Abstract: An LED package is provided. The LED package includes a carrier, an LED chip, a conductive structure, a first encapsulant, a lens and a heat sink. The carrier is cup shaped and comprises a bottom portion and a lateral wall. The LED chip is received in the carrier and disposed on the bottom portion. The conductive structure is electrically connected to the LED chip. The first encapsulant is received in the carrier and fixing the carrier and the conductive structure. The lens is corresponding to the LED chip. The carrier is embedded in the heat sink, and heat generated by the LED chip is transmitted to the heat sink via the bottom portion and the lateral wall of the carrier.

Abstract: A bus receiver receives at least one first signal and a second signal both generated from a chip connected to a parallel bus. The bus receiver includes a receiving module and a deskewing module. The receiving module is electrically connected to the parallel bus and receives the first signal and the second signal transmitted through the parallel bus. The deskewing module is electrically connected to the receiving module and deskews the phase of the first signal and the phase of the second signal. The first signal and the second signal are in the same phase.

Abstract: Multiphase voltage sources are used in driving an AC_LED; different light timing is achieved by changing the relative phase or frequency of the voltage sources. Different light color mixing is also achieved when more than one AC_LED with different colors are combined to use.

Abstract: An optical system for a projection device is disclosed. The projection device includes three different light sources, three condensers corresponding to the light sources, an integrator, an optical lens array, a total internal reflection prism, a digital micro-mirror device and a projection lens. The light sources generate light transmitting through the condensers, the integrator, the optical lens array, the total internal reflection prism, and the digital micro-mirror device into the projection lens. The optical system includes an emitting and reflecting module emitting and reflecting light from the light sources to the integrator and comprises a first, second emitting and reflecting mirrors intersecting thereto, the intersections of the first, second emitting and reflecting mirrors facing the corresponding light sources and condensers.

Abstract: An AC LED device and method for fabricating the same are disclosed. An exemplary embodiment of the AC LED device includes at least two separate AC LED unit chips, wherein each of the AC LED unit chip includes a substrate having a first light emitting module and a second light emitting module. Each of the first and second light emitting modules includes a plurality of light emitting micro diodes connected between a first conductive electrode and a second conductive electrode, wherein the amount of light emitting micro diodes emitting light during a positive half cycle of an AC charge is equal to that during a negative half cycle of an AC charge. A plurality of conductive wires is respectively and electrically connected to the separate AC LED unit chips without passive devices.

Abstract: The present invention provides a method for measuring the PN-junction temperature of a light-emitting diode (LED), which uses a reference voltage to establish the function of current, real power, power factor, or driving-time interval on temperature. The initial and thermal-equilibrium values of current, real power, power factor, or driving-time interval are measured, and hence the variations thereof are calculated. Referring to the pre-established function, the temperature change is given. By the temperature change and the initial temperature, the PN-junction temperature of the LED is thereby deduced.

Abstract: A lamp apparatus include a lamp body, at least an alternating current light-emitting diode and a plug. The alternating current light-emitting diode is disposed on a lamp body. The plug is electrically connected to the alternating current light-emitting diode. In lamp apparatuses utilizing AC LED, heat generated thereby is almost concentrated on chips. Compared with conventional lamp apparatuses utilizing DC LEDs, heat generated thereby is distributed on chips and outer rectifier. In lamp apparatuses utilizing AC LEDs, heat generated thereby is almost concentrated on chips because AC LEDs operate directly with AC electric power, omitting a rectifier and preventing power loss during operation of power rectification. Therefore, the heat accumulated on the chips of the AC LEDs is enough to be used to evaporate essential oil. In another embodiment, the invention utilizes low-resistance pure water surrounding the AC LED to dissipate its heat.

Abstract: A light emitting device includes a light emitting element having at least two electrodes disposed at the side of the light output surface thereof, and a base member having a recess and lead portions corresponding to the electrodes, the light emitting element being mounted on the base member and received in the recess, wherein the light output surface faces toward opening of the recess that becomes smaller while approaching the light output surface, and the electrodes are respectively in electrical connection with the lead portions that extend from the connection positions to outer edge of the base member for power connection, and a light reflecting portion is disposed in the recess adjacent to the light output surface such that the light emitted from the light emitting element can be reflected to walls of the recess to form a substantially collimated light beam so as to improve light efficiency.

Abstract: An assembly structure is provided. The assembly structure includes a first substrate, a second substrate and a medium layer disposed between the first and second substrates. The medium layer includes a side edge, and the second substrate includes at least one lead wire. When the second substrate is disposed on the medium layer, the lead wire of the second substrate is relatively oblique to the side edge of the medium layer.

