Abstract: An integrated circuit (IC) device includes a static random access memory (SRAM) array, and a resistive memory (resistive memory) array. A first set of programmable resistive elements in the resistive memory array are used to store data from memory cells in the SRAM array. Sense amplifier circuitry is couplable to the SRAM array and the resistive memory array. An arbiter is configured to assert an resistive memory enable signal to couple the sense amplifier circuitry to the resistive memory array and decouple the sense amplifier circuitry from the SRAM array during a resistive memory read operation, and to couple the sense amplifier to the SRAM array and decouple the sense amplifier circuitry from the resistive memory array during an SRAM read operation.

Abstract: A memory includes a first memory cell; and a second memory cell. A selectable current path is coupled between the first memory cell and the second memory cell. The selectable current path includes a first transistor. A first amplifier is coupled in a first feedback arrangement between the first memory cell and the first transistor. During a read operation of the first memory cell, a current through the first memory cell is substantially equal to a current through the second memory cell. The memory cell may include a magnetic tunnel junction (MTJ).

Abstract: A content addressable memory device includes a first memory cell having three programmable resistive elements coupled in parallel. The first terminals of the first, second, and third programmable resistive elements are coupled to a first node, the second terminal of the first programmable resistive element coupled to a first source line voltage, the second terminal of the second programmable resistive element coupled to a second source line voltage, and the second terminal of the third programmable resistive element coupled to a first supply voltage. A first access transistor includes a first current electrode coupled to a bit line; a second current electrode coupled to the first node, and a control electrode coupled to a word line. A match line transistor includes a first current electrode coupled to a match line; a second current electrode coupled to a second supply voltage and a control electrode coupled to the first node.

Abstract: A memory circuit includes a first bit line, a second bit line, and a memory cell that is coupled to first bit line and the second bit line. The memory cell includes a capacitor, a first pass gate transistor, a non-volatile (NV) element, and a second pass gate transistor. The first capacitor has a first terminal coupled to a first storage node and a second terminal coupled to a reference. The first pass gate transistor is coupled between the first bit line and the first storage node. The NV element and a second pass gate transistor are coupled in series, wherein the first NV element and the second pass gate transistor are coupled between the first storage node and the first program line.

Abstract: A memory system has a first plurality of non-volatile random access memory (NVRAM) cells. Each NVRAM cell has a volatile portion coupled to a corresponding non-volatile portion. A non-volatile indicator circuit provides information as to whether the first plurality of NVRAM cells has the most recent data written into NVRAM cells in the non-volatile portions.

Abstract: A content addressable memory device includes a first memory cell having three programmable resistive elements coupled in parallel. The first terminals of the first, second, and third programmable resistive elements are coupled to a first node, the second terminal of the first programmable resistive element coupled to a first source line voltage, the second terminal of the second programmable resistive element coupled to a second source line voltage, and the second terminal of the third programmable resistive element coupled to a first supply voltage. A first access transistor includes a first current electrode coupled to a bit line; a second current electrode coupled to the first node, and a control electrode coupled to a word line. A match line transistor includes a first current electrode coupled to a match line; a second current electrode coupled to a second supply voltage and a control electrode coupled to the first node.

Abstract: The present disclosure provides circuit and method embodiments for calibrating a signal of an integrated circuit. A programmable resistive element is coupled in series with a node of the integrated circuit, where at least part of the integrated circuit is formed in at least one front end of line (FEOL) device level. The programmable resistive element is formed in at least one back end of line (BEOL) wiring level, and the programmable resistive element is in a non-volatile resistive state that is variable across a plurality of non-volatile resistive states in response to a program signal applied to the programmable resistive element.

Abstract: A memory device includes a volatile memory cell and a non-volatile memory cell. The non-volatile memory cell includes a first resistive element having a first terminal and a second terminal and a second resistive element having a first terminal and a second terminal. The first terminal of the first resistive element is coupled to the first terminal of the second resistive element at a first node. The second terminal of the first resistive element is coupled to a first source line voltage. The second terminal of the second resistive element is coupled to a second source line voltage. A first transistor includes a first current electrode coupled to a first data storage node of the volatile memory cell, a second current electrode coupled to a supply voltage, and a control gate coupled to the first node.

Abstract: A memory device has an SRAM that stores a logic state. A first MTJ has two terminals. A second one of the terminals is coupled to a storing node. A first terminal of a second MTJ is coupled to the storing node. The first and second MTJs are programmed to a first resistance by flowing current from the first second terminals and to a second resistance by flowing current from the second to first terminal. A storing circuit is coupled to the storing node, the SRAM cell, and a non-volatile word line. The storing circuit couples the logic state of the SRAM cell to the storing node during a store mode. The logic state of the SRAM cell is stored in the first and second MTJs by applying a storing voltage between the first terminal of the first MTJ and the second terminal of the second MTJ of a first polarity then a second polarity.

Abstract: A memory circuit includes a first bit line, a second bit line, and a memory cell that is coupled to first bit line and the second bit line. The memory cell includes a capacitor, a first pass gate transistor, a non-volatile (NV) element, and a second pass gate transistor. The first capacitor has a first terminal coupled to a first storage node and a second terminal coupled to a reference. The first pass gate transistor is coupled between the first bit line and the first storage node. The NV element and a second pass gate transistor are coupled in series, wherein the first NV element and the second pass gate transistor are coupled between the first storage node and the first program line.

