Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: In order to achieve both a reduction in thermal resistance and an improvement in thermal deformation absorbing property of a semiconductor device having a packaging structure in which a semiconductor chip 1 is electrically connected to conductive members 3a and 3b via bonding members 2a and 2b, the bonding members 2a and 2b each includes a stacked structure provided with, in the order from the side close to the semiconductor chip 1, a nanospring layer 4 configured from a plurality of springs having a nano-order size, a planar layer 5 supporting the plurality of springs, and a bonding layer 6. The thickness of the nanospring layer 4 is larger than the thickness of the bonding layer 6, and the thickness of the bonding layer 6 is larger than the thickness of the planar layer 5.

Abstract: The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material 106, and after a semiconductor element 104 is connected to a lead frame 102 and wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloy 103 with the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resin 101 and the substrate.

Abstract: One object is to provide a game system restraining real money trade in a technical aspect. The game system includes one or more computer processors for executing a computer program to provide a game played by a plurality of users. The computer program includes: an exhibition request receiving module for receiving, from a first user among the plurality of users, an exhibition request for exhibiting a first game item owned by the first user; an exchange request receiving module for receiving, from a second user among the plurality of users, an exchange request for exchanging a second game item owned by the second user for the first game item exhibited by the first user; and a re-exhibition information presenting module for presenting, to part or all of the plurality of users, re-exhibition item information indicating that the second game item is exhibited for exchange for the first game item.

Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: The purpose of the present invention is to increase the reliability of a semiconductor device in which a semiconductor element and a substrate are connected by solder and which is molded by resin. Solder containing easily volatized metals (Zn, Mg, Sb) is used for a solder material 106, and after a semiconductor element 104 is connected to a lead frame 102 and wire bonding is carried out, vacuum heat treatment is applied, the easily volatized metals in the solder are volatized to adhere to a substrate surface, and an alloy 103 with the lead frame is formed, thereby roughening the substrate surface and improving the adhesive strength of a sealing resin 101 and the substrate.

Abstract: An electronic camera having a plurality of functions including capturing and recording images is provided. The electronic camera includes an operation input unit for inputting external operations that designate corresponding functions of the camera to be performed, an image pickup unit for capturing the image of an object, and a recorder for recording the image captured by the image pickup unit. The electronic camera further includes a playback unit for at least playing back image information that is recorded on the recording medium and a mode selector for selecting one operation mode of the camera from a plurality of available operation modes that include an operation explanation mode. If the operation explanation mode is selected at the mode selector, the playback unit plays back an operation guide that is pre-stored in a memory, the operation guide explaining at least one of the camera operations and functions thereof.

Abstract: An image processing apparatus provided with a display unit for displaying an operation picture, showing control indicia (e.g., icons) corresponding to multiple image processing functions, is operated to display the operation picture on an external display device. The operator selects one of the indicia shown on the external display device by operating an input device, such as touch screen of the apparatus or a remote control, to indicate the position of the desired one of the indicia. The operator can thereby quickly and reliably select an image processing function to be executed, without any need to view an operation picture on the display unit when making the selection.

Abstract: One object is to provide a video game system that can technically restrain real money trade. In accordance with one aspect, a server device 10 according to an embodiment of the present invention includes: a determination unit 58 configured to determine whether an exchange of exhibited game contents and bid game contents is concluded based on a game content parameter value characterizing the exhibited game contents and the game content parameter value characterizing the bid game contents; and an updating unit 61 configured to update an owned game content storage unit 52 such that, only when the determination unit 58 determines that the exchange is concluded, the exhibited game contents are stored in association with player identification information of a bidder player and the bid game contents are stored in association with player identification information of an exhibitor player.

Abstract: In a resin granulating apparatus of the present invention, a bracket extending in the outward radial direction over an outer peripheral surface of a sleeve is provided for the sleeve for rotatably supporting a cutter shaft of a cutter for shearing a material extruded from a die. Stopper means cooperating with the bracket to regulate movement of the sleeve toward the die and moving a regulation position in the axial direction is provided on the radially outer side over an outer diameter of the sleeve. With such a configuration, installation space is compactified so as to additionally provide the stopper means in the existing facilities, and a position of the cutter relative to a die surface is precisely adjusted so as to stably produce a pellet of a best shape.

