Abstract: A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing partition bath 35 that are divided by gates 21 through 24 and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids 13-31 and 13-32 in the input partition bath 31 and the first partition bath 32 are a preheating temperature. The temperature of a liquid 13-33 in the heat partition bath 33 is a soldering temperature. The gate 21 is gradually opened while the printed board assembly 11 is located in the first intermediate partition bath 32 and before the printed board assembly 11 is conveyed into the heat partition bath 33.

Abstract: A bath apparatus 12 reserves a liquid 13 as a heating medium and includes an input partition bath 31, a first intermediate partition bath 32, a heat partition bath 33, a second intermediate partition bath 34 and a removing partition bath 35 that are divided by gates 21 through 24 and sequentially arranged in a direction in which a printed board assembly where components are loaded onto a printed board moves. The temperatures of liquids 13-31 and 13-32 in the input partition bath 31 and the first partition bath 32 are a preheating temperature. The temperature of a liquid 13-33 in the heat partition bath 33 is a soldering temperature. The gate 21 is gradually opened while the printed board assembly 11 is located in the first intermediate partition bath 32 and before the printed board assembly 11 is conveyed into the heat partition bath 33.

Abstract: A semiconductor unit is provided, which includes a substrate, a plurality of semiconductor components loaded on the substrate, and a cooling device provided above the semiconductor components. A flat-bottomed dent, slightly smaller than the semiconductor component, is provided on a compound injection unit of the cooling device, and an injection hole for injecting a compound is formed in communication with the dent. The compound is injected through the injection hole into the dent and into a clearance provided between the compound injection unit and the semiconductor component, thus forming a compound layer in between the compound injection unit and the semiconductor component.