Patents by Inventor Michiaki Kobayashi

Michiaki Kobayashi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240149640
    Abstract: A vehicle air conditioning system includes a refrigerant circuit, a heat medium circuit, a vehicle-interior heat exchanger, a vehicle-exterior heat exchanger including a first heat exchanger and a second heat exchanger disposed in series with respect to a flow of air generated by an air blower, a switching unit, a detection unit for detecting a degree of frost formation, and a control device. The operation mode includes a defrosting mode in which the heat medium in the high-temperature medium circuit is supplied to a defrosting target to be selected as either the first or second heat exchanger by the operation of the switching unit. The control device selects, as the defrosting target, the first heat exchanger in preference to the second heat exchanger when determined that both the first and the second heat exchangers need to be defrosted.
    Type: Application
    Filed: March 29, 2022
    Publication date: May 9, 2024
    Applicant: MITSUBISHI HEAVY INDUSTRIES THERMAL SYSTEMS, LTD.
    Inventors: Hirotaka TANABE, Takayuki KOBAYASHI, Yasutaka AOKI, Tomoki HASE, Hideaki TATENOI, Masayuki SAKAI, Michiaki NAKANISHI
  • Patent number: 8532818
    Abstract: A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.
    Type: Grant
    Filed: February 25, 2010
    Date of Patent: September 10, 2013
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Tomohiro Ohashi, Tsutomu Nakamura, Hidenobu Tanimura, Michiaki Kobayashi
  • Publication number: 20130183121
    Abstract: In a vacuum processing apparatus having a plurality of vacuum processing chambers at least one of which are coupled to each of a plurality of vacuum transfer chambers which are behind an atmospheric transfer chamber and have vacuum transfer robots in their interior to transfer a wafer, taking out a plurality of wafers in a cassette and transferring successively to the plurality of the vacuum processing chambers, and thereafter returning to the cassette, the wafers are controlled to be transferred to all of the vacuum processing chambers coupled to the backmost vacuum transfer chamber and thereafter a next wafer is transferred to a vacuum processing chamber which becomes possible for the next wafer to be transferred in before they are possible to be transferred out from the vacuum processing chambers coupled to the backmost vacuum transfer chamber and arranged backmost.
    Type: Application
    Filed: March 1, 2012
    Publication date: July 18, 2013
    Inventors: Ryoichi Isomura, Susumu Tauchi, Hideaki Kondo, Michiaki Kobayashi
  • Patent number: 8048259
    Abstract: A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.
    Type: Grant
    Filed: August 30, 2006
    Date of Patent: November 1, 2011
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Michiaki Kobayashi, Tsutomu Nakamura, Takeo Uchino, Akitaka Makino, Masashi Nakagome
  • Publication number: 20110137454
    Abstract: A vacuum chamber includes: a vacuum vessel arranged at the backward side, where a wafer of a processing subject is processed inside an internal processing chamber; a transfer chamber arranged at the forward side, where said wafer is transferred at the inside thereof under atmospheric pressure; a cassette stage arranged at the forward of this transfer chamber, where a cassette storing said wafer is mounted; a lock chamber connected with said transfer chamber at the backward of said transfer chamber; a robot arranged inside said transfer chamber, where said wafer is transferred between said cassette and said lock chamber; and an aligning machine for making position of said wafer fit with the predetermined position, wherein the wafer is transferred to said lock chamber, after performing alignment of said wafer on said aligning machine, in the case where displacement amount of position of this wafer is larger than the predetermined value.
    Type: Application
    Filed: February 25, 2010
    Publication date: June 9, 2011
    Inventors: Tomohiro OHASHI, Tsutomu Nakamura, Hidenobu Tanimura, Michiaki Kobayashi
  • Publication number: 20100186672
    Abstract: A plasma processing apparatus composed of a processing chamber in a vacuum vessel to which a gas is fed to form a plasma, a sample stage in which a channel for a heat exchange medium is formed, beams for supporting the sample stage in the horizontal direction, a cylindrical space at atmospheric pressure formed below the channel in the sample stage, coupling paths for communicating the inner wall of the cylindrical space with the exterior of the vacuum vessel, a piping conduit for medium formed in the coupling path, a drive mechanism to drive pins for a wafer, and metal blocks covering junctions between the piping conduits for medium and the sample stage, whereby a gas at high temperature is supplied to between the metal blocks and is exhausted through the coupling path.
