Abstract: A method includes retrieving a first component information of a secured portion of a package, wherein the first component information is encrypted. The step of retrieving includes decrypting the first component information. A thermal resistance-network (R-network) is generated from the decrypted first component information. A temperature map of the package is generated using the thermal R-network and a second component information of an unsecured portion of the package, wherein the secured portion and the unsecured portion are bonded to each other.

Abstract: An electronic apparatus and a method for processing an input signal are provided. In the present invention, a signal conversion module is provided, and the signal conversion module registers into an operating system. A raw data corresponding to an input signal is obtained from the operating system through the signal conversion module, when the input signal is received from a human interface device. And a reference value is obtained from a driver of the human interface device through the signal conversion module. The raw data is converted into a coordinate data according to the reference value through the signal conversion module, and the coordinate data is sent to an application program through the signal conversion module.

Abstract: A heat dissipation device includes a base and a plurality of fins. Two latch parts project from a top surface of the base, the two latch parts cooperatively define a recess therebetween. Each fin defines a tenon at a bottom portion. The tenon has a configuration in complement with that of the recess. The latch parts located between two neighboring fins is punched to make the fins fix on the base.

Abstract: Model optimization approaches based on spectral sensitivity is described. For example, a method includes determining a first model of a structure. The first model is based on a first set of parameters. A set of spectral sensitivity variations data is determined for the structure. Spectral sensitivity is determined by derivatives of the spectra with respect to the first set of parameters. The first model of the structure is modified to provide a second model of the structure based on the set of spectral sensitivity variations data. The second model of the structure is based on a second set of parameters different from the first set of parameters. A simulated spectrum derived from the second model of the structure is then provided.

Abstract: An exemplary method for manufacturing a heat sink includes steps: providing a base with a plurality of spaced protrusions formed thereon; providing a plurality of fins and bending a distal end of each fin to form a connecting end; fitting each fin between two adjacent protrusions correspondingly and attaching the connecting end of each fin to the base; and deforming each protrusion to press the connecting ends of two adjacent fins.

Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.

Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.

Abstract: A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat.

Abstract: A high-voltage battery charging system includes a rectifier circuit, a power factor correction circuit, a bus capacitor, an intermediate non-isolated DC-DC converting circuit, an intermediate output capacitor, and a non-isolated DC-DC converting circuit. The rectifier circuit is used for rectifying an AC input voltage into a rectified voltage. The power factor correction circuit is used for increasing a power factor of the rectified voltage and generating a bus voltage. The bus capacitor is used for energy storage and voltage stabilization. The intermediate non-isolated DC-DC converting circuit is used for boosting the bus voltage into an intermediate output voltage. The intermediate output capacitor is connected between an output terminal of the intermediate non-isolated DC-DC converting circuit and the common terminal COM for energy storage and voltage stabilization.

Abstract: An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a heat spreader and a fin set placed on the heat spreader. The heat spreader includes a base, a partition board hermetically placed on the base, and a covering plate hermetically placed on the partition board. A first chamber is defined between the base and the partition board, and a second chamber is defined between the partition board and the covering plate.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base, a first heat pipe and a second heat pipe. The first heat pipe includes a first evaporating section sandwiched between the first base and the second base, a first condensing section sandwiched between the second base and the fin set, and a first connecting section interconnecting the first evaporating section and the first condensing section. The second heat pipe includes a second evaporating section located adjacent to a bottom end of the fin set, a second condensing section located adjacent to a top end of the fin set, and a second connecting section interconnecting the second evaporating section and the second condensing section.

Abstract: An exemplary heat dissipation device is adapted for dissipating heat generated by an electronic component mounted on a printed circuit board. The heat dissipation device includes a first base, a second base placed on the first base, a fin set placed on the second base; and a heat pipe including an evaporating section sandwiched between the first base and the second base, a condensing section sandwiched between the second base and the fin set, and a connecting section interconnecting the evaporating section and the condensing section.

Abstract: The present invention relates to a method and an auxiliary device for precision positioning of welded type nozzles. The auxiliary device for precision positioning of welded type nozzles includes a plurality of alignment tips and an alignment bar. Each alignment tip is connected to a welding adapter and extends a distance. The alignment bar is combined with the alignment tips so that first positioning portions of the alignment tips are aligned with a plurality of second positioning portions of the alignment bar, and after the alignment bar is combined with the alignment tips, a correction distance between an end surface of the alignment bar and a center line of a main pipe header in a longitudinal direction is larger than a length of an assembled nozzle after a nozzle tip is combined with the corresponding welding adapter. In this way, the geometric positions of the nozzles can be accurately corrected.

Abstract: A heat dissipation device dissipates heat generated by a heat-generating electronic element mounted on a top surface printed circuit board. The printed circuit board defines a plurality of first through holes. The heat dissipation device comprises a heat spreader located at a top side of the printed circuit board. The heat spreader defines a plurality of second through holes corresponding to the first through holes, respectively. A first heat sink is located over the heat spreader, and a plurality of second heat sinks is located at a bottom side of the printed circuit board. A plurality of heat pipes extending through the second through holes of the heat spreader and the first through holes of the printed circuit board to thermally connect the first and second heat sinks to the heat spreader.

Abstract: An electronic apparatus and a method for processing an input signal are provided. In the present invention, a signal conversion module is provided, and the signal conversion module registers into an operating system. A raw data corresponding to an input signal is obtained from the operating system through the signal conversion module, when the input signal is received from a human interface device. And a reference value is obtained from a driver of the human interface device through the signal conversion module. The raw data is converted into a coordinate data according to the reference value through the signal conversion module, and the coordinate data is sent to an application program through the signal conversion module.

Abstract: Methods of determining asymmetric properties of structures are described. A method includes measuring, for a grating structure, a first signal and a second, different, signal obtained by optical scatterometry. A difference between the first signal and the second signal is then determined. An asymmetric structural parameter of the grating structure is determined based on a calculation using the first signal, the second signal, and the difference.

Abstract: An electronic device assembly includes an electronic device and a bracket holding the electronic device. The bracket includes a first supporting seat defined a first receiving groove therein and a second supporting seat defined a second receiving groove therein. The first supporting seat is disengagably attachable to the second supporting seat according to either of two selectable arrangements. In a first one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a first receiving chamber having a first width for holding the electronic device in a first orientation. In a second one of the arrangements, the first receiving groove and the second receiving groove cooperatively define a second receiving chamber having a second width for holding the electronic device in a second orientation.

Abstract: A consumer electronic product assembly includes a consumer electronic product and a bracket holding the consumer electronic product. The bracket includes a supporting seat, a holding member and a connecting bar. The holding member holds the consumer electronic product. Opposite ends of the connecting bar hinge on the holding member and the supporting seat, respectively. The connecting bar is rotatable with respect to the supporting seat, and the holding member is rotatable with respect to the connecting bar, whereby the consumer electronic product held by the holding member can be adjusted to various positions with respect to the supporting seat.

Abstract: A standard cell semiconductor integrated circuit device design provides a standard cell semiconductor device that includes first standard cells and user-defined target standard cells which consume more power or include other operational characteristics that differ from the operational characteristics of the first standard cells. The standard cells are routed to ground and power wires using one power rail and the target cells are routed to the ground and power lines using the first power rail and a second power rail to alleviate electromigration in either of the power rails. The two power rails include an upper power rail and a lower power rail. An intermediate conductive layer may be disposed between the upper and lower power rails to provide for signal routing by lateral interconnection between cells.