Patents by Inventor Michael J. Ellsworth, Jr.
Michael J. Ellsworth, Jr. has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20190266362Abstract: A method, computer program product, and image branding system brand an image on a product. The system includes an image controller to determine current values for application to one or more thermoelectric devices. The image controller also determines a current range within which to select the current values based on a material composition of the product. The system also includes an image branding device including the thermoelectric devices. Each of the thermoelectric devices have a corresponding contact surface representing a single pixel. The contact surface of each of the one or more thermoelectric devices is heated based on the respective current value applied.Type: ApplicationFiled: February 26, 2018Publication date: August 29, 2019Inventors: Andrew G. Crimmins, Pasquale A. Catalano, John S. Werner, Arkadiy O. Tsfasman, Michael J. Ellsworth, JR.
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Publication number: 20190259632Abstract: A fixture to facilitate fabrication of a heat sink includes a base plate to support a lower section of the heat sink, and multiple registration pins extending from the base plate. A platen is provided over a heat transfer element (HTE) of the heat sink, with the platen including slip fit regions to slip fit around respective registration pins, and with the lower section and HTE disposed between the base plate and the platen, and forming a fixture stack segment aligned with an active region of the cold plate. A load plate is provided which includes slip fit regions configured to slip fit around corresponding registration pins with the load plate disposed over the fixture stack segment. The load plate includes a single load pin centrally disposed to apply a load to the fixture stack segment and facilitate bonding the lower section and HTE together.Type: ApplicationFiled: February 20, 2018Publication date: August 22, 2019Inventors: Phillip D. ISAACS, Christopher M. MARROQUIN, Daren SIMMONS, Frank L. POMPEO, Jason R. EAGLE, Mark K. HOFFMEYER, Michael J. ELLSWORTH, JR., Prabjit SINGH, Steve OSTRANDER
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Patent number: 10385996Abstract: Tapering couplers and coupling methods for connecting fluid flow components are provided. In one embodiment, the tapering coupler includes a housing with a first opening and a second opening in fluid communication through the housing. The first opening is sized for a first fluid flow component to couple to the housing, and the second opening for a second fluid flow component. The first and second fluid flow components include first and second fluid-carrying channels of different diameter, with the first fluid-carrying channel having a first channel diameter that is larger than the second channel diameter of the second fluid-carrying channel. A tapering element is associated with the housing and extends into the first fluid-carrying channel. The tapering element includes a tapering fluid-carrying channel which tapers in a direction back towards the housing, for instance, from about the first channel diameter to about the second channel diameter.Type: GrantFiled: August 12, 2015Date of Patent: August 20, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Amilcar R. Arvelo, Michael J. Ellsworth, Jr., Eric J. McKeever
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Publication number: 20190157186Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.Type: ApplicationFiled: January 18, 2019Publication date: May 23, 2019Inventors: Levi A. CAMPBELL, Milnes P. DAVID, Dustin W. DEMETRIOU, Michael J. ELLSWORTH, JR., Roger R. SCHMIDT, Robert E. SIMONS
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Publication number: 20190128271Abstract: A pump is provided which includes a rotating element, and a volute housing having a fluid inlet and a fluid outlet. In operational state, the rotating element rotates, drawing fluid through the fluid inlet of the volute housing and expelling the fluid at a higher pressure through the fluid outlet. Further, the pump includes a bypass mechanism integrated, at least in part, within the volute housing and exposing in nonoperational state of the pump, a bypass path through, at least in part, the volute housing that allows the fluid to pass from the fluid inlet to the fluid outlet of the pump.Type: ApplicationFiled: November 2, 2017Publication date: May 2, 2019Inventors: Levi A. CAMPBELL, Francis R. KRUG, JR., Milnes DAVID, Dustin DEMETRIOU, Michael J. ELLSWORTH, JR., Brian WERNEKE
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Publication number: 20190130235Abstract: Embodiments of the invention include an apparatus, a computer-implemented method, and a computer program product for branding a quick response code onto a surface. Aspects of the invention include a branding device having a plurality of thermoelectric devices on a substrate. Each of the thermoelectric devices is arranged on the substrate as a single bit in a quick response pattern. Each of the thermoelectric devices includes an n-type thermoelectric element electrically coupled to a p-type thermoelectric element. The thermoelectric elements can be individually heated or cooled using the Peltier effect.Type: ApplicationFiled: November 2, 2017Publication date: May 2, 2019Inventors: Pasquale A. Catalano, Andrew G. Crimmins, Michael J. Ellsworth, JR., Arkadiy Tsfasman, John Werner
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Patent number: 10265812Abstract: Liquid-cooled heat sink assemblies are provided which include: a heat transfer element including a heat transfer base with opposite first and second sides and a plurality of thermally conductive fins extending from the first side, and with the second side of the heat transfer base to couple to a component(s) to be cooled. The heat sink assembly further includes a coolant-carrying structure attached to the heat transfer element. The coolant-carrying structure includes a coolant-carrying base, and a coolant-carrying compartment through which liquid coolant flows. The coolant-carrying base includes a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins to extend therethrough. The plurality of thermally conductive fins extend into the coolant-carrying compartment through which the liquid coolant flows. In one or more embodiments, the heat transfer element is a metal structure and the coolant-carrying structure is a plastic structure.Type: GrantFiled: August 12, 2015Date of Patent: April 23, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons, Prabjit Singh, Jason T. Wertz