Abstract: A resistive non-volatile memory cell is programmed. A programming voltage is applied to a first terminal of the resistive non-volatile memory cell. Sensing, during the applying the programming voltage, determines if the resistive non-volatile memory cell has been programmed. Current is limited through the resistive non-volatile memory cell to a first magnitude. After a predetermined time, if the sensing has not detected that the resistive non-volatile memory cell has been programmed, the current through the resistive non-volatile memory cell is limited to a second magnitude greater than the first magnitude. The resistive non-volatile memory cell is also erased.

Abstract: A memory device includes a first memory cell having a first transistor, a second transistor, and a resistive storage element. During a read operation, sense current is conducted through the second transistor and the first transistor is used to sense feedback voltage at a first terminal of the resistive storage element. During a write operation, current is conducted through the first and second transistors.

Abstract: A memory has a word line, a bit line, a plurality of resistive non-volatile memory (RNVM) cells coupled to the word line, and a first source line and a second source line. A first RNVM cell of the plurality of RNVM cells includes a first RNVM element having a first terminal coupled to a common node and a second terminal coupled to the first source line. A second RNVM element has a first terminal coupled to the first RNVM element at the common node and a second terminal coupled to the second source line. The coupling transistor is coupled to the word line, the bit line, and the common node that couples the common node to the bit line during sensing. A sense amplifier is capacitively coupled to the bit line to read a logic state of the first RNVM cell during sensing.

Abstract: The present disclosure provides circuit and method embodiments for calibrating a signal of an integrated circuit. A programmable resistive element is coupled in series with a node of the integrated circuit, where at least part of the integrated circuit is formed in at least one front end of line (FEOL) device level. The programmable resistive element is formed in at least one back end of line (BEOL) wiring level, and the programmable resistive element is in a non-volatile resistive state that is variable across a plurality of non-volatile resistive states in response to a program signal applied to the programmable resistive element.

Abstract: A memory device has an SRAM that stores a logic state. A first MTJ has two terminals. A second one of the terminals is coupled to a storing node. A first terminal of a second MTJ is coupled to the storing node. The first and second MTJs are programmed to a first resistance by flowing current from the first second terminals and to a second resistance by flowing current from the second to first terminal. A storing circuit is coupled to the storing node, the SRAM cell, and a non-volatile word line. The storing circuit couples the logic state of the SRAM cell to the storing node during a store mode. The logic state of the SRAM cell is stored in the first and second MTJs by applying a storing voltage between the first terminal of the first MTJ and the second terminal of the second MTJ of a first polarity then a second polarity.

Abstract: The present disclosure provides embodiments for methods and memory devices. One embodiment of a memory device includes a first volatile memory cell having a first volatile access transistor with a current electrode coupled with a first volatile bit line; a first non-volatile memory cell having a first non-volatile access transistor with a current electrode coupled with a first non-volatile bit line; and a transfer circuit coupled between the first volatile bit line and the first non-volatile bit line. The transfer circuit is configured to: couple data latched from the first volatile bit line with the first non-volatile bit line during a store operation, and couple the first volatile bit line with the first non-volatile bit line during a restore operation.

Abstract: A resistive non-volatile memory cell is programmed. A programming voltage is applied to a first terminal of the resistive non-volatile memory cell. Sensing, during the applying the programming voltage, determines if the resistive non-volatile memory cell has been programmed. Current is limited through the resistive non-volatile memory cell to a first magnitude. After a predetermined time, if the sensing has not detected that the resistive non-volatile memory cell has been programmed, the current through the resistive non-volatile memory cell is limited to a second magnitude greater than the first magnitude. The resistive non-volatile memory cell is also erased.

Abstract: A memory device includes a volatile memory cell, a non-volatile memory cell, and a transfer system connected between the volatile memory cell and the non-volatile memory cell. The transfer circuit allows data transfer from the volatile memory cell to the non-volatile memory cell when the memory device is operating in a first mode, and from the non-volatile memory cell to the volatile memory cell when the memory device is operating in a second mode.

Abstract: A process and device structure is provided for increasing capacitance density of a capacitor structure. A sandwich capacitor is provided in which a bottom silicon-containing conductor plate is formed with holes or cavities, upon which an oxide layer and a top silicon-containing layer conductor is formed. The holes or cavities provide additional capacitive area, thereby increasing capacitance per footprint area of the capacitor structure. The holes can form, for example, a line structure or a waffle-like structure in the bottom conductor plate. Etching techniques used to form the holes in the bottom conductor plate can also result in side wall tapering of the holes, thereby increasing the surface area of the silicon-containing layer defined by the holes. In addition, depth of holes can be adjusted through timed etching to further adjust capacitive area.

Abstract: A method is provided for programming a multi-state flash memory having a plurality of memory cells. A first programming pulse is provided to the flash array; determining a threshold voltage distribution for the plurality of memory cells after providing the first programming pulse. The plurality of memory cells is categorized into at least two bins based on a threshold voltage of each memory cell of the plurality of memory cells. A first voltage is selected for a second programming pulse for programming a first bin of memory cells of the at least two bins, the first voltage based on both a threshold voltage of the first bin and a first target threshold voltage. A second voltage is selected for a third programming pulse for programming a second bin of memory cells of the at least two bins, the second voltage based on both the threshold voltage of the second bin and on a second target threshold voltage.