Abstract: A system for identifying wafers contained in a wafer carrier includes a wafer sorter. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The wafer sorter is adapted to scan at least a portion of a wafer extending from the carrier and to identify at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier. A method for identifying wafers contained in a wafer carrier is provided. Each wafer includes a surface terminating in an edge and a plurality of sector identification codes disposed on the surface proximate the edge. The method includes scanning at least a portion of a wafer extending from the carrier and identifying at least one of the sector identification codes on the wafer independent of the orientation of the wafer in the wafer carrier.

Abstract: Management of move requests from a factory system to an automated handling system (AMHS) is provided. In one embodiment, a method and system is provided which includes receiving a move request from the factory system and selectively passing the move request to the AMHS based on a comparison of the move request with one or more conditions of the AMHS. The move request may be selectively passed to the AMHS by, for example, passing the move request to the AMHS without modification, changing a destination tool identified in the move request and/or delaying the move request, or canceling the move request. By selectively passing the move request based on conditions of the AMHS, move requests can more efficiently be managed and the throughput of the automated material handling system can be increased.

Abstract: The detection of a processing deviation in a cluster tool of a wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the cluster tool. In an example embodiment, a wafer is placed into a first chamber of the cluster tool and it is rotated to a certain angle of rotation. Each time the wafer moves within the cluster tool the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The wafer exits the cluster tool and is examined for structural or surface defects that indicate that there was a variation in the processing parameters. A wafer movement map is developed from the positional coordinates and the map is then used as an analysis tool to identify the processing location that caused defect to occur. An important advantage is the increased control and traceability that the tracking method brings to single wafer handling and processing.

Abstract: The present invention is generally directed to various methods for determining, tracking and/or controlling processing based upon wafer characteristics. In one embodiment, the method is directed to selecting a plurality of wafers from the group of wafers based upon the semiconductor device to be manufactured on the wafer and at least one characteristic of the wafers. In another embodiment, the method comprises identifying a source of wafers wherein the device metrology data lies outside of the preselected range based upon the wafer identification mark and the device metrology data. As yet another example, the method comprises determining at least one parameter of a process operation to be performed on a wafer in a processing tool based upon the determined wafer characteristics.

Abstract: A metbod for perforning a wafer-less qualification of a processing tool includes creating a wafer-less qualification model for the processing tool. Qualification data is generated from the processing tool iiiring a wafer-less qualification process. The qualification data is compared with the wafer-less qualification model. The processig tool is determined to be operating in a predefined state based on the comparison of the qualification data with the wafer-less qualification model.

Abstract: The detection of a processing deviation in a multiple stage wafer processing system is achieved by assigning individual wafers a set of positional coordinates each time the wafer moves within the wafer processing system. In an example embodiment, a wafer is placed into a first processing stage and it is rotated to a certain angle of rotation. As the wafer moves from one processing stage to another the wafer is given a different angle of rotation; both the rotation angle and the wafer location are then recorded as a set of positional coordinates. The processed wafer is examined for surface deviations arising from variations in the processing parameters. The positional coordinates are used to develop a wafer movement map that aids in identifying the processing stage location where the deviation in the processing parameters occurred. An important advantage is the increased processing deviation traceability that the method brings to wafer processing.

Abstract: The movement of individual wafers in a semiconductor facility is tracked via a set of coordinates that include rotational points of reference on the wafer that coincide with the wafer's location in the processing line. In an example embodiment, the method includes imparting angles of rotation on the wafers in different stages of the processing system. The different angles of rotation on each wafer are collected as data along with the wafer location in the processing system and the tool/equipment identification code. The combined angle of rotation and wafer location data is used to map the path the wafer has traveled from the onset of processing. An important advantage of the invention is the increased control and traceability that the invention brings to wafer processing.

Abstract: A method of brokering information in a manufacturing system comprising a broker coupled between a supplier of information and a consumer of information is set forth. The manufacturing system receives information from the supplier in a first format and sends information from the broker to the consumer in a second format. Additionally, a method of brokering fault detection and classification data in a manufacturing system which comprises providing a broker coupled between a supplier of fault detection and classification data and a consumer of fault detection and classification data is set forth. The manufacturing system receives fault detection and classification data from the supplier in a first format and sends fault detection and classification data from the broker to the consumer in a second format. Additionally, a manufacturing system which comprises a supplier of fault detection and classification data, a consumer of fault detection and classification data and a broker is set forth.

Abstract: The present invention provides for a method and an apparatus for using a latency time period as a control input parameter. A manufacturing run of semiconductor devices is processed. Metrology data from the processed semiconductor devices is acquired. A latency analysis process is performed using the acquired metrology data. A feedback/feed-forward modification process is performed in response to the latency analysis process.

Abstract: A method for monitoring consumable performance in a processing tool comprises storing a performance model of the processing tool; receiving a consumable item characteristic of a consumable item in the processing tool; determining a predicted processing rate for the processing tool based on the consumable item characteristic and the performance model; determining an actual processing rate of the processing tool; and determining a replacement interval for the consumable item based on at least the actual processing rate. A processing system includes a processing tool and an automatic process controller. The processing tool is adapted to process wafers and includes a consumable item.

