Abstract: A method of brokering information in a manufacturing system which includes a broker coupled between a supplier of information and a consumer of information. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format.

Abstract: A method and apparatus is provided for fault notification based on a severity level. The method comprises detecting a fault associated with a processing tool that is adapted to process one or more workpieces, determining a fault severity level of the detected fault and selecting at least one user to notify of the fault based on the severity level of the fault.

Abstract: The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are processed by a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. The present invention provides the advantage that wafer lots and reticles can be matched to an event on the processing line and stored as data for later review and analysis.

Abstract: In one example, the method includes operating a process tool that has a plurality of sensors for sensing at least one parameter associated with the operation of the process tool, obtaining data from the sensors and determining at least one maintenance activity for the process tool based upon the data obtained from the sensors. In another example, data from the sensors is provided to a controller that analyzes the data and indicates desired variations in at least one maintenance activity to be performed on the process tool based upon the analysis of the data. In yet another example, the controller identifies a plurality of maintenance activities to be performed on the process tool based upon the analysis of the data.

Abstract: An automated material handling system is presented for a manufacturing facility divided into separate fabrication areas. The automated material handling system plans and carries out the movement of work pieces between fabrication areas and maintains a database indicating the location of each work piece within the manufacturing facility. In one embodiment, the automated material handling system accomplishes the containerless transfer of semiconductor wafers through a wall separating a first and second fabrication areas. The wafers are transported within containers (e.g., wafer boats). The material handling system includes a number of transfer tools, including air lock chambers, mass transfer systems, robotic arms, and stock areas. The material handling system also includes a control system which governs the operations of the transfer tools as well as the dispersal of containers.

Abstract: A method and apparatus is provided for routing workpieces based upon detecting a fault. The method comprises routing a workpiece to a first processing tool identified by a dispatch system, detecting a fault condition associated with the first processing tool and notifying the dispatch system of the detected fault condition. The method further comprises routing a second workpiece to a second processing tool in response to the dispatch system being notified of the fault condition.

Abstract: Management of multiple types of empty carriers in automated material handling systems. In one embodiment, an automated material handling system (AMHS) includes a plurality of material carriers including a plurality of empty carriers classified into two or more types and one or more stock areas, each including a plurality of bins for storing material carriers. Each stock area is associated with one or more thresholds for each empty carrier type. The AMHS further includes a control system coupled to a first one of the stock areas for computing an empty percentage for each empty carrier type. The empty percentage for a particular empty carrier type is the percentage of bins of the first one stock area which contain empty carriers of the particular type.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: A method and an apparatus for performing fault detection using real-time or near real-time data from a database. A first process on at least one semiconductor wafer is performed. Data is acquired on at least one of a real-time basis and a near real-time basis, the data comprising at least one of a process state data, a tool state data, and an integrated metrology data resulting from the first processing of semiconductor wafer. The data is stored in a database. A fault detection analysis is performed based upon the data acquired from the database based upon a trigger signal that causes data to be extracted from the database on a substantially real time basis.

Abstract: According to an example embodiment, the present invention is directed to a new and efficient method for bringing at least two items together from independent locations via separate paths in a computer controlled manufacturing environment. Using the computer, the probabilities for pickup and delivery of each of the two items are generated and used to determine an efficient manner in which to bring the items together via the separate paths.

Abstract: A method for controlling a processing tool having a plurality of chambers includes processing a wafer in a first chamber of the processing tool; measuring a characteristic of the wafer; and modifying an operating recipe of one of the plurality of chambers based on the measured characteristic. A system for processing semiconductor wafers includes a processing tool, a metrology tool, and a process controller. The processing tool includes a plurality of chambers. The metrology tool is adapted to measure a characteristic of a wafer processed in a first chamber of the processing tool. The process controller is adapted to modify an operating recipe of one of the plurality of chambers based on the measured characteristic.

Abstract: A reticle sorter and a semiconductor fabrication facility employing one or more reticle sorters is provided. The reticle sorter(s) generally lies between a reticle storage system and a group of one or more photolithography exposure tools (e.g., steppers) and is configured for sorting reticles in one or more cassettes. The use of the reticle sorter provides sorting functionality apart from the reticle storage system and typically closer to the group of photolithography steppers with which it is associated. This can, for example, significantly increase the throughput of semiconductor wafers through the associated photolithography exposure tools as well as in the semiconductor fabrication plant as a whole.

Abstract: The invention is, in its various aspects, a method and apparatus for dynamically generating trace data reports in a semiconductor fabrication process employing fault detection control. The method comprises specifying data including at least one of a parameter, a trigger, and a frequency, for a trace data report; automatically generating from a fault detection controller a request including the specified data to a report generator; formulating the trace data report responsive to the request; and returning the formulated trace data report from the report generator based on the request.

Abstract: A method and apparatus for determining a possible cause of a fault in a semiconductor fabrication process. The method includes determining a first fault in a first processing tool executing under first operating conditions and determining a second fault in a second processing tool executing under second operating conditions. The method further includes identifying a possible source of the second fault based on at least the first operating conditions of the first processing tool.

Abstract: The present invention is generally directed to method of dynamically enabling additional sensors based upon initial sensor data, and a system for accomplishing same. In one illustrative embodiment, the method comprises initiating a process operation in a process tool, determining if an abnormal process event has occurred in the process operation based upon data sensed by at least one control sensor, enabling at least one additional sensor to acquire additional data related to the process operation if an abnormal process event is determined to have occurred and obtaining data from the enabled additional sensor.

Abstract: Wafer processing cycle times are substantially reduced by predicting and correcting downstream processing location anomalies before a wafer lot is released to the next processing location on the processing line. In an example embodiment, a method of verifying downstream processing line readiness in a semiconductor processing facility having a material handling system includes presenting a wafer lot to a first application processing location. A signal is then sent to a second application processing location to verify readiness by simulating the second application processing on the wafer lot. The availability or operating status of the second processing location is then communicated to the material handling system, the material handling system communicating instructions to the first processing location on where to send the wafer lot after the processing simulation is complete. The readiness verification method is repeated until the wafer lot is completely processed.

Abstract: A method and apparatus is provided for operating a processing tool in a degraded mode upon detecting a fault and in accordance with one or more business rules. The method comprises detecting a fault associated with a processing tool capable of processing one or more workpieces and operating the processing tool in a degraded mode in response to detecting the fault.

Abstract: A method, apparatus, and system is provided for a proactive dispatch system to improve line balancing. At least one request for processing a semiconductor wafer is received. A line-balancing analysis based upon the request is performed. At least one semiconductor wafer based upon the line-balancing analysis is processed.

Abstract: A method and a system for managing the movement of material lots through a semiconductor fabrication facility. In an example embodiment of the method, the movement of the material lots is tracked and a business rules module is accessed that generates material movement directives as a function of event changes on the line and externally provided directives that change the material lot movement sequence. Material lots are then rearranged in the material handling system as a function of a carrier code and the directive indicating a change. The result is a fabrication process that is more responsive and flexible with respect to internal or external changing conditions.

Abstract: Tracking the movement of individual wafers in a semiconductor processing system is improved by using an apparatus to axially rotate a wafer and using both the rotation angle and the wafer's location in the processing system as tracking coordinates. In an example embodiment, the apparatus imparts angles of rotation on the wafers in different stages of wafer processing. The rotation angles of each wafer are collected as data along with the wafer's location in the process. The combined wafer location and angle of rotation data are used to map the path the wafer has traveled from the onset of processing. An important advantage to this apparatus is the increased control and improved yields that the apparatus brings to wafer processing.