Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat

Abstract: A method of checking a sheet as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

Abstract: A wireless IC tag 1 is provided with a memory circuit 304 including a ROM 307 in which an identification number is written, and a pulse width detection circuit 305 having divided resistors 111, 112, 113 and a capacitor 305 for detecting a signal waveform from a reader. In order to prevent the increase in the number of process steps and photomasks, a resistance value of the pulse width detection circuit 305 is adjusted by an electron beam writing method while utilizing a step of writing an identification number unique to the wireless IC tag 1 into the ROM (307) of the memory circuit 304.

Abstract: A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

Abstract: There is a problem related to radio wave interference, e.g. the shade of radio wave of a radio IC tag, when a plurality of radio IC tags are present in a region of electromagnetic wave. When a plurality of antennas each having a large area are present in the vicinity of the radio IC tag, the radio IC tag easily receives the affect of an antenna conductor. In a plurality of radio IC tags present in a radio wave area, width of the antenna conductor of the radio IC tag is set at 1.0 mm or less. Furthermore, in order to realize an antenna conductor having a small width, an IC tag chip of both side electrode structure having electrodes on the front surface and rear surface of a chip is sandwiched between antennas.

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract: To provide an antenna shape devised to be integrated and compact. The antenna connected to an IC chip that performs wireless identification includes a slit that separates two connection points with respect to the IC chip, in which a length of the slit is approximately 3 millimeters, and a width of the slit is in a range of from 0.8 millimeter to 1.4 millimeters.

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract: A wireless IC tag is provided which includes a plate-shaped first conductor, a plate-shaped second conductor, and an IC chip which is sandwiched between the first conductor and the second conductor via a front surface and a rear surface of the IC chip. The IC chip includes a double voltage rectifier circuit to rectify an alternating voltage induced between the front surface and the rear surface of the IC chip. The second conductor functions as an antenna and also includes a slit extending from a center portion thereof in a longitudinal direction. The first conductor electrically connects both sides of the slit via the front surface and the rear surface of the IC chip.

Abstract: A compact wireless IC tag incorporating a pressure sensor in an IC chip. The IC chip of the wireless IC tag has SOI structure comprising a silicon sheet layer, a silicon device layer which is formed on the upper side of the silicon sheet layer, and a thin silicon oxide layer having about 0.01 ?m to 5 ?m thickness sandwiched between the silicon sheet layer and silicon device layer. In the silicon device layer, a capacitive element of a pressure sensor comprising of a gap, and a first metal wiring and a second metal wiring respectively disposed on the upper and lower sides of the gap, is formed. In the silicon sheet layer on the lower side of the capacitive element, an aperture filled with rubber-like elastic material is formed.

Abstract: A plurality of radio semiconductor chips each having a plurality of electrodes on a surface thereof is provided. By establishing connection between the respective electrodes of the semiconductor chips by wires in a chain form, continuous manufacture of inlets becomes possible. The effect of reducing the cost of a radio recognition semiconductor device can be thereby brought about.

Abstract: A system and method are provided for detecting biological and chemical material. To measure biological materials such as genes easily at low costs, the device for implementing a small-sized, high sensitive, economical measurement apparatus is provided. Probes appropriate for target biological materials are fixed on a chip, on which a sensor, identification number, and radio communication function are implemented, the captured targets are detected by the sensors, and the result of sensing are transferred to an external control unit by the radio communication function. The small-sized, high sensitivity measurement apparatus for detecting biological and chemical materials such as genes and measuring physical and chemical amounts such as temperature, pressure, pH, and the like can be implemented.

Abstract: The present invention provides a service system using a certificate which is easily portable and difficult to counterfeit. The feature of the invention is to use a contactless IC chip as a portable certificate. An IC chip-attached seal is thin and small, and therefore is easily portable and distributable to a user. By integrating or attaching (or sticking) the IC chip into or on a certificate 3910, the counterfeiting of the certificate 3910 becomes difficult.

Abstract: An issue of reducing a product manufacture unit cost exists in wireless IC chips which are required to be disposable because the wireless IC chips circulate in a massive scale and require a very high collection cost. It is possible to increase the communication distance of a wireless IC chip with an on-chip antenna simply contrived for reduction of the production unit cost by increasing the size of the antenna mounted on a wireless IC chip or by increasing the output power of a reader as in a conventional way. However, because of the circumstances of the applications used and the read accuracy of the reader, the antenna cannot be mounted on a very small chip in an in-chip antenna form. When an AC magnetic field is applied to an on-chip antenna from outside, eddy current is produced in principle because the semiconductor substrate is conductive. It has been fount that the thickness of the substrate can be used as a design parameter because of the eddy current.

Abstract: A contactless IC chip is mounted or adhered on a certificate and used in a service system having an interrogator and a computer system. The interrogator and the computer system are interconnected via a network such as the Internet. The IC chip is used as an electronic tag and the interrogator receives first information by reading information printed on the certificate including a digital signature and by receiving second information from the electronic tag through an antenna of the interrogator. Then, the first information from the certificate and the digital signature are used by the computer to calculate third information that is compared with the second information received from the electronic tag. If the comparison results in a match, then the certificate is deemed authentic.

Abstract: The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

Abstract: Transmission and reception of the identification number to/from an interrogator includes an interrogator that reads a recognition number from a responder by radio. When a clock pulse is modulated on a high-frequency carrier and transmitted to the responder from the antenna of the interrogator, there are a first case when the clock pulse interval is short and a second case when the clock pulse interval is long.

Abstract: A wireless IC tag is provided which includes a plate-shaped first conductor, a plate-shaped second conductor, and an IC chip which is sandwiched between the first conductor and the second conductor via a front surface and a rear surface of the IC chip. The IC chip includes a double voltage rectifier circuit to rectify an alternating voltage induced between the front surface and the rear surface of the IC chip. The second conductor functions as an antenna and also includes a slit extending from a center portion thereof in a longitudinal direction. The first conductor electrically connects both sides of the slit via the front surface and the rear surface of the IC chip.

Abstract: This Application is intended to provide a method for effectively protecting paper or film-form media against forgery. This can be achieved by, for example, embedding in a paper or film-form medium a thin semiconductor chip up to 0.5 mm square, equipped with an antenna, and characterized in that the side walls of the semiconductor chip are formed using oxide films, and in that multiple such semiconductor chips are separated by etching. Limiting the size of these semiconductor chips to 0.5 mm or less enables improvement against bending and concentrated loads, and separating the semiconductor chips by etching results in semiconductor chips free from cracking and breakage. Also, the oxide films constituting the side walls of the semiconductor chips prevents short-circuiting at edges during connection to the respective antennas. Thus, simplified processes can be adopted.

Abstract: The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.