Abstract: A method of fabricating a liquid-cooled heat sink assembly, including: providing a heat transfer element including a heat transfer base having opposite first and second sides, and a plurality of thermally conductive fins extending from the first side of the heat transfer base, the second side of the heat transfer base to couple to a component(s) to be cooled; providing a coolant-carrying structure including a coolant-carrying base and a coolant-carrying compartment through which liquid coolant flows, the coolant-carrying base including a plurality of fin-receiving openings sized and positioned for the plurality of thermally conductive fins of the heat sink base to extend through; and attaching the heat transfer element and coolant-carrying structure together with the plurality of thermally conductive fins extending through the fin-receiving openings in the coolant-carrying base into the coolant-carrying compartment.

Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

Abstract: Embodiments provide a method to control a power-on phase of an electronic device is provided. The method includes transmitting, by a processing device, a request to a plurality of sensors, the request to read a measurement related to an environmental condition; receiving, by the processing device, the measurement from each of the plurality of sensors; and when the measurement is equal to or above a threshold value, commencing, by the processing device, the power-on phase of the electronic device.

Abstract: Embodiments provide a method to control a power-on phase of an electronic device is provided. The method includes transmitting, by a processing device, a request to a plurality of sensors, the request to read a measurement related to an environmental condition; receiving, by the processing device, the measurement from each of the plurality of sensors; and when the measurement is equal to or above a threshold value, commencing, by the processing device, the power-on phase of the electronic device.

Abstract: Energy efficient control of cooling system cooling of an electronic system is provided based, in part, on weighted cooling effectiveness of the components. The control includes automatically determining speed control settings for multiple adjustable cooling components of the cooling system. The automatically determining is based, at least in part, on weighted cooling effectiveness of the components of the cooling system, and the determining operates to limit power consumption of at least the cooling system, while ensuring that a target temperature associated with at least one of the cooling system or the electronic system is within a desired range by provisioning, based on the weighted cooling effectiveness, a desired target temperature change among the multiple adjustable cooling components of the cooling system. The provisioning includes provisioning applied power to the multiple adjustable cooling components via, at least in part, the determined control settings.

Abstract: Systems and methods are provided for data center cooling by vaporizing fuel using data center waste heat. The systems include, for instance, an electricity-generating assembly, a liquid fuel storage, and a heat transfer system. The electricity-generating assembly generates electricity from a fuel vapor for supply to the data center. The liquid fuel storage is coupled to supply the fuel vapor, and the heat transfer system is associated with the data center and the liquid fuel storage. In an operational mode, the heat transfer system transfers the data center waste heat to the liquid fuel storage to facilitate vaporization of liquid fuel to produce the fuel vapor for supply to the electricity-generating assembly. The system may be implemented with the liquid fuel storage and heat transfer system being the primary fuel vapor source, or a back-up fuel vapor source.

Abstract: Cooling apparatuses and methods of fabrication are provided which facilitate immersion-cooling of an electronic component(s). The cooling apparatus includes a drawer-level enclosure sized to reside within an electronics rack. The drawer-level enclosure includes a compartment which accommodates one or more electronic components to be cooled. A dielectric fluid is disposed within the compartment. The dielectric fluid includes a liquid dielectric which at least partially immerses the electronic component(s) within the compartment(s). A hinged, liquid-cooled heat sink is also disposed within the compartment of the enclosure. The heat sink operatively facilitates cooling the one or more electronic components via the dielectric fluid within the compartment, and is rotatable between an operational position overlying the electronic component(s), and a service position which allows access to the electronic component(s).

Abstract: Embodiments provide a method to control a power-on phase of an electronic device is provided. The method includes transmitting, by a processing device, a request to a plurality of sensors, the request to read a measurement related to an environmental condition; receiving, by the processing device, the measurement from each of the plurality of sensors; and when the measurement is equal to or above a threshold value, commencing, by the processing device, the power-on phase of the electronic device.

Abstract: Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.

Abstract: Apparatuses and methods are provided for facilitating air-cooling of, for instance, one or more electronics racks within a data center. The apparatus includes an air-moving assembly and one or more flywheels. The air-moving assembly includes a shaft, one or more mechanical fans coupled to the shaft to rotate, at least in part, with the shaft, and a motor coupled to the shaft to rotatably drive the shaft. The flywheel(s) is sized and coupled to the shaft of the air-moving assembly to store rotational energy, and to facilitate, for a specified period of time, continued rotation of the shaft during interruption in power to the motor. In one implementation, the flywheel(s) is sized and coupled to the shaft to facilitate, for the specified time period, continued rotation of the shaft at a specified percentage, or greater, rotational speed of the shaft compared with shaft speed when rotatably driven by the motor.

Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.

Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Abstract: Apparatuses and methods are provided for blocking removal of an air-moving assembly from a housing when in operational state. The apparatus includes a protective louver assembly having a louver(s) and an interlock element(s). The louver(s) is disposed at an air inlet or an air outlet of the air-moving assembly, and pivots between an operational and a quiesced orientation, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The interlock element(s) is associated with the louver(s) to pivot with the louver(s) between the operational orientation and the quiesced orientation. In the operational orientation, the interlock element(s) blocks, at least in part, access to at least one fastener securing the air-moving assembly within the housing, and thereby prevents removal of the air-moving assembly from the chassis when in the operational state.

Abstract: Composite heat sink structures and methods of fabrication are provided, with the composite heat sink structures including: a thermally conductive base having a main heat transfer surface to couple to, for instance, at least one electronic component to be cooled; a compressible, continuous sealing member; and a sealing member retainer compressing the compressible, continuous sealing member against the thermally conductive base; and an in situ molded member. The in situ molded member is molded over and affixed to the thermally conductive base, and is molded over and secures in place the sealing member retainer. A coolant-carrying compartment resides between the thermally conductive base and the in situ molded member, and a coolant inlet and outlet are provided in fluid communication with the coolant-carrying compartment to facilitate liquid coolant flow through the compartment.

Abstract: A method of providing a cooling apparatus for cooling a heat-dissipating component(s) of an electronics enclosure includes: providing a thermal conductor to couple to the heat-dissipating component(s), the thermal conductor including a first conductor portion coupled to the heat-dissipating component, and a second conductor portion to position along an air inlet side of the electronics enclosure, so that in operation, the first conductor portion transfers heat from the component(s) to the second conductor portion; coupling at least one air-cooled heat sink to the second conductor portion to facilitate transfer of heat to airflow ingressing into the enclosure; providing at least one thermoelectric device coupled to the first or second conductor portion to facilitate providing active auxiliary cooling to the thermal conductor; and providing a controller to control operation of the thermoelectric device(s) and to selectively switch operation of the cooling apparatus between active and passive cooling modes.

Abstract: Tamper-proof electronic packages and fabrication methods are provided including an enclosure enclosing, at least in part, at least one electronic component within a secure volume, a two-phase dielectric fluid within the secure volume, and a tamper-respondent detector. The tamper-respondent detector monitors, at least in part, temperature and pressure of the two-phase dielectric fluid. In operation, the two-phase dielectric fluid deviates from an established saturation line of the two-phase dielectric fluid within the secure volume with an intrusion event into the secure volume, and the tamper-respondent detector detects, from the monitoring of the temperature and pressure of the two-phase dielectric fluid, the deviation from the established saturation line, and thereby occurrence of the intrusion event.

Abstract: Apparatuses and methods are provided for locking an air-moving assembly within a chassis when in operational state. The apparatus includes a locking louver assembly having a louver(s) and locking mechanism. The louver(s) is disposed at an air inlet or outlet of the air-moving assembly, and pivots between operational and quiesced orientations, dependent on presence or absence, respectively, of airflow through the air-moving assembly. The locking mechanism includes a keying element(s) affixed to the louver(s) to pivot therewith, which includes an elongated key(s) oriented in a first direction when the louver(s) is in operational orientation, and a second direction when in quiesced orientation. A key-receiving element(s) is associated with the chassis and includes a key opening(s) which receives and accommodates movement of the elongated key(s) between the first and second directions, and prevents removal of the air-moving assembly from the chassis with the key(s) oriented in the first direction.

Abstract: Disclosed herein is a packaging label. The label includes a first region comprising a first thermochromic ink where the first thermochromic ink undergoes a permanent change from a first state to a second state when exposed to a first temperature. The label includes a second region having a second thermochromic ink where the second thermochromic ink undergoes a temporary change from the first state to the second state when exposed to the first temperature only to return to the first state upon being exposed to a desired second temperature.

Abstract: Embodiments provide a method to control a power-on phase of an electronic device is provided. The method includes transmitting, by a processing device, a request to a plurality of sensors, the request to read a measurement related to an environmental condition; receiving, by the processing device, the measurement from each of the plurality of sensors; and when the measurement is equal to or above a threshold value, commencing, by the processing device, the power-on phase of the electronic device.

Abstract: Energy efficient control of a cooling system cooling an electronic system is provided. The control includes automatically determining at least one adjusted control setting for at least one adjustable cooling component of a cooling system cooling the electronic system. The automatically determining is based, at least in part, on power being consumed by the cooling system and temperature of a heat sink to which heat extracted by the cooling system is rejected. The automatically determining operates to reduce power consumption of the cooling system and/or the electronic system while ensuring that at least one targeted temperature associated with the cooling system or the electronic system is within a desired range. The automatically determining may be based, at least in part, on one or more experimentally obtained models relating the targeted temperature and power consumption of the one or more adjustable cooling components of the cooling system.