Abstract: An IC chip (12) having a memory (16) for memorizing a first random number (11) and information other than the first random number (11) (identification number 17 and the like) and for transmitting information in the memory (16) non-contact condition with a time difference according to a numeric value of the first random number (11). By setting the first random number (11) in a memory address counter (13) of the IC chip (12) for time difference control, the memory address counter (13) can be used for memory data transmission control at the same time, thereby building up a logic simply. As a consequence, it is possible to construct a semiconductor device capable of anti-collision control in the size of 0.5 mm square or less.

Abstract: A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

Abstract: The present invention provides a service system using a certificate which is easily portable and difficult to counterfeit. The feature of the invention is to use a contactless IC chip as a portable certificate. An IC chip-attached seal is thin and small, and therefore is easily portable and distributable to a user. By integrating or attaching (or sticking) the IC chip into or on a certificate 3910, the counterfeiting of certificate 3910 becomes difficult.

Abstract: In a wireless IC tag utilizing a wireless IC chip, the wireless IC tag having sufficient stress strength is manufactured economically. There is adopted a structure in which an upper electrode and a lower electrode are respectively formed on a front surface and a rear surface of a wireless IC chip, and the upper electrode is connected to a first conductor and a lower electrode is connected to a second conductor, and the first conductor and the second conductor are connected outside the wireless IC chip. Thereby, it is possible to fabricate the wireless IC tag economically and to ensure the stress strength.

Abstract: A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from which information can be read cut or written and having visible information. The method includes a step of encrypting the visible information of the sheet and storing the encrypted visible information in the electronic circuit chip, and a step of determining discriminatively the authenticity of the sheet by comparing the visible information of the sheet with the information stored in the electronic circuit chip.

Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract: A non-contact identification semiconductor device is provided with a semiconductor chip including a receiving circuit that receives an inquiry to the non-contact identification semiconductor device, a memory that stores identification information of multiple bits and a sending circuit that sends the identification information. An antenna coupled to said semiconductor chip receives the identification information from said semiconductor chip and transmits the identification information outside of said non-contact semiconductor. The long side length of the semiconductor chip is not greater than 0.5 mm in plane dimension, and the identification information is stored by a pattern printed by an electron beam.

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.

Abstract: The technology includes the steps of: associating material-object identification code identifying each individual material object with material-object information representing information about material object identified by identification code and storing identification code and material-object information in material-object information database in each of business categories; sending code and information stored in database in each business category; integrating items of information having same code with each other among codes and items of information received from database in each business category to generate integrated material-object information, associating identification code with integrated material-object information identified by code and storing identification code and integrated material-object information in integrated database; requesting to send integrated material-object information associated with given identification code; reading requested integrated material-object information from integrat

Abstract: To provide an antenna shape devised to be integrated and compact. The antenna connected to an IC chip that performs wireless identification includes a slit that separates two connection points with respect to the IC chip, in which a length of the slit is approximately 3 millimeters, and a width of the slit is in a range of from 0.8 millimeter to 1.4 millimeters.

Abstract: A semiconductor device manufacturing method is used for packaging a thin semiconductor chip in an economical manner. A semiconductor chip having one electrode terminal, a first member having a first conductor on its surface, and a second member having a second conductor on its surface are prepared. The first and second members are positioned such that the first and second conductors face each other, and the semiconductor chip is held between the members. In this arrangement, one of the first and second conductors is in electrical contact with the first electrode.

Abstract: Concerning a plurality of second bonding pads that are electrically connected with a plurality of first bonding pads provided on an IC chip and having a predetermined narrow pitch, a technique is disclosed that allows the plurality of second pads to be provided on the IC chip. This makes it possible to provide the second pads at desired positions. Accordingly, it becomes possible to form, by printing with a low accuracy, respective interconnections that connect the plurality of second pads with a plurality of electrodes provided on a substrate. Also, matching of positions is executed between the plurality of second pads and the plurality of electrodes formed on the substrate by printing. This matching makes it possible to electrically connect the second pads with the electrodes provided on the substrate in a such a manner that they are opposed to each other.

Abstract: In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

Abstract: A system and method are provided for detecting biological and chemical material. To measure biological materials such as genes easily at low costs, the device for implementing a small-sized, high sensitive, economical measurement apparatus is provided. Probes appropriate for target biological materials are fixed on a chip, on which a sensor, identification number, and radio communication function are implemented, the captured targets are detected by the sensors, and the result of sensing are transferred to an external control unit by the radio communication function. The small-sized, high sensitivity measurement apparatus for detecting biological and chemical materials such as genes and measuring physical and chemical amounts such as temperature, pressure, pH, and the like can be implemented.

Abstract: The present invention aims to economically implement an ultra-compact semiconductor device having an identification number according to the efficient utilization of an electron-beam writing method.

Abstract: In a method of mounting a planar electronic circuit chip onto a flexible sheet together with another planar electronic element, the electronic circuit part and the another electric element are selected so that the planar surface of the another electric element is greater than the planar surface of the electronic circuit chip, and the another electric element and the electronic circuit chip are mounted on the sheet so that the planar surface of the another electric element and the planar surface of the electronic circuit chip are in parallel with the sheet surface, and the planer surface of the electronic circuit chip is accommodated within the planar surface of the another electric element as viewed in a direction perpendicular to the sheet surface.

Abstract: A method of checking sheets as to forgery thereof, the sheet being provided with an electronic circuit chip from or in which information can be read out or written and having visible information.

Abstract: The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit with a semiconductor device, providing a plurality of semiconductor devices on said jig to house the devices into the openings, and fixing on a substrate then cutting the substrate to provide independent electronic devices. When the semiconductor device is in a form of chip, a support member attached to the chip will facilitate the handling of chips.

Abstract: An electronic device, in which a flat plate semiconductor and dumets connected to surface electrodes on the front and back surfaces of the semiconductor and to lead wires are encapsulated in a glass tube.