Abstract: Methods, systems, and devices for read refresh operations are described. A memory device may include a plurality of sub-blocks of memory cells. Each sub-block may undergo a quantity of access operations (e.g., read operations, write operations). Based on the quantity of access operations performed on any one sub-block over a period of time, a read refresh operation may be performed on the memory cells of the sub-block. A read refresh operation may refresh and/or restore the data stored to the memory cells of the sub-block, and be initiated based on the memory device receiving an operation code (e.g., from a host device).

Abstract: An example apparatus can include a memory array and control circuitry. The memory array can include a first portion including a first plurality of memory cells. The memory array can further include a second portion including a second plurality of memory cells. The control circuitry can be configured to designate the first portion as active responsive to a determination that the first portion passed a performance test. The control circuitry can be configured to designate the second portion as inactive responsive to a determination that the second portion failed the performance test.

Abstract: The present disclosure includes apparatuses, methods, and systems for multi-state programming of memory cells. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of four possible data states by applying a first voltage pulse to the memory cell wherein the first voltage pulse has a first polarity and a first magnitude, and applying a second voltage pulse to the memory cell wherein the second voltage pulse has a second polarity and a second magnitude, and the second voltage pulse is applied for a shorter duration than the first voltage pulse.

Abstract: As described, an apparatus may include a memory cell corresponding to a memory address and an access line forming at least a portion of the memory cell. The apparatus may include a first decoder associated with a first delivery driver coupled to a first end of the access line and a second decoder associated with a second delivery driver coupled to another end of the access line.

Abstract: Methods, systems, and devices for accessing a multi-level memory cell are described. The memory device may perform a read operation that includes pre-read portion and a read portion to access the multi-level memory cell. During the pre-read portion, the memory device may apply a plurality of voltages to a plurality of memory cells to identify a likely distribution of memory cells storing a first logic state. During the read portion, the memory device may apply a first read voltage to a memory cell based on performing the pre-read portion. The memory device may apply a second read voltage to the memory cell during the read portion that is based on the first read voltage. The memory device may determine the logic state stored by the memory cell based on applying the first read voltage and the second read voltage.

Abstract: An example apparatus includes a three-dimensional (3D) memory array including a sense line and a plurality of vertical stacks. Each respective on of the vertical stacks includes a different respective portion of the sense line, a first memory cell coupled to that portion of the sense line, a second memory cell coupled to that portion of the sense line, a first access line coupled to the first memory cell and a second access line coupled to the second memory cell. The first and second access lines are perpendicular to the sense line.

Abstract: Methods, systems, and devices for read refresh operations are described. A memory device may include a plurality of sub-blocks of memory cells. Each sub-block may undergo a quantity of access operations (e.g., read operations, write operations). Based on the quantity of access operations performed on any one sub-block over a period of time, a read refresh operation may be performed on the memory cells of the sub-block. A read refresh operation may refresh and/or restore the data stored to the memory cells of the sub-block, and be initiated based on the memory device receiving an operation code (e.g., from a host device).

Abstract: As described, an apparatus may include a memory cell corresponding to a memory address and an access line forming at least a portion of the memory cell. The apparatus may include a first decoder associated with a first delivery driver coupled to a first end of the access line and a second decoder associated with a second delivery driver coupled to another end of the access line.

Abstract: Methods, systems, and devices for data-based polarity write operations are described. A write command may cause a set of data to be written to a set of memory cells. To write the set of data, a write operation that applies voltages across the memory cells based on a logic state of data to be written to the memory cells may be used. During a first interval of the write operation, a voltage may be applied across a memory cell based on a logic state of a data bit to be written to the memory cell. During a second interval of the write operation, a voltage may be applied across the memory cell based on an amount of charge conducted by the memory cell during the first interval.

Abstract: Methods, systems, and devices for read refresh operations are described. A memory device may include a plurality of sub-blocks of memory cells. Each sub-block may undergo a quantity of access operations (e.g., read operations, write operations). Based on the quantity of access operations performed on any one sub-block over a period of time, a read refresh operation may be performed on the memory cells of the sub-block. A read refresh operation may refresh and/or restore the data stored to the memory cells of the sub-block, and be initiated based on the memory device receiving an operation code (e.g., from a host device).