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Patent number: 10249555Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.Type: GrantFiled: November 30, 2017Date of Patent: April 2, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons
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Patent number: 10244665Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.Type: GrantFiled: December 7, 2015Date of Patent: March 26, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Richard C. Chu, Milnes P. David, Michael J. Ellsworth, Jr., Madhusudan K. Iyengar, Roger R. Schmidt, Robert E. Simons
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Patent number: 10234061Abstract: Formed hose configurations are provided which include an innermost elastomer layer, a first fiber-reinforcement region, and multiple second fiber-reinforcement regions. The first fiber-reinforcement region has a first fiber-reinforcement density, and is disposed, at least in part, at a bend region of the formed hose, and the multiple second fiber-reinforcement regions have a second fiber-reinforcement density, and are disposed at least at the first and second end regions of the formed hose. The second fiber-reinforcement density is greater than the first fiber-reinforcement density, and results in the first and second ends of the formed hose being less radially-deformable than the bend region of the hose. This facilitates providing a mechanical fluid-tight connection with a hose barb fitting when the formed hose is slid over the hose barb fitting, absent any clamp over the formed hose and hose barb fitting connection.Type: GrantFiled: December 7, 2017Date of Patent: March 19, 2019Assignee: INTERNATION BUSINESS MACHINES CORPORATIONInventors: Michael J. Ellsworth, Jr., Prabjit Singh
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Patent number: 10169624Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.Type: GrantFiled: December 11, 2017Date of Patent: January 1, 2019Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr.
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Patent number: 10160072Abstract: A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.Type: GrantFiled: October 26, 2015Date of Patent: December 25, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Dylan J. Boday, Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons, Prabjit Singh, Jason T. Wertz
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Publication number: 20180368286Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.Type: ApplicationFiled: August 24, 2018Publication date: December 20, 2018Inventors: Amilcar R. ARVELO, Alan F. BENNER, Michael J. ELLSWORTH, JR., Eric J. McKEEVER
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Publication number: 20180368285Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.Type: ApplicationFiled: August 24, 2018Publication date: December 20, 2018Inventors: Amilcar R. ARVELO, Alan F. BENNER, Michael J. ELLSWORTH, JR., Eric J. McKEEVER
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Patent number: 10132433Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is recessed, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: January 25, 2018Date of Patent: November 20, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
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Patent number: 10111364Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.Type: GrantFiled: May 20, 2015Date of Patent: October 23, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Amilcar R. Arvelo, Alan F. Benner, Michael J. Ellsworth, Jr., Eric J. McKeever
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Patent number: 10107426Abstract: Conduit connectors for liquid manifolds and methods of fabrication are provided. In one embodiment, a conduit connector is integrated, at least in part, within a liquid manifold, and includes a conduit-receiving opening or socket and at least one releasable retention component. The conduit-receiving opening is disposed within the liquid manifold and in fluid communication with at least one liquid-carrying channel of the liquid manifold. The releasable retention component(s) is selectively operative to threadlessly secure in a fluid-tight manner a conduit within the conduit-receiving opening in fluid communication with the at least one liquid-carrying channel of the liquid manifold to facilitate flow of liquid through the liquid-carrying channel(s), or to release the conduit from the conduit-receiving opening of the conduit connector. The releasable retention component(s) resides at least partially within the liquid manifold when operatively holding the conduit within the conduit-receiving opening.Type: GrantFiled: August 12, 2015Date of Patent: October 23, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Thomas J. Brunschwiler, Evan G. Colgan, Michael J. Ellsworth, Jr., Gerd Schlottig
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Patent number: 10104810Abstract: Coupling assemblies for connecting fluid-carrying components are provided. The coupling assemblies include, for instance: a socket fitting with a first opening and a second opening in fluid communication through the fitting, the first opening being sized to accommodate a first fluid-carrying component, and the second opening being sized to accommodate a second fluid-carrying component; a sleeve, the sleeve encircling the socket fitting and being rotatable relative to the fitting, and the sleeve including a first locking feature; and a second locking feature associated with one of the fluid-carrying components. The second locking feature is positioned and sized to engage the first locking feature of the sleeve when the one fluid-carrying component is inserted into the socket fitting. Once engaged, rotating of the sleeve locks the first and second locking features together to secure the one fluid-carrying component to the socket fitting.Type: GrantFiled: September 7, 2015Date of Patent: October 16, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Amilcar R. Arvelo, Alan F. Benner, Michael J. Ellsworth, Jr., Eric J. McKeever
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Publication number: 20180295754Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.Type: ApplicationFiled: June 12, 2018Publication date: October 11, 2018Inventors: Levi A. CAMPBELL, Richard C. CHU, Milnes P. DAVID, Michael J. ELLSWORTH, JR., Madhusudan K. IYENGAR, Roger R. SCHMIDT, Robert E. SIMONS
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Patent number: 10070560Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).Type: GrantFiled: June 7, 2016Date of Patent: September 4, 2018Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATIONInventors: Levi A. Campbell, Milnes P. David, Dustin W. Demetriou, Michael J. Ellsworth, Jr., Roger R. Schmidt, Robert E. Simons