Patents by Inventor Meng Fu
Meng Fu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20210104450Abstract: A heat dissipating device which is liquid cooled includes a base and at least one heat dissipation fin connected to the base. The base includes a first cavity. The at least one heat dissipation fin comprising a second cavity communicating with the first cavity, the second cavity and the first cavity together form an accommodation cavity for accommodating a working fluid which forcefully applies cooling upon being heated sufficiently to be vaporized.Type: ApplicationFiled: November 7, 2019Publication date: April 8, 2021Inventors: ZHEN-QUAN ZHONG, QIAO-LONG CHEN, MENG FU
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Patent number: 10943757Abstract: Provided is a gas discharge tube, including at least two electrodes and an insulating tube body, which is connected in a sealing manner with the electrodes to form a discharge inner cavity. A low-temperature sealing adhesive for sealing the discharge inner cavity is arranged in the gas discharge tube. The low-temperature sealing adhesive is melted at a specific low temperature to cause gas leakage in the discharge inner cavity.Type: GrantFiled: July 5, 2016Date of Patent: March 9, 2021Assignee: SHENZHEN BENCENT TELECTRONICS CO., LTD.Inventors: Ji He, Meng Fu, Feilong Wang
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Publication number: 20200373267Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: ApplicationFiled: August 10, 2020Publication date: November 26, 2020Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
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Patent number: 10741513Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: GrantFiled: December 19, 2018Date of Patent: August 11, 2020Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
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Patent number: 10477731Abstract: A liquid-cooled radiator includes liquid-cooled boards, a condenser, a driver, a coolant conduit assembly, and a mounting bracket. The liquid-cooled boards and the condenser are mounted on the mounting bracket. The driver is coupled to the liquid-cooled boards and the condenser through the coolant conduit assembly. The coolant conduit assembly includes a main conduit, a diverting block, and a sub-conduit. The diverting block is mounted to the mounting bracket. The liquid-cooled boards are coupled to the diverting block in parallel through the sub-conduit. The condenser, the driver, and the diverting block are coupled together through the main conduit. The driver drives coolant from the condenser to flow through the diverting block and the sub-conduit to the liquid-cooled boards, flow through the sub-conduit and the diverting block to the main conduit, and then flow from the main conduit to the condenser to be condensed.Type: GrantFiled: March 1, 2019Date of Patent: November 12, 2019Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: Meng Fu, Qiao-Long Chen, Lin-Wei Liu
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Publication number: 20190188315Abstract: A new approach is proposed to support grouping and storing a data stream based on the types of data items in the stream for efficient data batch processing and analysis. First, the data stream is uploaded to a cloud storage, wherein the stream of data includes a plurality of data items of different types generated by and collected from different users and/or devices. The data items are then retrieved, grouped and saved by a preprocessing unit into a plurality of batch data queues, wherein data items in each batch data queue are of the same type. One or more batch processing units are then configured to fetch and batch process data items from the batch data queues and store these data items of the same data type to one or more cloud storage files for further processing and analysis on the cloud storage one batch data queue at a time.Type: ApplicationFiled: June 12, 2018Publication date: June 20, 2019Applicant: ACER CLOUD TECHNOLOGY (US), INC.Inventors: Meng-Fu HSIEH, Jung-Hsuan FAN, Jim CHANG
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Publication number: 20190160947Abstract: An on-board charging device includes an AC connector, an AC to DC converter and a detection circuit. The AC connector is configured to be connected to an electric vehicle supply equipment (EVSE), so that a protective earth terminal of EVSE is electrically connected to a protective earth terminal of the on-board charging device. The AC to DC converter is electrically connected to the AC connector, and the AC to DC converter is configured to convert an AC voltage provided by the EVSE into a DC voltage. The AC to DC converter has a reference ground terminal. The detection circuit outputs a detection voltage based on the voltage difference between the protective earth terminal of the on-board charging device and the reference ground terminal of the AC to DC converter. The detection voltage reflects whether the protective earth terminal of the EVSE is abnormal or not.Type: ApplicationFiled: November 14, 2018Publication date: May 30, 2019Inventors: Sheng-Nan TSAI, Chia-Cheng YANG, Meng-Fu CHO
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Publication number: 20190131263Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: ApplicationFiled: December 19, 2018Publication date: May 2, 2019Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
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Patent number: 10255385Abstract: Model optimization approaches based on spectral sensitivity is described. For example, a method includes determining a first model of a structure. The first model is based on a first set of parameters. A set of spectral sensitivity variations data is determined for the structure. Spectral sensitivity is determined by derivatives of the spectra with respect to the first set of parameters. The first model of the structure is modified to provide a second model of the structure based on the set of spectral sensitivity variations data. The second model of the structure is based on a second set of parameters different from the first set of parameters. A simulated spectrum derived from the second model of the structure is then provided.Type: GrantFiled: February 28, 2013Date of Patent: April 9, 2019Assignee: KLA-TENCOR CORPORATIONInventors: Stilian Ivanov Pandev, Thaddeus Gerard Dziura, Meng-Fu Shih, Lie-Quan Lee
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Patent number: 10228194Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.Type: GrantFiled: May 25, 2017Date of Patent: March 12, 2019Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: Xiao-Yu Zhao, Chi-Yuan Lai, Meng Fu
