Abstract: In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer or electrically conductive vias. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, interconnect layers, conductive vias that electrically connect different components of the package and/or passive devices. In some specific embodiments, the dielectric layers are formed from a suitable epoxy such as SU-8 type.

Abstract: A method and apparatus for processing multiple signals at a common frequency combined into a single radio frequency cable and subsequently recovering the signals without significant losses, distortion, or cross-talk. The method and apparatus includes processing multiple signals at a common frequency fed through a single radio frequency (RF) cable with or without one or more amplifiers and utilized for either forward or reverse link transmissions. The invention enables a single power amplifier to amplify multiple RF signals that occupy a common frequency channel and after amplification splitting these signals into amplified copies of the originals. The amplified signals may be sent to different antenna ports to illuminate different base station sectors if required. The signal splitting function is performed at the antenna masthead such that this method reduces the number of feeder cables running up the antenna tower by a factor of N, where N is the number of common frequency signals (e.g.

Abstract: An optical based input touch display device with high resolution shadow detection using the linear splitting of waveguides among transmit and receive lenses and grey-scale calculations for shadow edge and center detection is disclosed. The apparatus includes a light source and a transmit waveguide optically coupled to the light source. The transmit waveguide includes a plurality of transmit waveguide grooves coupled to a plurality of groups of shared transmit lenses respectively. The plurality of groups of transit lenses, which are configured to generate a plurality of collimated light beams from the light source. A receive waveguide is also provided having a plurality of receive waveguide grooves coupled to a plurality of groups of shared receive lenses. The plurality of groups of receive lenses are configured to receive the plurality of collimated light beams. A photodiode array including a plurality of photodiodes are optically coupled to the plurality of receive waveguide grooves respectively.

Abstract: The present invention allows transmission of multiple signals between masthead electronics and base housing electronics in a base station environment. At least some of the received signals from the multiple antennas are translated to being centered about different center frequencies, such that the translated signals may be combined into a composite signal including each of the received signals. The composite signal is then sent over a single feeder cable to base housing electronics, wherein the received signals are separated and processed by transceiver circuitry. Prior to being provided to the transceiver circuitry, those signals that were translated from being centered about one frequency to another may be retranslated to being centered about the original center frequency.

Abstract: In one aspect, an integrated circuit package composed of a plurality of immediately adjacent stacked layers of cured, planarizing, photo-imageable dielectric is described. At least one interconnect layer is provided between a pair of adjacent dielectric layers. An integrated circuit is positioned within one or more of the dielectric layers such that at least one of the dielectric layers extends over the active surface of the integrated circuit. The integrated circuit is electrically coupled with I/O pads on a surface of the package at least in part through the interconnect layer or electrically conductive vias. In particular embodiments, the package can include thermal pipes, a heat sink, multiple integrated circuits, interconnect layers, conductive vias that electrically connect different components of the package and/or passive devices. In some specific embodiments, the dielectric layers are formed from a suitable epoxy such as SU-8 type.

Abstract: Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to an integrated circuit package in which one or more integrated circuits are embedded in a substrate and covered with a layer of photo-imageable epoxy. The substrate can be made of various materials, including silicon, quartz and glass. An integrated circuit is positioned within a cavity in the top surface of the substrate. The epoxy layer is formed over the top surface of the substrate and the active face of the integrated circuit. An interconnect layer is formed over the epoxy layer and is electrically coupled with the integrated circuit.

Abstract: Various methods for forming an integrated circuit micro-module are described. In one aspect of the invention, layers of an epoxy are sequentially deposited over a substrate to form planarized layers of epoxy over the substrate. The epoxy layers are deposited using spin coating. At least some of the layers are photolithographically patterned after they are deposited and before the next epoxy layer is deposited. Openings are formed in at least some of the patterned epoxy layers after they are patterned and before the next epoxy layer is deposited. An integrated circuit is placed within one of the openings. At least one of the epoxy layers is deposited after the placement of the integrated circuit to cover the integrated circuit. At least one conductive interconnect layer is formed over an associated epoxy layer. Multiple external package contacts are formed.

