Abstract: A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively.

Abstract: The physical movement of reticles and solder bump masks within a wafer processing plant are continually tracked and documented in a historical database for the useful life of the reticles or masks. In an example embodiment of the mask tracking method, the method includes moving the masks from one location to another in mask pods. In addition, a mask data set is generated for each mask composed of a mask identification code cross-referenced to a pod identification code and the mask data sets are then stored in a computer arrangement. The mask data sets are then updated in the computer arrangement to include a facility location identification code as each mask moves to a subsequent location during wafer processing. An important advantage is that wafer lots and reticles can now be matched to an event on the processing line and stored as data for later review and analysis.

Abstract: Methods and systems for managing test wafers an automated material handling system are provided. Test material is classified into a plurality of classes. A time profile for each class of test material for a time period is determined and the test material is placed into cassettes based on the determined time profile for each class. When a request to pick up a particular group of a test material class is received, a cassette is identifying for picking up the particular group based on the contents of the cassette.

Abstract: A method for pre-positioning routed material in a computer controlled manufacturing arrangement having alternate locations for predetermined ones of a plurality of manufacturing process steps and predetermined types of materials to be routed into alternate locations. The method includes establishing a distribution of events indicative of the alternate locations at which material is processed for a manufacturing process step with respect to the materials to be routed and documenting the distribution of events in a database with respect to the type of materials to be routed and the alternate locations in terms of routing times, therein establishing a historical routing time for the type of material to be routed. In addition, there is established the actual mix of materials to be routed to the alternate locations and their historical routing time and actual routing time for the type of routed material are compared.

Abstract: An apparatus for identification of work pieces and protection of equipment used to operate on the work pieces in a computer controlled manufacturing arrangement. The equipment to be protected includes at least one receptacle for holding a work piece, and the apparatus comprises a rail and an electronic sensor mounted to the rail. The rail is shaped to generally to surround a selected portion of the equipment and is arranged to be supported proximate the equipment to deflect objects from the equipment. The electronic sensor is mounted to the rail at a location to sense a work piece in the receptacle and arranged to be coupled to the computer.

Abstract: An automated material handling system is presented for a manufacturing facility divided into separate fabrication areas. The automated material handling system plans and carries out the movement of work pieces between fabrication areas and maintains a database indicating the location of each work piece within the manufacturing facility. In one embodiment, the automated material handling system accomplishes the containerless transfer of semiconductor wafers through a wall separating a first and second fabrication areas. The wafers are transported within containers (e.g., wafer boats). The material handling system includes a number of transfer tools, including air lock chambers, mass transfer systems, robotic arms, and stock areas. The material handling system also includes a control system which governs the operations of the transfer tools as well as the dispersal of containers.

Abstract: An apparatus and method are presented for identifying a semiconductor die within a group of semiconductor dice formed upon a surface of the same semiconductor wafer. During wafer fabrication, several parallel-resonant electronic structures are formed within each die area of the semiconductor wafer. The parallel-resonant structures are configured such that each semiconductor die responds differently to an alternating current (a.c.) electrical signal. During an identification operation, an a.c. electrical signal is coupled to the parallel-resonant structures of a selected semiconductor die. The unique response of the parallel-resonant structures of the selected semiconductor die to the a.c. electrical signal is used to determine the position of the selected semiconductor die relative to other semiconductor dice formed from the same semiconductor wafer. The apparatus includes a includes a variable frequency oscillator configured to produce an a.c. voltage Vout, a probe, and a resistor.

Abstract: A probabilistic dispatching method and arrangement for directing the movement of wafers in a manufacturing process. In a manufacturing process, some process steps may be performed by tools at alternate locations. Delivery of the material from one manufacturing process step to the next occurs via a rail for transporting the material and stockers for holding the material until the processing can commence. While awaiting processing, material may be moved from one stocker to a stocker at an alternate location and then removed for processing. A distribution of removal events is maintained for process steps having alternate locations, wherein a removal event refers to removal of material from a stocker for processing. When material is returned to a stocker for delivery to another stocker to await a subsequent processing step, the other stocker is identified as a function of the distribution of removal events for the subsequent processing step.

Abstract: A computer controlled manufacturing arrangement and method for selecting between multiple paths for transporting cassettes between processing locations. The manufacturing arrangement includes a plurality of stockers interconnected with tracks on which cassettes are carried on vehicles. A first and second stocker are interconnected by at least a first path and a second path formed by the tracks, and a cassette can be transported from the first to the second stocker via either of the two paths. A plurality of robotic arrangements are configured to transfer cassettes between the stockers and the vehicles. A data processing system is coupled to the robotic arrangements and configured and arranged to maintain an historical record of codes indicative of periods of time expended in transporting cassettes from the first stocker to the second stocker via the first path and second path, respectively.

Abstract: An apparatus and method are presented for non-contact manipulation of a semiconductor die during semiconductor device manufacturing. Multiple die manipulation circuits are formed within specific regions of die areas of a semiconductor wafer. The die manipulation circuits may be formed upon a frontside surface of the wafer or upon a backside surface of the wafer. Following separation of the semiconductor dice from the wafer, a die is positioned above a horizontal surface of a die manipulation apparatus. Each die manipulation circuit receives alternating current (a.c.) power via an alternating magnetic field and uses the a.c. power to produce a static magnetic field. The static magnetic field opposes static magnetic fields formed around one or more levitation coils of the horizontal surface, causing the die to be levitated above the horizontal surface. By varying the relative strengths of the magnetic fields created by the levitation coils, "waves" of magnetic flux may be formed.