Abstract: One object is to provide a game system that can technically restrain real money trade. In accordance with one aspect, a game system according to an embodiment of the present invention includes: a bid data generating unit configured to generate bid data including game medium information related to a bid game medium and not including player specifying information that specifies a bidder player; and a second display control unit configured to allow a bid screen generated based on bid data to be displayed in the game being played by an exhibitor player.

Abstract: The disclosed junction material, manufacturing method thereof, and manufacturing method of junction structure utilize lead-free materials and ensure a high reliability of the junction between a semiconductor element and a frame or substrate, or, between a metal plate and another metal plate. For junctions between a semiconductor element and a frame or substrate, by using as the JUNCTION MATERIAL a laminate material comprising a Zn-based metallic layer (101), Al-based metallic layers (102a, 102b) on both sides thereof, and X-based metallic layers (103a, 103b) (X=Cu, Au, Ag or Sn) on the outside of both the Al-based metallic layers (102a, 102b), even in an oxygen-rich environment, the superficial X-based metallic layers protect the Zn and Al from oxidation until said junction material melts, preserving the wettability and bondability of said junction material as solder and securing the high reliability of the junction.

Abstract: Provided is a connecting part for a semiconductor device including a semiconductor element, a frame, and a connecting part which connects the semiconductor element and the frame to each other, in which an interface between the connecting part and the semiconductor element and an interface between the connecting part and the frame respectively have the area of Al oxide film which is more than 0% and less than 5% of entire area of the respective interfaces. The connecting part has an Al-based layer and first and second Zn-based layers on main surfaces of the Al-based layer, a thickness ratio of the Al-based layer relative to the Zn-based layers being less than 0.59.

Abstract: In a connecting material of the present invention, a Zn series alloy layer is formed on an outermost surface of an Al series alloy layer. In particular, in the connecting material, an Al content of the Al series alloy layer is 99 to 100 wt.% or a Zn content of the Zn series alloy layer is 90 to 100 wt.%. By using this connecting material, the formation of an Al oxide film on the surface of the connecting material at the time of the connection can be suppressed, and preferable wetness that cannot be obtained with the Zn—Al alloy can be obtained. Further, a high connection reliability can be achieved when an Al series alloy layer is left after the connection, since the soft Al thereof functions as a stress buffer material.

Abstract: A semiconductor device includes a semiconductor element, a support member bonded to a first surface of the semiconductor element with a first bonding material and a lead electrode bonded to a second surface of the semiconductor element supported on the support member with a second bonding material, and further including a method of producing the semiconductor device. Respective connecting parts of the support member and the lead electrode are Ni-plated and each of the first and the second bonding material is a Sn solder having a Cu6Sn5 content greater than a eutectic content.

Abstract: A content distribution system which assures reliability of content is provided. Permitted-user information corresponding to a user who is permitted to use content to be distributed is associated with the content. In the case where user specific information which specifies a user and the permitted-user information do not have a predetermined relation, a user terminal transmits the user specific information and the permitted-user information to a server. The server generates user-related information in which the received user specific information is set as a distribution destination and the permitted-user information is set as a distributor, generates new permitted-user information so as to have the predetermined relation with the user specific information, and provides the new permitted-user information to the user terminal. The user terminal which obtains the new permitted-user information changes the permitted-user information to the new permitted-user information.

Abstract: A Ni plating is applied on a base metal in a metal strip form, and a brightener-free Sn-(1 to 4% by mass)Cu plating is applied on the Ni plating. The metal strip is heat-treated at a temperature at or above the melting point (solidus line) of a Sn-(1 to 4% by mass)Cu alloy to form a Cu-Sn compound layer or a Cu—Ni—Sn-compound layer on the Ni plating layer and a Sn layer or a Sn—Cu-ally layer on the Cu—Sn compound layer or the Cu—Ni—Sn-compound layer. The metal strip is further fabricated into a connector.