Patents by Inventor Naoaki Nakamura
Naoaki Nakamura has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10996403Abstract: An optical fiber mounting method that mounts a plurality of optical fibers on a substrate includes: bundling the optical fibers together with a bundling member; adjusting a height of the bundling member from a surface of the substrate or an angle of inclination of the bundling member relative to the surface of the substrate; bringing end faces of the optical fibers bundled with the bundling member into contact with end faces of optical waveguides on the substrate, the optical waveguides respectively corresponding to the optical fibers; and bonding the optical fibers to the substrate, in a state where the end faces of the optical fibers are in contact with the end faces of the optical waveguides.Type: GrantFiled: April 22, 2020Date of Patent: May 4, 2021Assignee: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura
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Publication number: 20200363592Abstract: An optical fiber mounting method that mounts a plurality of optical fibers on a substrate includes: bundling the optical fibers together with a bundling member; adjusting a height of the bundling member from a surface of the substrate or an angle of inclination of the bundling member relative to the surface of the substrate; bringing end faces of the optical fibers bundled with the bundling member into contact with end faces of optical waveguides on the substrate, the optical waveguides respectively corresponding to the optical fibers; and bonding the optical fibers to the substrate, in a state where the end faces of the optical fibers are in contact with the end faces of the optical waveguides.Type: ApplicationFiled: April 22, 2020Publication date: November 19, 2020Applicant: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura
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Patent number: 10629556Abstract: A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.Type: GrantFiled: May 10, 2018Date of Patent: April 21, 2020Assignee: FUJITSU LIMITEDInventors: Takashi Kubota, Takayoshi Matsumura, Naoaki Nakamura
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Patent number: 10591690Abstract: An optical module includes a circuit board having, an electronic circuit formed therein and an optical circuit mounted thereon, and coupled to a first end of an inner optical fiber, a connector assembly to which a second end of the inner optical fiber is fixed, and a housing including a first housing including a slid surface on which a sliding surface included in the connector assembly slides so as to position the connector assembly, a second housing including an engaging protrusion engaged with the positioned connector assembly so as to fix the connector assembly, the second housing being bonded to the first housing and the housing being mounted with the circuit board.Type: GrantFiled: May 30, 2018Date of Patent: March 17, 2020Assignee: FUJITSU LIMITEDInventors: Akio Sugama, Naoaki Nakamura, Takayoshi Matsumura
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Patent number: 10586770Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.Type: GrantFiled: November 5, 2018Date of Patent: March 10, 2020Assignee: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura, Norio Kainuma, Takashi Kubota, Kenji Fukuzono, Takumi Masuyama, Yuki Hoshino, Hidehiko Kira
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Patent number: 10444450Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.Type: GrantFiled: May 22, 2018Date of Patent: October 15, 2019Assignee: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura, Kenji Fukuzono, Norio Kainuma, Takashi Kubota, Takumi Masuyama, Yuki Hoshino, Hidehiko Kira
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Patent number: 10443957Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.Type: GrantFiled: August 23, 2018Date of Patent: October 15, 2019Assignee: FUJITSU LIMITEDInventors: Shunichi Kikuchi, Yoshihisa Iwakiri, Naoaki Nakamura, Takayoshi Matsumura
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Publication number: 20190274216Abstract: A board module includes a first board having an inner wall that has a protrusion and defines a through hole. The board module includes a second board provided in the through hole and joined to the protrusion by using a resin. The board module includes a third board joined above and across the first board and the second board.Type: ApplicationFiled: February 19, 2019Publication date: September 5, 2019Applicant: FUJITSU LIMITEDInventors: TAKASHI KUBOTA, Takayoshi Matsumura, Naoaki Nakamura