Abstract: As described, an apparatus may include a memory cell corresponding to a memory address and an access line forming at least a portion of the memory cell. The apparatus may include a first decoder associated with a first delivery driver coupled to a first end of the access line and a second decoder associated with a second delivery driver coupled to another end of the access line.

Abstract: Phase change material can be set with a multistage set process. Set control logic can heat a phase change semiconductor material (PM) to a first temperature for a first period of time. The first temperature is configured to promote nucleation of a crystalline state of the PM. The control logic can increase the temperature to a second temperature for a second period of time. The second temperature is configured to promote crystal growth within the PM. The nucleation and growth of the crystal set the PM to the crystalline state. The multistage ramping up of the temperature can improve the efficiency of the set process relative to traditional approaches.

Abstract: In one embodiment, an apparatus comprises a first memory array comprising a plurality of phase change memory (PCM) cells; and a controller to track a first cycle count metric based at least in part on a number of writes performed to at least a portion of the first memory array; and adjust, based on the first cycle count metric, a demarcation voltage to be applied during read operations performed on PCM cells of the first memory array.

Abstract: Phase change material can be set with a multistage set process. Set control logic can heat a phase change semiconductor material (PM) to a first temperature for a first period of time. The first temperature is configured to promote nucleation of a crystalline state of the PM. The control logic can increase the temperature to a second temperature for a second period of time. The second temperature is configured to promote crystal growth within the PM. The nucleation and growth of the crystal set the PM to the crystalline state. The multistage ramping up of the temperature can improve the efficiency of the set process relative to traditional approaches.

Abstract: Phase change material can be set with a multistage set process. Set control logic can heat a phase change semiconductor material (PM) to a first temperature for a first period of time. The first temperature is configured to promote nucleation of a crystalline state of the PM. The control logic can increase the temperature to a second temperature for a second period of time. The second temperature is configured to promote crystal growth within the PM. The nucleation and growth of the crystal set the PM to the crystalline state. The multistage ramping up of the temperature can improve the efficiency of the set process relative to traditional approaches.

Abstract: Examples may include techniques to mitigate bias drift for memory cells of a memory device. A first memory cell coupled with a first word-line and a bit-line is selected for a write operation. A second memory cell coupled with a second word-line and the bit-line is de-selected for the write operation. First and second bias voltages are applied to the first word-line and the bit-line during the write operation to program the first memory cell. A third bias voltage is applied to the second word-line during the write operation to reduce or mitigate voltage bias to the second memory cell due to the second bias voltage applied to the bit-line to program the first memory cell.

Abstract: In one embodiment, an apparatus comprises a first memory array comprising a plurality of phase change memory (PCM) cells; and a controller to track a first cycle count metric based at least in part on a number of writes performed to at least a portion of the first memory array; and adjust, based on the first cycle count metric, a demarcation voltage to be applied during read operations performed on PCM cells of the first memory array.

Abstract: Examples may include techniques to mitigate bias drift for memory cells of a memory device. A first memory cell coupled with a first word-line and a bit-line is selected for a write operation. A second memory cell coupled with a second word-line and the bit-line is de-selected for the write operation. First and second bias voltages are applied to the first word-line and the bit-line during the write operation to program the first memory cell. A third bias voltage is applied to the second word-line during the write operation to reduce or mitigate voltage bias to the second memory cell due to the second bias voltage applied to the bit-line to program the first memory cell.

Abstract: Examples may include techniques to mitigate bias drift for memory cells of a memory device. A first memory cell coupled with a first word-line and a bit-line is selected for a write operation. A second memory cell coupled with a second word-line and the bit-line is de-selected for the write operation. First and second bias voltages are applied to the first word-line and the bit-line during the write operation to program the first memory cell. A third bias voltage is applied to the second word-line during the write operation to reduce or mitigate voltage bias to the second memory cell due to the second bias voltage applied to the bit-line to program the first memory cell.

Abstract: Phase change material can be set with a multistage set process. Set control logic can heat a phase change semiconductor material (PM) to a first temperature for a first period of time. The first temperature is configured to promote nucleation of a crystalline state of the PM. The control logic can increase the temperature to a second temperature for a second period of time. The second temperature is configured to promote crystal growth within the PM. The nucleation and growth of the crystal set the PM to the crystalline state. The multistage ramping up of the temperature can improve the efficiency of the set process relative to traditional approaches.