Abstract: A light emitting device includes a leadframe, a light emitting unit, a transparent encapsulant, and a fluorescent colloid layer. The light emitting unit is disposed on the leadframe. The transparent encapsulant covers the light emitting unit, wherein the transparent encapsulant has a concave on which at least one reflective surface is disposed. The fluorescent colloid layer is disposed outside the transparent encapsulant, wherein a chamber is formed between the fluorescent colloid layer and the transparent encapsulant. The light generated by the light emitting unit is reflected by the reflective surface and guided to a side wall of the fluorescent colloid layer.

Abstract: A light emitting diode (LED) package includes at least one LED chip, a carrier, a light reflection element and at least one outside connection electrode. The LED chip is disposed on the carrier and a conductive line or a flip chip method is used to connect the electrodes of the LED chip to the external connection electrodes. A transparent material is used for fixing the light reflection element and carrier, and forming a lens.

Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

Abstract: An alternating current light-emitting device and the fabrication method thereof is disclosed. The alternating current light-emitting device includes at least one alternating current micro-die light-emitting module formed on a substrate and composed of at least two micro-dies connected to one another. The micro-dies, each includes at least two active layers, are electrically connected by a conductive structure, such that the active layers of the micro-dies take turns emitting light during positive and negative half cycles of alternating current, thereby providing a full-scale light-emitting area for all-time light emission.

Abstract: A structure of light-emitting diode (LED) dies having an AC loop (a structure of AC LED dies), which is formed with at least one unit of AC LED micro-dies disposed on a chip. The unit of AC LED micro-dies comprises two LED micro-dies arranged in mutually reverse orientations and connected with each other in parallel, to which an AC power supply may be applied so that the LED unit may continuously emit light in response to a positive-half wave voltage and a negative-half wave voltage in the AC power supply. Since each AC LED micro-die is operated forwardly, the structure of AC LED dies also provides protection from electrical static charge (ESD) and may operate under a high voltage.

Abstract: An alternating current light-emitting device includes a substrate, an alternating current microdie light-emitting module, and a conductive structure. The alternating current microdie light-emitting module is formed on the substrate and has at least two microdies and a concave portion disposed between the two microdies. Each of the microdies has at least one active layer. The conductive structure electrically connects the microdies and thereby enables the active layers of the microdies to take turns to emit light during positive and negative half cycles of alternating current. The conductive structure is formed in the concave portion and covers an insulator. The present invention prevents undue open circuits but enhances yield.

Abstract: A projection optical system includes a digital micro-mirror device and a light blocker disposed along the light path of the digital micro-mirror device. The digital micro-mirror device includes a base having a plurality of outer pads, a micro-mirror array disposed on the base, and a plurality of bonding wires. The bonding wires are electrically connecting the outer pads with the corresponding micro-mirror array. The light blocker is configured for blocking the light incident to the bonding wires and the light reflected by the bonding wires.

Abstract: A projector light tunnel comprising an elongated transparent solid body having a light incident surface for facing toward a light source, a light emitting surface at an opposite side of the elongated transparent solid body to the light incident surface, for uniformly standardizing intensity distribution of light emitted from the light source, the light incident surface being configured as a curved surface.

Abstract: An alternating current light emitting device and the fabrication method includes forming one or more alternating current micro diode light emitting modules on a substrate, wherein the alternating current micro diode light emitting module has two micro diodes connected to one another, and each micro diode has at least two active layers and is electrically connected by a conductive structure, such that the active layers of each micro diode can take turns emitting light during the positive/negative half cycles of alternating current. A continuous and full-scale light emitting effect is thereby achieved.

Abstract: A light emitting device and the method for producing the same are disclosed. The light emitting device has at least a light emitting unit with a first electrode and a second electrode for generating a light source when powered on, a conductive element electrically coupled to the first electrode of the light emitting unit and a substrate having a carrier portion for carrying the light emitting unit and a heat dissipating portion extending from the carrier portion and electrically coupled to the second electrode of the light emitting unit, in which the conductive element is disposed on a side of a planar face of the heat dissipating portion, thereby allowing large contact area to be established between the heat dissipating portion and a sub-heat-dissipating system or air so as to achieve good heat dissipation.

Abstract: A heat dissipation package is provided. Conducting leads of the package are located between two dissipating parts of a heat dissipation carrier to form the heat dissipation package with a structure of heat outside and electricity inside. Consequently, there is no limitation caused by electrical elements surrounding the heat dissipation carrier, so as to enhance the expandability of the heat dissipation carrier and improve the efficiency for heat dissipation of the heat generation element.