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Publication number: 20190157207Abstract: An optical module includes: a substrate including a through hole, a first chip including a first heating member and disposed in the through hole, a second chip including a second heating member and bonded to a first upper surface of the substrate and a second upper surface of the first chip via bumps, and a first heat sink adhered to a lower surface of the substrate with a first adhesive and adhered to a lower surface of the first chip with a second adhesive, wherein the substrate includes a slit which is provided on a side of a first portion, to which the second chip is bonded, of the substrate with respect to the through hole, and communicates with the through hole.Type: ApplicationFiled: November 5, 2018Publication date: May 23, 2019Applicant: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura, NORIO KAINUMA, TAKASHI KUBOTA, KENJI FUKUZONO, Takumi Masuyama, Yuki Hoshino, Hidehiko Kira
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Patent number: 10261249Abstract: An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.Type: GrantFiled: October 17, 2017Date of Patent: April 16, 2019Assignee: FUJITSU LIMITEDInventors: Norio Kainuma, Naoaki Nakamura, Kenji Fukuzono
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Publication number: 20190093964Abstract: A cooling plate that includes: a plate that is attached to a heat generating element; feed flow paths and return flow paths for coolant that are alternatingly arranged along a plate face of the plate; and a plurality of coolant flow paths that are formed in a plurality of levels within the plate closer to the heat generating element than the feed flow paths and the return flow paths, the plurality of coolant flow paths placing adjacent paths of the feed flow paths and the return flow paths in parallel communication through each of the levels.Type: ApplicationFiled: August 23, 2018Publication date: March 28, 2019Applicant: FUJITSU LIMITEDInventors: Shunichi KIKUCHI, Yoshihisa IWAKIRI, Naoaki NAKAMURA, Takayoshi MATSUMURA
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Publication number: 20180348458Abstract: An optical module includes a circuit board having, an electronic circuit formed therein and an optical circuit mounted thereon, and coupled to a first end of an inner optical fiber, a connector assembly to which a second end of the inner optical fiber is fixed, and a housing including a first housing including a slid surface on which a sliding surface included in the connector assembly slides so as to position the connector assembly, a second housing including an engaging protrusion engaged with the positioned connector assembly so as to fix the connector assembly, the second housing being bonded to the first housing and the housing being mounted with the circuit board.Type: ApplicationFiled: May 30, 2018Publication date: December 6, 2018Applicant: FUJITSU LIMITEDInventors: Akio Sugama, Naoaki Nakamura, Takayoshi Matsumura
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Publication number: 20180341075Abstract: An optical module includes a substrate, a silicon photonics chip disposed in an opening of the substrate, a control chip disposed across the substrate and the silicon photonics chip, a plurality of laser diodes disposed over the silicon photonics chip, and a metallic bar in contact with each of terminals of the plurality of laser diodes and electrically coupling each of the terminals with the silicon photonics chip or the substrate.Type: ApplicationFiled: May 22, 2018Publication date: November 29, 2018Applicant: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura, KENJI FUKUZONO, NORIO KAINUMA, TAKASHI KUBOTA, Takumi Masuyama, Yuki Hoshino, Hidehiko Kira
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Publication number: 20180337156Abstract: A composite bump includes a plurality of first bumps that is metal-bonded to an electrode pad of a semiconductor chip, and a second bump that is metal-bonded to the plurality of first bumps. A method for forming a composite bump, includes forming a plurality of first bumps to be metal-bonded to an electrode pad of a semiconductor chip, and forming a second bump to be metal-bonded to the plurality of first bumps.Type: ApplicationFiled: May 10, 2018Publication date: November 22, 2018Applicant: FUJITSU LIMITEDInventors: TAKASHI KUBOTA, Takayoshi Matsumura, Naoaki Nakamura
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Patent number: 10115694Abstract: An electronic device includes an electronic part including a first substrate having a group of first terminals over a first front surface and having a concavity in a back surface, a filler placed in the concavity, and a flat plate placed over the back surface with the filler therebetween, and further includes a second substrate disposed on the first front surface side of the first substrate and having a group of second terminals bonded to the group of first terminals over a second front surface opposite the first front surface. The filler and flat plate minimize deformation of the first substrate and variation in the distance between the group of first terminals and the group of second terminals caused by the deformation of the first substrate, which thereby reduces the occurrence of a failure in bonding together the group of first terminals and the group of second terminals.Type: GrantFiled: December 5, 2016Date of Patent: October 30, 2018Assignee: FUJITSU LIMITEDInventors: Hidehiko Kira, Naoaki Nakamura, Sanae Iijima
