Abstract: A switch-connected dragonfly network and method of operating. A plurality of groups of row switches is organized according to multiple rows and columns, each row including multiple groups of row switches connected to form a two-level dragonfly network. A plurality of column switches interconnect groups of row switches along respective columns, a column switch associated with a corresponding group of row switches in a row. A switch port with a same logical port on a row switch at a same location in each group along the respective column connects to a same column switch. The switch-connected dragonfly network is expandable by adding additional rows, an added row comprising a two-level dragonfly network. A switch group of said added row associated with a column being connects to an available port at an existing column switch of said column by corresponding added S path link with no re-cabling of the switched network required.

Abstract: A semiconductor device includes a first circuit formed on a substrate in a first region, a second circuit formed on the substrate in a second region and including one or more transistors, and connections between the first circuit and respective gates of the transistors of the second circuit. The substrate includes a first semiconductor material and the second circuit includes one or more transistors having channels formed from a second semiconductor material different from the first semiconductor material.

Abstract: Method for and apparatus were fans and cable placed at the ends at the same end of a computer rack drawer. The cable ends are located between the fans and the computing elements. The bulk length of each cable passes through the region where the fans are located. Air, and optionally EMI, sealing are provided by an elastic material near the fans. In this way cables could exit the same tailstock of the drawer where fans are located. The cable ends can receive good cooling, and the distance between the cable ends and computing elements of the drawer is not lengthened by the fan position.

Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.

Abstract: A semiconductor device includes a first circuit formed on a substrate in a first region, a second circuit formed on the substrate in a second region and including one or more transistors, and connections between the first circuit and respective gates of the transistors of the second circuit. The substrate includes a first semiconductor material and the second circuit includes one or more transistors having channels formed from a second semiconductor material different from the first semiconductor material.

Abstract: An apparatus is provided including a transformer including a first printed circuit board having one or more conducting layers, the one or more conducting layers forming, at least in part, a transformer coil; at least one inductor; and at least one continuous piece of conducting material external to the printed circuit board, where the at least one continuous piece of conducting material forms a connection between the transformer and the at least one inductor. A method is also provided for assembling a switched-mode power supply.

Abstract: An electrical connector carries large amounts of electrical current between two circuit boards with low resistance and low self-inductance by means of an interdigitated anode and cathode, thereby providing low dynamic voltage loss. The connector also may include, near where power will be consumed, an interposer board with on-board capacitance to provide even lower dynamic voltage loss. The connector has application to delivering low-voltage, high-current power from a power supply on a first board to electronics on a second board: the low resistance provides low voltage drop for a load current that is constant, while the low inductance and the capacitors provide low voltage fluctuation for a load current that changes. These issues are of great importance, for example, in designing high-performance computers.

Abstract: An assembled circuit board has a topology that defines positions, dimensions and power dissipation of components mounted to the circuit board, including a high power component and one or more low power components. A cold plate makes thermal contact to the high power component through a thermal interface material. A thermally conductive sheet overlays the circuit board and is formed to match the topology of the low power component or components. The sheet has a first portion that makes thermal contact with the cold plate and a second portion that overlays the low power component or components. The cold plate removes heat directly from the high power component and indirectly through the thermally conductive sheet from the low power component or components. The thermally conductive sheet conforms to the topology of the low power components either by preforming or by flexibility.

Abstract: Method for and apparatus were fans and cable placed at the ends at the same end of a computer rack drawer. The cable ends are located between the fans and the computing elements. The bulk length of each cable passes through the region where the fans are located. Air, and optionally EMI, sealing are provided by an elastic material near the fans. In this way cables could exit the same tailstock of the drawer where fans are located. The cable ends can receive good cooling, and the distance between the cable ends and computing elements of the drawer is not lengthened by the fan position.

Abstract: An embodiment includes a method for use in operating a memory chip, the method comprising: operating the memory chip with an increased burst length relative to a standard burst length of the memory chip; and using the increased burst length to access metadata during a given operation of the memory chip. Another embodiment includes a memory module, comprising a plurality of memory chips, each memory chip being operable with an increased burst length relative to a standard burst length of the memory chip, the increased burst length being used to access metadata during a given operation of the memory module.

Abstract: Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.

Abstract: An method for forming a cooling apparatus for cooling an electronic component. The apparatus has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Abstract: An electrical connector includes an anode for conducting an electrical supply current from a source to a destination, a cathode for conducting an electrical return current from the destination to the source, and an insulator that prevents electrical conduction between the anode and the cathode. The first and second shapes are such as to provide a conformity of one to the other, with the insulator placed therebetween and having a predetermined relatively thin thickness. A predetermined low-resistance path for the supply current is provided respectively by the anode and the cathode, and a proximity of the anode to the cathode along these paths provides a predetermined low self-inductance of the connector. The anode and the cathode each comprises a plurality of sections that are disposed at one or more predetermined angles to form a rigid assembly that accommodates a geometry between the source and the destination.

Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The planar top member has a plurality of stamped indent formations at a plurality of locations, each indent formation providing a contact surface such that the planar top member is affixed to the bottom member by braze or solder at each contact surface. Alternatively, the planar bottom member also has a plurality of stamped indent formations in alignment with indent formations of the top member. The planar top member is affixed to the bottom member by brazing or soldering each respective contact surface of an indent formation of the planar top member to an opposing contact surface of a corresponding indent formation of the parallel planar bottom member.

Abstract: An apparatus for cooling an electronic component has a planar top member of a thermal energy conductive material and a parallel planar bottom member of the material, the planar bottom member including a surface having regions configured for heat exchange contact with the electronic component. The joined planar top and bottom members have a sidewall structure of reduced height (and generally the height of the cold plate) between active areas in order to improve flexibility. The stiffness of the sidewalls is reduced by very advantageously reduce the height of the sidewalls. In one embodiment, the sidewalls are shorter in height corresponding to regions only between active areas. Alternatively, the sidewalls are of reduced height everywhere by insetting the active areas within the top and/or bottom sheets.

Abstract: A structure for a network switch. The network switch may include a plurality of spine chips arranged on a plurality of spine cards, where one or more spine chips are located on each spine card; and a plurality of leaf chips arranged on a plurality of leaf cards, wherein one or more leaf chips are located on each leaf card, where each spine card is connected to every leaf chip and the plurality of spine chips are surrounded on at least two sides by leaf cards.

Abstract: Embodiments disclosed herein generally relate to techniques for routing data through one or more cascaded memory modules. Each memory module can include a plurality of data buffers. Each data buffer includes a plurality of ports for routing data to and/or from other memory modules. In one embodiment, the data buffer is configured to route write data to DRAM devices on a first memory module or route write data to a data buffer of at least one downstream memory module. The data buffer is also configured to receive read data from a DRAM device of the first memory module or receive read data from a downstream memory module.

Abstract: A power-delivery system may comprise a load device and a direct-current converter configured to deliver current to the load device when the direct-current converter is in an on state. The power-deliver system may comprise a voltage-measurement system configured to measure, at a beginning of each measurement cycle in a cyclic measurement pattern, a voltage at the load device. The power-deliver system may comprise a power controller configure to receive, at the beginning of each measurement cycle, the measurement of the voltage, and to perform, at the beginning of a control cycle in a cyclic control pattern, a voltage-control decision in response to a change in the measurement of the voltage being below a voltage-change threshold. The voltage-control decision may comprise whether to switch the state of the first direct-current converter. The cyclic control pattern may operate at a first frequency, and the measurement pattern may operate at a second frequency.