Abstract: A light source device having a good heat dissipation capability is disclosed, in which heat generated by a light emitting device is conducted to a base fabricated by a porous material through a heat conducting mask or a heat conducting pipe. Due to a large area contact between the heat conducting mask or the heat conducting pipe and the base, the heat can be evenly conducted to the base, so that the base can absorb the heat and dissipate the heat to external, so as to improve a heat dissipation efficiency. Moreover, in the light source device of the disclosure, heat exchange of the light emitting device can be directly carried on through air convection, so that the heat generated by the light emitting device can be taken away from the light source device through heat exchange of cool air.

Abstract: A light emitting diode (LED) lamp including a socket, an LED module disposed on the socket, and a lamp housing assembled to the socket is provided. LED module includes a supporting member and a plurality of LED packages, wherein each LED package includes a chip carrier, a reflective member, an LED chip, a lens, and a phosphor layer. Reflective member mounted on the chip carrier has a recess for exposing parts of the chip carrier. LED chip disposed in the recess. Lens encapsulating the LED chip has a light-emitting surface, a first reflection surface bonded with the reflective member and a second reflection surface, wherein the LED chip faces the light-emitting surface of the lens.

Abstract: A light emitting diode (LED) package comprising a carrier, an LED chip, a lens, and a phosphor layer is provided. The LED chip disposed on the carrier. The lens encapsulating the LED chip has a plurality of fins surrounding the LED chip and a conical indentation. The fins extending backward the LED chip radially. Each of the fins has at least one light-emitting surface and at least one reflection surface adjoining the light-emitting surface. A bottom surface of the conical indentation is served as an total reflection surface. The phosphor layer is disposed on the light-emitting surfaces of the lens. An LED package and an LED module are also provided.

Abstract: A multi-facet light emitting lamp including a first light source plate, a second light source plate, and a plurality of airflow channels is provided. The first light source plate has at least one first connecting terminal. The second light source plate has at least one second connecting terminal. The first connecting terminal is connected with the second connecting terminal, and an inner space is formed between the first light source plate and the second light source plate. The inner space and a space outside the multi-facet light emitting lamp are connected by the airflow channels.

Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

Abstract: A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof; and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip. Alternatively, an AC LED system in single chip with four metal contacts is also disclosed.

Abstract: An optical system includes a light source array, a dichroic mirror set, a light converting device and a light guide pipe. The light source array is used for emitting a first homogeneous light. The dichroic mirror set is disposed in a light path of the first homogeneous light and used for reflecting a part of the first homogeneous light to the light guide pipe, transmitting the remaining part of the first homogeneous light to the converting device. The light converting device is disposed in the transmitting light path of the dichroic mirror and used for transferring the first homogeneous light into a second, third homogeneous light. The dichroic mirror is further used for reflecting the second, third homogeneous light to the light guide pipe. The light guide pipe is used for mixing the first, second and third homogeneous light to obtain a white light.

Abstract: The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Abstract: An apparatus and a method for measuring a diode chip are provided. The diode chip is placed on a thermal conductive element. The apparatus measures an instant starting current and a first temperature, which is associated with the instant starting current, of the thermal conductive element. After the diode chip operates, the apparatus adjusts the temperature of the thermal conductive element to a second temperature, such that the current of the diode chip is adjusted to be equal to the instant starting current. The apparatus calculates a property of the diode chip according to a real power of the diode chip and a difference between the first temperature and the second temperature.

Abstract: A plurality of AC_LED units are coupled and disposed on a single chip to form an AC_LED system in single chip with three metal contacts to be driven by three-phase voltage sources. Alternatively, an AC_LED system in single chip with four metal contacts is also disclosed to be driven by four-phase voltage sources.

Abstract: A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.

Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

Abstract: A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.

Abstract: An electronic apparatus includes a first body comprising a first display area for displaying a first display image, a first sensor disposed in the first body for detecting a first curvature of the first body, and a control module disposed in the first body and electrically connected to the first sensor. When the first body is curved, the first sensor is used to generate a first sensing signal according to the first curvature, and the control module is used to execute a first function according to the first sensing signal.

Abstract: A projection optical system includes a digital micro-mirror device and a light blocker disposed along the light path of the digital micro-mirror device. The digital micro-mirror device includes a base having a plurality of outer pads, a micro-mirror array disposed on the base, and a plurality of bonding wires. The bonding wires are electrically connecting the outer pads with the corresponding micro-mirror array. The light blocker is configured for blocking the light incident to the bonding wires and the light reflected by the bonding wires.

Abstract: A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure of heat outside and electricity inside. Consequently, there is no limitation caused by electrical elements surrounding the heat dissipation carrier, so as to enhance the expandability of the heat dissipation carrier and improve the efficiency for heat dissipation of the heat generation element.

Abstract: A light-emitting diode packaging apparatus is disclosed, which is used for a supporting member having a plurality of supporting pieces to be inserted therein for the subsequent molding and packaging operations, including a mold base for a plurality of supporting pieces of a supporting member to be inserted therein, and a controller for inserting into the mold base and positioning the supporting member. This invention features forming a positioning foot at the periphery of at least one electrode pin of each of the supporting pieces, and also forming a corresponding first positioning aperture on the mold cup of the mold base for the positioning of the supporting pieces. The present invention also provides a mold base and supporting pieces for use with the light-emitting diode packaging apparatus.

Abstract: An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.

Abstract: An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.