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Patent number: 10182492Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.Type: GrantFiled: April 24, 2017Date of Patent: January 15, 2019Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: Xiao-Yu Zhao, Chi-Yuan Lai, Meng Fu
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Patent number: 10163836Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: GrantFiled: January 22, 2018Date of Patent: December 25, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
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Patent number: 10108237Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.Type: GrantFiled: May 15, 2017Date of Patent: October 23, 2018Assignee: CHAMP TECH OPTICAL (FOSHAN) CORPORATIONInventors: Meng Fu, Qiao-Long Chen, Wu-Fei Xu
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Publication number: 20180292872Abstract: A heat dissipating device includes a first copper plate, a second copper plate, a plurality of first heat pipes, a plurality of second heat pipes, and a heat dissipating component. Evaporating sections of the first heat pipes and the second heat pipes are clamped between and thermally connected to the first copper plate and the second copper plate. The second heat pipe, the evaporating section of the first heat pipes, the first copper plate, and the second copper plate are positioned at a bottom surface of the heat dissipating component. The second copper plate is thermally connected to the bottom surface of the heat dissipating component. Condensing sections of the first heat pipes is thermally connected to a top surface of heat dissipating component.Type: ApplicationFiled: May 15, 2017Publication date: October 11, 2018Inventors: MENG FU, QIAO-LONG CHEN, WU-FEI XU
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Publication number: 20180279463Abstract: An airtight structure includes a first plate having a first surface and a second surface opposite to the first surface, a second plate mounted on the second surface of the first plate, a wick structure mounted between the first plate and the second plate, a first fixed pin welded with the first plate and the second plate, and a second fixed pin welded with the first plate and the second plate. The second plate bonds to form a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity, a bottom surface of the cup portion forms a first through hole for receiving the first fixed pin therein. An outer periphery of the cup portion forms a second through hole. The second through hole is spaced apart from the first through hole.Type: ApplicationFiled: April 24, 2017Publication date: September 27, 2018Inventors: XIAO-YU ZHAO, CHI-YUAN LAI, MENG FU
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Publication number: 20180274866Abstract: An airtight structure includes a first plate, a second plate, a wick structure mounted between the first plate and the second plate. A middle portion of the second plate forms a cup portion. The cup portion and the first plate together define a cavity. The wick structure is received in the cavity. A portion of the first plate extends upwardly to form a first extending portion. The first extending portion is a hollow cylinder. A portion adjacent to an end of the second plate forms a through hole corresponding to the first extending portion. The first extending portion extends through the through hole, an inner surface of the through hole contacts the first extending portion.Type: ApplicationFiled: May 25, 2017Publication date: September 27, 2018Inventors: XIAO-YU ZHAO, CHI-YUAN LAI, MENG FU
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Patent number: 10014218Abstract: A method for forming a semiconductor device structure is provided. The method includes providing a semiconductor structure. The semiconductor structure has a central portion and a peripheral portion surrounding the central portion. The method includes forming first conductive bumps and dummy conductive bumps over a surface of the semiconductor structure. The first conductive bumps are over the central portion and electrically connected to the semiconductor structure. The dummy conductive bumps are over the peripheral portion and electrically insulated from the semiconductor structure. The first conductive bumps each have a first thickness and a first width. The dummy conductive bumps each have a second thickness and a second width. The second thickness is less than the first thickness. The second width is greater than the first width.Type: GrantFiled: April 20, 2017Date of Patent: July 3, 2018Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.Inventors: Meng-Fu Shih, Cheng-Lin Huang, Chien-Chen Li, Che-Jung Chu, Wen-Ming Chen, Kuo-Chio Liu
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Patent number: 10007752Abstract: The present disclosure relates to a curve-fitting procedure for determining proximity effect device parameters in semiconductor fabrication. Methods presented herein are adapted to determine the impact of narrow width related effects on device characteristics by comparing two-dimensional (2D) and/or three-dimensional (3D) device simulations. Methods presented herein are adapted to determine the accuracy of conventional extraction methods utilizing non-rectangular gate device simulation.Type: GrantFiled: July 20, 2015Date of Patent: June 26, 2018Assignees: Taiwan Semiconductor Manufacturing Co., Ltd, National Taiwan UniversityInventors: Kuen-Yu Tsai, Meng-Fu You, Yi-Chang Lu
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Publication number: 20180166409Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: ApplicationFiled: January 22, 2018Publication date: June 14, 2018Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku
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Patent number: 9875979Abstract: External electrical connectors and methods of forming such external electrical connectors are discussed. A method includes forming an external electrical connector structure on a substrate. The forming the external electrical connector structure includes plating a pillar on the substrate at a first agitation level affected at the substrate in a first solution. The method further includes plating solder on the external electrical connector structure at a second agitation level affected at the substrate in a second solution. The second agitation level affected at the substrate is greater than the first agitation level affected at the substrate. The plating the solder further forms a shell on a sidewall of the external electrical connector structure.Type: GrantFiled: November 16, 2015Date of Patent: January 23, 2018Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Meng-Fu Shih, Chun-Yen Lo, Cheng-Lin Huang, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu, Yung-Chiuan Cheng, Wei-Chih Huang, Chen-Hsun Liu, Chien-Pin Chan, Yu-Nu Hsu, Chi-Hung Lin, Te-Hsun Pang, Chin-Yu Ku