided in the first opening, the second opening and the third opening; and a solder ball provided on the metal post.

Abstract: When manufacturing a circuit board, a wiring pattern is printed on a substrate with a conductive paste formed of metal powder and thermoplastic resin, and then the conductive paste is subjected to a heating treatment and a pressing treatment.

Abstract: A high melting point solder alloy superior in oxidation resistance, in particular a solder alloy provided with both a high oxidation resistance and high melting point suitable for filling fine through holes of tens of microns in diameter and high aspect ratios and forming through hole filling materials, comprising a zinc-aluminum solder alloy containing 0.001 wt % to 1 wt % of aluminum and the balance of zinc and unavoidable impurities.

Abstract: A method of manufacturing an acoustic wave device includes forming a first sealing portion on a substrate having an acoustic wave element thereon so that a functional region, in which an acoustic wave oscillates, of the acoustic wave element acts as a first non-covered portion and a cutting region for individuating acts as a second non-covered portion, forming a second sealing portion on the first sealing portion so as to cover the first non-covered portion and the second non-covered portion, and cutting off the substrate and the second sealing portion so that the second non-covered portion is divided.

Abstract: Metallic powder particles disperse in paste matrix made of resin material. The metallic powder particles each defines a dissolved surface layer having reacted with acid solution. The metallic powder particles having reacted with acid solution is allowed to have a high electrical conductivity. The electrically conductive paste containing the mentioned metallic powder particles is also allowed to exhibit a sufficiently high electrical conductivity. The electrically conductive paste can thus be used for establishment of a fine wiring pattern and establishment of a wiring pattern for a high speed signal, for example. Moreover, the electrically conductive paste can easily be applied to a resin sheet in a predetermined pattern based on silk-screen printing, for example. The electrically conductive paste can be employed in various applications.

Abstract: In a method of producing a micro-actuator, a first adhesive is applied to a movable plate, and a movable, and a movable electrode is placed on the first adhesive. A second adhesive is applied to the movable electrode, and a piezoelectric element is placed on the second adhesive. Next, a third adhesive is applied to an actuator base, a base electrode is placed on the third adhesive, and the third adhesive is semi-cured in the same manner as above. A fourth adhesive is applied to the base electrode, the piezoelectric element is placed on the fourth adhesive, and the fourth adhesive is semi-cured in the same manner as above. Finally, the adhered laminate thus obtained is placed into a heating furnace and heated at a predetermined temperature for a predetermined period of time to thereby fully cure the adhesives.