    Type: Application
    Filed: February 26, 2009
    Publication date: July 29, 2010
    Inventors: Koji Okuda, Tsutomu Nakamura, Michiaki Kobayashi, Masakazu Isozaki, Hidenobu Tanimura
  • Publication number: 20100163185
    Abstract: A vacuum processing apparatus which includes a vacuum vessel having a processing chamber provided therein into which a processing gas is supplied to form a plasma and which processes a wafer located in the processing chamber, and a vacuum transfer vessel having a vacuumed transfer chamber coupled with the vacuum vessel provided therein into which the wafer is transferred. A resin-made film having a plasma resistance is bonded onto a surface of a lid of the vacuum transfer vessel on the side of the transfer chamber.
    Type: Application
    Filed: February 26, 2009
    Publication date: July 1, 2010
    Inventors: Michiaki Kobayashi, Tsutomu Nakamura, Koji Okuda, Masakazu Isozaki
  • Publication number: 20090078372
    Abstract: A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container.
    Type: Application
    Filed: November 24, 2008
    Publication date: March 26, 2009
    Inventors: Takeo UCHINO, Tsutomu Nakamura, Michiaki Kobayashi
  • Publication number: 20080066859
    Abstract: A vacuum pump exhausts gas within the processing chamber from a lower portion of a sample so as to reduce pressure within a processing chamber. The vacuum pump includes a rotary vane and a fixed vane which are arranged within a case of the vacuum pump and have a plurality of impeller blades in a coaxial manner; an exhausting port for exhausting the gas exhausted from the rotary vane outside the case; and a conducting port arranged along a lower direction of the rotary vane, into which inert gas is conducted, which are provided on a circumference thereof. An MFC (flow rate adjusting device) is arranged between a gas storage unit of the inert gas and the conducting port, for adjusting an amount of the inert gas.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 20, 2008
    Inventors: Michiaki Kobayashi, Tsutomu Nakamura, Akitaka Makino
  • Publication number: 20070068626
    Abstract: A plasma processing apparatus which contributes to reducing required time for maintenance and thereby to enhancing the efficiency of processing and that of apparatus operation is to be provided. A vacuum processing apparatus comprises a vacuum vessel in which a substrate-shaped sample is arranged in an internally arranged processing chamber in which the pressure is reduced; a transfer chamber to which the vacuum vessel is linked and through whose inside reduced in pressure the sample is transferred; a passage which establishes communication between the transfer chamber and the vacuum vessel in a state in which the transfer chamber and the processing chamber are linked to each other and through whose inside the sample not yet processed or already processed is transferred; and a covering member which is removably coupled to cover the internal wall face of the passage, wherein the sample is processed within the processing chamber with a plasma formed in the processing chamber.
    Type: Application
    Filed: August 30, 2006
    Publication date: March 29, 2007
    Inventors: Michiaki Kobayashi, Tsutomu Nakamura, Takeo Uchino, Akitaka Makino, Masashi Nakagome
  • Publication number: 20070068628
    Abstract: A vacuum processing apparatus having an improved wafer processing efficiency and an improved working efficiency is provided. The vacuum processing apparatus includes a vacuum container in which a specimen is processed with plasma generated from a processing gas supplied to the vacuum container; a transfer container through which the specimen processed in the vacuum container is transferred, the transfer container being coupled to the vacuum container under ambient pressure; a blower for generating an ambient gas flow in the transfer container and an outlet disposed on the transfer container; a storage container for storing the specimen processed in the vacuum container, the storage container being disposed in the ambient gas flow in the transfer container; and an exhauster for exhausting a gas in the storage container.
    Type: Application
    Filed: February 28, 2006
    Publication date: March 29, 2007
    Inventors: Takeo Uchino, Tsutomu Nakamura, Michiaki Kobayashi
  • Patent number: 4745953
    Abstract: The invention discloses a device for measuring the concentration of alcohol contained in the dampening water used in printing. Part of the dampening water pumped up from a dampening water tank (1) and delivered to a water fountain (3) is sampled through a bypass passage and the dampening water is returned to the dampening water tank (1) after the measurement of the concentration of the sampled dampening water. A measuring unit (8) for detecting the concentration of alcohol has a shielding plate (13) disposed adjacent to the dampening water inlet so that the disturbance of the surface of the dampening water introduced into the measuring unit is prevented. The dampening water discharge outlet consists of a pipe whose upper end is in coplanar relationship with a predetermined surface level of the aqueous solution in the measuring unit so that the excessive dampening water overflows into the pipe (10) to return to the dampening water tank.