Abstract: Various apparatus and methods for improving the dissipation of heat from integrated circuit micro-modules are described. One aspect of the invention pertains to an integrated circuit package with one or more thermal pipes. In this aspect, the integrated circuit package includes multiple layers of a cured, planarizing dielectric. An electrical device is embedded within at least one of the dielectric layers. At least one electrically conductive interconnect layer is embedded within one or more of the dielectric layers. A thermal pipe made of a thermally conductive material is embedded in at least one associated dielectric layer. The thermal pipe thermally couples the electrical device with one or more external surfaces of the integrated circuit package. Various methods for forming the integrated circuit package are described.

Abstract: Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to a wafer level method for packaging micro-systems. A substrate prefabricated with metal vias can be provided. The substrate can also be made by forming holes in a substrate and electroplating an electrically conductive material into the holes to form the vias. Multiple Microsystems are formed on a top surface of the substrate. Each microsystem is formed to include multiple layers of planarizing, photo-imageable epoxy, one or more interconnect layers and an integrated circuit. Each interconnect layer is embedded in an associated epoxy layer. The integrated circuit is positioned within at least an associated epoxy layer. The interconnect layers of the Microsystems are formed such that at least some of the interconnect layers are electrically coupled with one or more of the metal vias in the substrate.

Abstract: Various apparatuses and methods for forming integrated circuit packages are described. One aspect of the invention pertains to a method for forming a microsystem and one or more passive devices in the microsystem. Layers of epoxy are sequentially deposited over a substrate to form multiple planarized layers of epoxy over the substrate. The epoxy layers are deposited by spin coating. At least some of the epoxy layers are photolithographically patterned after they are deposited and before the next epoxy layer is deposited. An integrated circuit having multiple I/O bond pads is placed on an associated epoxy layer. At least one conductive interconnect layer is formed over an associated epoxy layer. A passive component is formed within at least one of the epoxy layers. The passive component is electrically coupled with the integrated circuit via at least one of the interconnect layers. Multiple external package contacts are formed.

Abstract: A method and apparatus for processing multiple signals at a common frequency combined into a single radio frequency cable and subsequently recovering the signals without significant losses, distortion, or cross-talk. The method and apparatus includes processing multiple signals at a common frequency fed through a single radio frequency (RF) cable with or without one or more amplifiers and utilized for either forward or reverse link transmissions. The invention enables a single power amplifier to amplify multiple RF signals that occupy a common frequency channel and after amplification splitting these signals into amplified copies of the originals. The amplified signals may be sent to different antenna ports to illuminate different base station sectors if required. The signal splitting function is performed at the antenna masthead such that this method reduces the number of feeder cables running up the antenna tower by a factor of N, where N is the number of common frequency signals (e.g.

Abstract: The present invention allows transmission of multiple signals between masthead electronics and base housing electronics in a base station environment. At least some of the received signals from the multiple antennas are translated to being centered about different center frequencies, such that the translated signals may be combined into a composite signal including each of the received signals. The composite signal is then sent over a single feeder cable to base housing electronics, wherein the received signals are separated and processed by transceiver circuitry. Prior to being provided to the transceiver circuitry, those signals that were translated from being centered about one frequency to another may be retranslated to being centered about the original center frequency.

Abstract: One embodiment of the present invention includes a flexible interconnect assembly that can convert between optical and electrical signals and that is configured to be easily secured to an electrical device, such as a printed circuit board or integrated circuit chip. The flexible interconnect assembly includes a flexible substrate and one or more optical waveguides that are mounted on the flexible interconnect and suitable for transmitting optical signals. One or more conversion devices for converting between electrical and optical signals are arranged on the flexible substrate. The flexible interconnect assembly optionally includes an attachment fixture that enables the flexible substrate to be reversibly coupled to an attachment apparatus. Particular embodiments of the present invention involve methods, devices and systems for using a flexible interconnect assembly with one or more electronic substrates configured with an attachment apparatus.

Abstract: Embodiments of the invention are concerned with improvements to antenna systems, in particular beamforming antenna systems. Embodiments provide an improved beamformer arrangement for receiving and transmitting of signals by antenna elements. Embodiments are particularly well suited to use for transceiving of radio signals by base stations, such as are commonly found in cellular networks.