Abstract: A method and apparatus for performing manufacturing system analysis upon a manufacturing network. Real-time production data is collected. The real-time production data is stored in a static file database. A real-time data flow is emulated using said real-time production data from said static file database. A reactive function analysis is performed.

Abstract: A computer system includes a first database, a second database, and a data handler. The data handler is adapted to receive a database request, issue a first request to the first database, and issue a second request to the second database. The first and second requests are based on the database request. The data handler is further adapted to receive a first response from the first database, receive a second response from the second database, and ignore one of the first and second responses. A method for increasing database availability includes receiving a database request; issuing a first request to a first database; issuing a second request to a second database, the first and second requests being based on the database request; receiving a first response from the first database; receiving a second response from the second database; and ignoring one of the first and second responses.

Abstract: Reticles are selected for use in a wafer processing system based on the wafer-processing recipe and on the level of degradation exhibited by the reticle after multiple exposures to light and constant physical handling. In an example embodiment of an integrated reticle sorter and stocker, a scanner identifies the reticle and gathers dimensional data on each reticle. A sorter sorts reticles within reticle pods according to the processing recipe and stores the pods within a storage location in the stocker. A computer arrangement then records information from the scanner and the sorter and assesses whether any of the reticles has degraded beyond an acceptable level of usage.

Abstract: Systems and methods for managing automated material handling systems, such as semiconductor fabrication facilities, using material item (e.g., wafer lot) attributes and cassette attributes are provided. A semiconductor fabrication facility typically includes multiple wafer lots and multiple cassettes for storing the wafer lots. A system and method, in one embodiment of the invention, includes setting one or more lot attributes for each wafer lot, setting one or more cassette attributes for each cassette, and selecting a particular cassette for holding a particular wafer lot based on the one or more wafer lot attributes of the particular wafer lot and the one or more cassette attributes of the particular cassette. The wafer lot and cassette attributes may, for example, include an attribute identifying a position in a fabrication sequence and one or more attributes indicative of one or more contaminants.

Abstract: A method for aligning wafers includes defining a grid on a wafer; determining a grid offset parameter based on an offset between the grid and an external reference point defined on the wafer; and aligning the wafer based on the grid offset parameter and the external reference point. A system for aligning wafers includes a database server and a tool. The database server is adapted to store a grid offset parameter associated with a wafer. The grid offset parameter defines an offset between a grid defined on the wafer and an external reference point defined on the wafer. The tool is adapted to align the wafer based on the grid offset parameter associated with the wafer and the external reference point.

Abstract: A system for verifying the integrity of components moving within a material handling system ensures that only components of acceptable integrity and condition are allowed to move onto the processing locations of a semiconductor plant. In an example embodiment, components that are warped or cracked are initially detected and scanned by a beam break system and/or an optical system. An integrity verification assessment is made immediately on the component to determine whether the scanned component meets with a predefined baseline parameter or characteristic. The components that do not pass integrity verification are then removed from the material handling system while the components that pass move on to the first processing location.

Abstract: Wafer processing time and handling is reduced by coupling a retrofitable processing tool between two standard processing tools. In an example embodiment, the retrofitable tool includes a metrology unit, which is coupled between two processing tools, that provides metrology capability without having to remove the wafers from the processing line. Once the metrology process is complete the wafers are transferred to the next processing tool and the retrofitable tool is decoupled from the two processing tools. An important advantage is the increased processing flexibility that the processing line reconfiguration method and the retrofitable tool bring to wafer processing.

Abstract: Techniques for controlling the flow of wafer lots in a semiconductor fabrication facility having multiple storage locations and a fabrication facility employing such techniques are provided. A process and system for controlling the flow of wafer lots within a semiconductor fabrication facility, in accordance with one embodiment of the invention, includes determining a first storage location for a wafer lot, determining, prior to moving the wafer lot, an availability condition of the first storage location based on a condition level of the first storage location and a priority of the wafer lot, and storing the wafer lot in the storage location if the location is available and storing the wafer lot in an alternate location if the storage location is unavailable. The storage location may, for example, be a stocker.

Abstract: A system and method for stocking and sorting reticles used in a semiconductor fabrication facility, the facility having a material handling system that presents a reticle to a photolithography process area. In an example embodiment of the reticle management system, a reticle storage system and a reticle sorting apparatus are coupled to a host system that is adapted to track and control the movement of reticles in the material handling system. The host system is capable of interfacing with a management input module that integrates management directives into the reticle flow plan in the manufacturing process. The result is a reticle management system that is flexible enough to manage a finite number of reticles and pods in minimizing the delivery time of a reticle to the desired location while responding to changing conditions external to the manufacturing process.

Abstract: An apparatus and a system for stocking and sorting wafers in a wafer processing system reduce cycle time in manufacturing and reduce excessive handling of delicate wafers. In an example embodiment, the apparatus includes in an enclosure having therein a scanner adapted to identify codes located on the wafer carriers that indicate the position of a wafer within the carrier. A sorting mechanism for sorting wafers and carriers within the enclosure is also included as well as a computer arrangement that communicates with the management system of the wafer processing system. One of the advantages of the present invention is the reduction in cycle time that is achieved by sorting wafers immediately on demand while at a stocking location.