    Type: Grant
    Filed: November 25, 1986
    Date of Patent: May 24, 1988
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Michiaki Kobayashi, Daiji Suzuki, Kenji Yamada
  • Patent number: 4733360
    Abstract: A card-like article inspection device has an inclined table for placing articles thereon in an upright and aligned state, a camera for detecting the foremost article, and an article feed frame for transferring the article having been inspected along one side of the table in its upright posture. The articles having been inspected are pushed separately into two placing portions of the table. Thus, the articles can be classified into a group of non-defective articles or into a group of defective articles.
    Type: Grant
    Filed: June 11, 1985
    Date of Patent: March 22, 1988
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Michiaki Kobayashi, Shigeo Hachiki, Makoto Shibasaki, Satoshi Sasaki
  • Patent number: 4703691
    Abstract: An ink fountain has at least one position display means for displaying the position of each ductor blade piece to be preset before printing and at least one position indicating means for indicating an actual position of the blade piece. A gap between the distal end of the blade piece and the surface of an ink fountain roller is adjusted in such a manner that the actual position of the blade piece is registered with the position, to be preset, of the blade piece by operating an adjusting member.
    Type: Grant
    Filed: May 5, 1986
    Date of Patent: November 3, 1987
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hideo Takeuchi, Michiaki Kobayashi, Makoto Shibasaki
  • Patent number: 4694749
    Abstract: An operation of presetting plate cylinder for automatic registration is carried out in a manner that rotational phase, lateral and twist errors of each plate cylinder are corrected by conventional means and then delamination errors are corrected on the basis of values calculated by using functional expressions concerning statistics. In order to carry out the operation, an apparatus for presetting plate cylinders has register error correcting means, control means for operating the delamination errors and a delamination error correcting means.
    Type: Grant
    Filed: November 1, 1985
    Date of Patent: September 22, 1987
    Assignees: Dai Nippon Insatsu Kabushiki Kaisha, Mitsubishi Jukogyo Kabushiki Kaisha
    Inventors: Hideo Takeuchi, Michiaki Kobayashi, Osamu Yoritsune, Takemasa Matsumoto
  • Patent number: 4607571
    Abstract: An ink fountain has at least one position display means for displaying the position of each ductor blade piece to be preset before printing and at least one position indicating means for indicating an actual position of the blade piece. A gap between the distal end of the blade piece and the surface of an ink fountain roller is adjusted in such a manner that the actual position of the blade piece is registered with the position, to be preset, of the blade piece by operating an adjusting member.
    Type: Grant
    Filed: December 16, 1983
    Date of Patent: August 26, 1986
    Assignee: Dai Nippon Insatsu Kabushiki Kaisha
    Inventors: Hideo Takeuchi, Michiaki Kobayashi, Makoto Shibasaki
  • Patent number: D864885
    Type: Grant
    Filed: February 27, 2018
    Date of Patent: October 29, 2019
    Assignee: Hitachi High-Technologies Corporation
    Inventors: Michiaki Kobayashi, Kazuyuki Hirozane, Akio Harada, Nobuhide Nunomura, Yutaka Kouzuma
  • Patent number: D900760
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 3, 2020
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yutaka Kouzuma, Michiaki Kobayashi, Kazuyuki Hirozane, Kohei Kawamura, Nobuya Miyoshi, Hiroyuki Kobayashi
  • Patent number: D901407
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: November 10, 2020
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yutaka Kouzuma, Michiaki Kobayashi, Kazuyuki Hirozane, Nobuya Miyoshi, Kohei Kawamura, Hiroyuki Kobayashi
  • Patent number: D924824
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: July 13, 2021
    Assignee: Hitachi High-Tech Corporation
    Inventors: Yutaka Kouzuma, Kazuyuki Hirozane, Michiaki Kobayashi, Yoshifumi Ogawa