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Patent number: 10103510Abstract: An optical module includes an optical element having a group of first pads which is formed on a first surface thereof, a substrate having a group of second pads which is formed on a second surface thereof facing the first surface so as to correspond to the group of first pads, respectively, and a group of solders that respectively bonds the group of first pads and the group of second pads to each other, wherein, in a plan view, the corresponding first and second pads partially overlap each other, and a center of gravity of the group of first pads coincides with a center of gravity of the group of second pads.Type: GrantFiled: October 23, 2017Date of Patent: October 16, 2018Assignee: FUJITSU LIMITEDInventors: Norio Kainuma, Naoaki Nakamura
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Publication number: 20180217343Abstract: An optical module includes a housing; a substrate configured to have a through hole; a first chip configured to have a first heating member and be disposed inside the through hole; a second chip configured to have a second heating member, the second chip being placed on the substrate and the first chip with a bump interposed; a first heat conduction member configured to be sandwiched between a lower wall of the housing and the first chip and transfer heat generated by the first heating member to the lower wall of the housing; and a second heat conduction member configured to be sandwiched between an upper wall of the housing and the second chip and transfer heat generated by the second heating member to the upper wall of the housing.Type: ApplicationFiled: January 19, 2018Publication date: August 2, 2018Applicant: FUJITSU LIMITEDInventors: Takayoshi Matsumura, Naoaki Nakamura, NORIO KAINUMA, KENJI FUKUZONO, Yuki Hoshino, TAKASHI KUBOTA, Takumi Masuyama, Hidehiko Kira
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Publication number: 20180159300Abstract: An optical module includes an optical element having a group of first pads which is formed on a first surface thereof, a substrate having a group of second pads which is formed on a second surface thereof facing the first surface so as to correspond to the group of first pads, respectively, and a group of solders that respectively bonds the group of first pads and the group of second pads to each other, wherein, in a plan view, the corresponding first and second pads partially overlap each other, and a center of gravity of the group of first pads coincides with a center of gravity of the group of second pads.Type: ApplicationFiled: October 23, 2017Publication date: June 7, 2018Applicant: FUJITSU LIMITEDInventors: NORIO KAINUMA, Naoaki Nakamura
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Publication number: 20180156972Abstract: An optical module includes a first board that includes a recessed portion and a first conductor layer, a second board accommodated in the recessed portion and includes an optical waveguide and a second conductor layer, a semiconductor element installed across the first board and the second board and coupled to the first conductor layer and the second conductor layer, and a first bonding material disposed between a sidewall and a bottom surface of the recessed portion and the second board so as to bond the first board and the second board to each other.Type: ApplicationFiled: October 17, 2017Publication date: June 7, 2018Applicant: FUJITSU LIMITEDInventors: NORIO KAINUMA, Naoaki Nakamura, KENJI FUKUZONO
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Patent number: 9817453Abstract: A cooling device that is thermally connected to a heat source and cools the heat source by means of a heat medium flowing inside the cooling device, includes: a first passage configured such that the heat medium before being heated by the heat source flows through the first passage; a second passage configured such that the heat medium after being heated by the heat source flows through the second passage; a plurality of heat exchanging chambers each configured such that in the heat exchanging chamber, the heat medium is heated by heat generated by the heat source; a first communicating passage provided in each of the plurality of heat exchanging chambers and configured such that through the first communicating passage, the first passage and the heat exchanging chamber communicate with each other; a second communicating passage provided in each of the plurality of heat exchanging chambers.Type: GrantFiled: September 11, 2015Date of Patent: November 14, 2017Assignee: FUJITSU LIMITEDInventor: Naoaki Nakamura