Abstract: A reticle sorter and a semiconductor fabrication facility employing one or more reticle sorters is provided. The reticle sorter(s) generally lies between a reticle storage system and a group of one or more photolithography exposure tools (e.g., steppers) and is configured for sorting reticles in one or more cassettes. The use of the reticle sorter provides sorting functionality apart from the reticle storage system and typically closer to the group of photolithography steppers with which it is associated. This can, for example, significantly increase the throughput of semiconductor wafers through the associated photolithography exposure tools as well as in the semiconductor fabrication plant as a whole.

Abstract: An automated system is presented for containerless transfer of semiconductor wafers through a wall separating a first fabrication area and a second fabrication area. The system includes multiple containers for transporting the wafers, one or more air lock chambers, mass transfer systems, robotic arms, stock areas, and a control system. The containers (e.g., wafer boats) are dispersed between the first and second fabrication areas. A portion of the containers contain at least one semiconductor wafer, and the remainder of the containers are empty. The air lock chambers are positioned in sealed openings in the wall. The air lock chambers provide isolation between the first and second fabrication areas while permitting the transfer of semiconductor wafers between the fabrication areas. A mass transfer system is positioned within each air lock chamber and allows for containerless transfer of wafers through the air lock chamber. The stock areas provide storage areas for containers adjacent to each air lock chamber.

Abstract: An electrode reshaping process and apparatus is provided for use in a semiconductor etching device. A wafer is place between upper and lower electrodes of the semiconductor etching device. The apparatus and method selectively adjusts the shape of an upper electrode in the semiconductor etching device to compensate for non-uniformities inherent in the etching device. One or more motors attached to the upper electrode provide the electrode shaping forces in accordance with information provided by etch rate variation models stored in a host computer. With the shape of the upper electrode adjusted, the wafer can be etched more uniformally.

Abstract: A system and method for managing empty carriers in an automated material handling system. The system includes a plurality of material carriers, some of which are empty, and a plurality of stock areas which store the carriers while waiting for the contained material to be processed or after having been processed. The system also includes a transportation system for moving the carriers between the stock areas. The system also includes a control system which receives status information from the transportation system and stock areas and controls the movement of carriers, in particular empty carriers, within the system in order to avoid production inefficiencies due to time delays introduced by an empty carrier not being available at a stock area when needed. The control system accomplishes this by calculating status variables, such as the empty percentage of each stock area, the current move rate of carriers in the system, and the current empty move rate in the system.

Abstract: A scanning system for scanning bar codes attached to wafer cassettes received in a chamber of a wafer processing tool. The system includes a scanner positioned external to the chamber for reading the bar codes and generating signals indicative thereof. Light generated by the scanner passes through an opening in the chamber wall and reflects off one or more reflective or refractive members positioned internal to the chamber, to illuminate the bar code attached to a wafer cassette contained in the chamber. Light reflected from the bar code likewise is bent by the reflective or refractive members and passes through the wall opening where it is sensed by the scanner. The reflective or refractive members are positioned so that the scanner can read bar codes which are not within the line of sight of the scanner through the wall opening.

Abstract: A method for tracking products within a sequence of processes. The products are moved in carriers through the sequence and the products are initially arranged in groups. The products may be moved between different carriers during the sequence. The method includes the steps of: (a) assigning a first set of identification numbers to the products, a second set of identification numbers to the groups, and a third set of identification numbers to the carriers; and (b) tracking the movement of products through the sequence using the second set of identification numbers, tracking the movement of carriers using the third set of identification numbers, and synchronizing the movement of the products and the carriers.

Abstract: A method and apparatus is presented for transferring semiconductor wafers through a barrier between two separate fabrication areas without the transfer of a container (i.e., wafer boat) with the wafers. The method includes providing an air lock chamber configured within a wall separating a first fabrication area and a second fabrication area. A first door providing access to the air lock chamber from the first fabrication area is opened and a first wafer boat containing the wafers is placed into the air lock chamber. The wafers are removed from the first wafer boat and placed in the air lock chamber. The empty first wafer boat is then removed from the air lock chamber, and the first door is closed. A second door providing access to the air lock chamber from the second fabrication area is opened, and an empty second wafer boat is placed into the air lock chamber.

Abstract: The invention provides an apparatus for supporting a workpiece during the manufacturing process involving the workpiece and a process for manufacturing a workpiece using the apparatus. The apparatus includes a holding device for maintaining the workpiece in a predetermined orientation during performance of the manufacturing process. The holding device includes a plurality of members. The improvement comprises at least one member of the plurality of members including a plurality of indicators arranged in a predetermined order to establish an identifying code. Each indicator of the plurality of indicators absorbs a predetermined portion of incident light.

Abstract: The invention provides an improved apparatus for supporting a workpiece during the manufacturing process involving the workpiece. The apparatus includes a holding device for maintaining the workpiece in a predetermined orientation during performance of the manufacturing process. The holding device includes a plurality of members. The improvement comprises at least one member of the plurality of members including a plurality of indicators arranged in a predetermined order to establish an identifying code. Each indicator of the plurality of indicators absorbs a predetermined portion of incident light.

Abstract: A test fixture for a boat having a plurality of slots for holding wafers includes a base for fixedly holding a boat to be tested; a wafer simulator, which wafer simulator includes a plurality of wafers sized to properly seat in the plurality of slots in the boat; structure for moving the plurality of wafers of the wafer simulator wholly into and out of the plurality of slots in the boat; and structure determining whether the plurality of wafers is properly seated in the plurality of slots in the boat when the wafer simulator is moved wholly into the plurality of slots in the boat.