Abstract: A memory apparatus includes multiple memory circuits an interface circuit having one or more first components of a first type and one or more second components of a second type different from the first type, each of the one or more first components and second components being electrically couplable to a host system. The interface circuit is operable to present to the host system a simulated memory circuit where there is a difference in at least one aspect between the simulated memory circuit and at least one memory circuit of the plurality of memory circuits. The at least one aspect includes a timing that relates to a refresh operation latency, in which each memory circuit of the plurality of memory circuits is electrically coupled to at least one first component and to at least one second component.

Abstract: A memory apparatus includes multiple memory circuits and an interface circuit to present to a host system emulated memory circuits. The interface circuit includes a first component of a first type and a second component of a second type, the first component and the second component being operable to present a host-system interface to the host system and to present a memory-circuit interface to the plurality of memory circuits, in which there is a difference in at least one aspect between the host-system interface and the memory circuit interface. At least one of the first and second components is operable to identify one or more memory circuits that is not being accessed and to perform a power-saving operation on the one or more memory circuits identified as not being accessed, where the power-saving operation includes placing the memory circuits identified as not being accessed in a precharge power down mode.

Abstract: An apparatus includes multiple first memory circuits, each first memory circuit being associated with a first memory standard, where the first memory standard defines a first set of control signals that each first memory circuit circuits is operable to accept and defines a first version of a protocol. The apparatus also includes an interface circuit coupled to the first memory circuits, in which the interface circuit is operable to emulate at least one second memory circuit, each second memory circuit being associated with a second different memory standard. The second different memory standard defines a second set of control signals that the emulated second memory circuit is operable to accept and defines a second different version of a protocol. Both the first version of the protocol and the second different version of the protocol are associated either with DDR2 dynamic random access memory (DRAM) or with DDR3 DRAM.

Abstract: A memory subsystem is provided including an interface circuit adapted for coupling with a plurality of memory circuits and a system. The interface circuit is operable to interface the memory circuits and the system for emulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. Such aspect includes a signal, a capacity, a timing, and/or a logical interface.

Abstract: One embodiment of the present invention sets forth a heat spreader module for dissipating thermal heat generated by electronic components. The assembly comprises a printed circuit board (PCB), electronic components disposed on the PCB, a thermal interface material (TIM) thermally coupled to the electronic components, and a heat spreader plate thermally coupled to the TIM. The heat spreader plate includes an embossed pattern. Consequently, surface area available for heat conduction between the heat spreader plate and surrounding medium may be increased relative to the prior art designs.

Abstract: A system, method, and apparatus are included for providing additional space between an integrated circuit package and a circuit board. An integrated circuit package is provided including a plurality of integrated circuit package contacts. Also provided is a circuit board in electrical communication with the integrated circuit package. Further, the integrated circuit package, the integrated circuit contacts, and/or the circuit board is configured for providing additional space between the integrated circuit package and the circuit board to position at least a portion of at least one component between the integrated circuit package and the circuit board.

Abstract: A system and method are provided. The system and method simulate a DRAM memory circuit using an interface circuit connected to a plurality of other DRAM memory circuits. In response to the receipt of a refresh control signal, a first refresh control signal is sent to a first subset of the plurality of other DRAM memory circuits and a second refresh control signal is sent to a second subset of the plurality of other DRAM memory circuits.

Abstract: One embodiment of the present invention sets forth a memory module that includes at least one memory chip, and an intelligent chip coupled to the at least one memory chip and a memory controller, where the intelligent chip is configured to implement at least a part of a RAS feature. The disclosed architecture allows one or more RAS features to be implemented locally to the memory module using one or more intelligent register chips, one or more intelligent buffer chips, or some combination thereof. Such an approach not only increases the effectiveness of certain RAS features that were available in prior art systems, but also enables the implementation of certain RAS features that were not available in prior art systems.

Abstract: A memory subsystem is provided including an interface circuit adapted for communication with a system and a majority of address or control signals of a first number of memory circuits. The interface circuit includes emulation logic for emulating at least one memory circuit of a second number.

Abstract: A memory subsystem is provided including an interface circuit adapted for communication with a system and a majority of address or control signals of a first number of memory circuits. The interface circuit includes emulation logic for emulating at least one memory circuit of a second number.

Abstract: Systems, methods, and apparatus, including computer program products, for providing termination resistance in a memory module are provided. An apparatus is provided that includes a plurality of memory circuits; an interface circuit operable to communicate with the plurality of memory circuits and to communicate with a memory controller; and a transmission line electrically coupling the interface circuit to a memory controller, wherein the interface circuit is operable to terminate the transmission line with a single termination resistance that is selected based on a plurality of resistance-setting commands received from the memory controller.

Abstract: Embodiments of the present invention provide a method for handling errors in data servers. Generally, embodiments of the invention enable a data packet that is marked as erroneous to be handled so that it is not committed to permanent storage. One or more components are configured to recognize a poisoned data indicator, and to respond to the indicator by taking programmed actions to delete the data, to stop the data from being transmitted, to notify upstream components, and to purge related data from downstream components.

Abstract: A memory circuit power management system and method are provided. An interface circuit is in communication with a plurality of memory circuits and a system.

Abstract: A system and method are provided for delaying a signal communicated from a system to a plurality of memory circuits. Included is a component in communication with a plurality of memory circuits and a system. Such component is operable to receive a signal from the system and communicate the signal to at least one of the memory circuits after a delay. In other embodiments, the component is operable to receive a signal from at least one of the memory circuits and communicate the signal to the system after a delay.

Abstract: An apparatus and method are provided for communicating with a plurality of physical memory circuits. In use, at least one virtual memory circuit is simulated where at least one aspect (e.g. power-related aspect, etc.) of such virtual memory circuit(s) is different from at least one aspect of at least one of the physical memory circuits. Further, in various embodiments, such simulation may be carried out by a system (or component thereof), an interface circuit, etc.

Abstract: A memory circuit power management system and method are provided. An interface circuit is in communication with a plurality of memory circuits and a system. In use, the interface circuit is operable to perform a power management operation in association with only a portion of the memory circuits.

Abstract: A memory circuit power management system and method are provided. In use, an interface circuit is in communication with a plurality of memory circuits and a system. The interface circuit is operable to interface the memory circuits and the system for autonomously performing a power management operation in association with at least a portion of the memory circuits.

Abstract: A system and method are provided for delaying a signal communicated from a system to a plurality of memory circuits. Included is a component in communication with a plurality of memory circuits and a system. Such component is operable to receive a signal from the system and communicate the signal to at least one of the memory circuits after a delay. In other embodiments, the component is operable to receive a signal from at least one of the memory circuits and communicate the signal to the system after a delay.

Abstract: A system and method are provided for simulating an aspect of a memory circuit. Included is an interface circuit that is in communication with a plurality of memory circuits and a system. Such interface circuit is operable to interface the memory circuits and the system for simulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. In accordance with various embodiments, such aspect may include a signal, a capacity, a timing, and/or a logical interface.

Abstract: A system and method are provided for simulating an aspect of a memory circuit. Included is an interface circuit that is in communication with a plurality of memory circuits and a system. Such interface circuit is operable to interface the memory circuits and the system for simulating at least one memory circuit with at least one aspect that is different from at least one aspect of at least one of the plurality of memory circuits. In accordance with various embodiments, such aspect may include a signal, a capacity, a timing, and/or a logical interface.