Abstract: A flex interconnect with an integrated electrical-to optical and optical-to-electrical transport layer, which enables the optical transport of critical high speed data without the need of expensive and bulky optical connectors. The flex interconnect assembly includes a flexible printed circuit substrate, which includes one or more electrical interconnects, formed on the flexible printed circuit substrate, for transmitting one or more electrical signals respectively. The flexible printed circuit substrate also includes an optical waveguide mounted onto the substrate. The optical waveguide includes an integral optical transport layer, including electrical-to-optical and optical-to-electrical interfaces connected at either end of the optical waveguide. With the integrated optical transport layer, the flex interconnect can receive electrical signals, convert and transmit them to optical signals, and then convert them back to electrical signals, all without expensive and bulky opto-electrical connectors.

Abstract: One embodiment of the present invention includes a flexible interconnect assembly that can convert between optical and electrical signals and that is configured to be easily secured to an electrical device, such as a printed circuit board or integrated circuit chip. The flexible interconnect assembly includes a flexible substrate and one or more optical waveguides that are mounted on the flexible interconnect and suitable for transmitting optical signals. One or more conversion devices for converting between electrical and optical signals are arranged on the flexible substrate. The flexible interconnect assembly optionally includes an attachment fixture that enables the flexible substrate to be reversibly coupled to an attachment apparatus. Particular embodiments of the present invention involve methods, devices and systems for using a flexible interconnect assembly with one or more electronic substrates configured with an attachment apparatus.

Abstract: A method and apparatus for transmitting wireless data to users which increases the wireless capacity for data transmissions within a sector served by a base station is disclosed. Accordingly, the sector is subdivided into a plurality of beams, typically by means of beam forming antennas, and the user data to be transmitted is time division multiplexed by scheduling the data into timeslots for transmission via the beams. Capacity is thus increased by decreasing network interference and/or transmitting data to more than one user at the same time by means of the multiple beams, and time division multiplexing the data. Preferably multiple users can be scheduled on multiple beams simultaneously in order to increase capacity. Preferably the same user can be allocated more than one beam if the radio conditions warrant. Such a system is optimized for data and carries out the following steps: a. Evaluating the reverse link wireless conditions for each user; b.

Abstract: An optical based input touch display device with high resolution shadow detection using the linear splitting of waveguides among transmit and receive lenses and grey-scale calculations for shadow edge and center detection is disclosed. The apparatus includes a light source and a transmit waveguide optically coupled to the light source. The transmit waveguide includes a plurality of transmit waveguide grooves coupled to a plurality of groups of shared transmit lenses respectively. The plurality of groups of transit lenses, which are configured to generate a plurality of collimated light beams from the light source. A receive waveguide is also provided having a plurality of receive waveguide grooves coupled to a plurality of groups of shared receive lenses. The plurality of groups of receive lenses are configured to receive the plurality of collimated light beams. A photodiode array including a plurality of photodiodes are optically coupled to the plurality of receive waveguide grooves respectively.

Abstract: A method embodiment of the invention includes a scheme for trimming and compensation of a laser emitter in a fiber optic link. A laser emitter is provided. Also a reference optical power value is determined using data models of laser emitter performance generated by statistical analysis of sample population of lasers that are similar to the subject laser emitter. The performance of the subject laser is measured and qualified optical power levels for the subject laser emitter are determined using the reference operating power value and measured performance of the subject laser emitter. The driving current of the subject laser emitter is adjusted to compensate for changes in temperature until the optical power of the subject laser emitter obtains a desired qualified optical power level. Related methods of determining qualified optical power levels for a laser emitter in a fiber optic link are also disclosed.

Abstract: Techniques for manufacturing an optical transmission device in a manner so that the photonic device is protected from damage that can be caused by exposure to the environment and physical handling are described. The invention involves placing a lens or a lens array over a photonic device, either with or without the use of a receptacle device, such that the photonic device is contained within a sealed cavity. The invention has three main embodiments in which the photonic device can be hermetically sealed, quasi-hermetically sealed, or non-hermetically sealed. The optical transmission device can be configured to serve as an optical receiver, detector, or a transceiver device.