Patents by Inventor Peter Yu

Peter Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190033706
    Abstract: Examples of a multiple-mask multiple-exposure lithographic technique and suitable masks are provided herein. In some examples, a photomask includes a die area and a stitching region disposed adjacent to the die area and along a boundary of the photomask. The stitching region includes a mask feature for forming an integrated circuit feature and an alignment mark for in-chip overlay measurement.
    Type: Application
    Filed: November 1, 2017
    Publication date: January 31, 2019
    Inventors: Peter Yu, Chih-Tung Hsu, Kevin Wang, Chih-Chia Hu, Roger Chen
  • Patent number: 10157885
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Grant
    Filed: July 29, 2016
    Date of Patent: December 18, 2018
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Peter Yu-Fei Huang, Richard Burton Cassidy, II, Chaochieh Tsai
  • Publication number: 20180033773
    Abstract: A package structure and method for forming the same are provided. The package structure includes a first die, and the first die includes a first magnetic pad formed over a first substrate. The package structure includes a second die, and the second die includes a second magnetic pad formed over a second substrate. The package structure also includes a hybrid bonding structure formed between the first die and the second die of the second wafer. The hybrid bonding structure includes a magnetic bonding structure which is made of the first magnetic pad and the second magnetic layer.
    Type: Application
    Filed: July 29, 2016
    Publication date: February 1, 2018
    Inventors: Peter Yu-Fei HUANG, Richard Burton CASSIDY, II, Chaochieh TSAI
  • Patent number: 9876612
    Abstract: A method of data bandwidth overhead reduction in a protocol based communication over a Wide Area Network (WAN) includes transmitting, through a sender device of a source location, data packets of a sequence to a receiver device of a destination location communicatively coupled to the sender device through the WAN and storing a copy of the transmitted data packets in the sender device for a first threshold duration of time. When the receiver device receives a non-consecutive data packet, the receiver device waits for a second threshold period of time before transmitting a NAK message to the sender device related to non-receipt of one or more out-of-order data packet(s). The sender device interprets the NAK message and retransmits the one or more out-of-order data packet(s) to the receiver device after which the one or more out-of-order data packets are removed.
    Type: Grant
    Filed: February 6, 2017
    Date of Patent: January 23, 2018
    Inventors: Naveen Maveli, Ashwath Nagaraj, Peter Yu
  • Publication number: 20180012868
    Abstract: A three-dimensional stacking structure is described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die includes contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Application
    Filed: August 25, 2017
    Publication date: January 11, 2018
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai
  • Patent number: 9748206
    Abstract: A three-dimensional stacking structure and the manufacturing method(s) thereof are described. The stacking structure includes at least a bottom die, a top die and a spacer protective structure. The bottom die include contact pads in the non-bonding region. The top die is stacked on the bottom die without covering the contact pads of the bottom die and the bottom die is bonded with the top die through bonding structures there-between. The spacer protective structure is disposed on the bottom die and covers the top die to protect the top die. By forming an anti-bonding layer before stacking the top dies to the bottom dies, the top die can be partially removed to expose the contact pads of the bottom die for further connection.
    Type: Grant
    Filed: May 26, 2016
    Date of Patent: August 29, 2017
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Peter Yu Fei Huang, Chaochieh Tsai
  • Patent number: 9737226
    Abstract: Disclosed is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire and is suitable for use during imaging procedures such as, without limitation, CT scans or MRI. The connector assembly includes a housing having. An engagement member is pivotably disposed within the housing to retain the connector on an ECG electrode fixed to a patient's body, an arcuate stiffener is deposed between the engagement member and a pivot member and a radiolucent resilient member configured to bias the engagement member.
    Type: Grant
    Filed: August 8, 2016
    Date of Patent: August 22, 2017
    Assignee: Covidien LP
    Inventors: David Zhou, Peter Yu
  • Publication number: 20170156462
    Abstract: A customizable travel case is disclosed having a compartment for displaying identifying information or decoration on the outside of the travel case. The display compartment has a transparent cover that is capable of opening and closing so that identifying information or decoration can be inserted and displayed without having to open the travel case. The cover of the display compartment is held in a closed position by the use of magnets.
    Type: Application
    Filed: December 4, 2015
    Publication date: June 8, 2017
    Applicant: Travelers Club Luggage, Inc.
    Inventor: Peter Yu
  • Patent number: 9602389
    Abstract: Disclosed are a method and/or a system for defining logical channels and channel policies in an application acceleration environment. In one aspect, a system includes a branch site including a branch client. A headquarters site includes a headquarters server, the branch site and the headquarters site are communicatively coupled over a logical link via a transmission media. A first point of presence (POP) is communicatively coupled with a branch customer premise equipment (CPE) located at the branch site over a first segment of the logical link. A second POP is communicatively coupled with the first POP over a second segment of the logical link. Each segment of the logical link is constructed from a physical link and contains two segment endpoints. The physical link carries a network traffic of the network connection between the two segment endpoints of an associated segment.
    Type: Grant
    Filed: November 21, 2015
    Date of Patent: March 21, 2017
    Inventors: Naveen Maveli, Alex Kaufman, Ashwath Nagaraj, Peter Yu
  • Patent number: 9581570
    Abstract: In accordance with the present disclosure, a method of using acoustic emission data to predict the state of a structural element is described. The method includes capturing acoustic emission data for a structural element. The method further includes predicting the future stress intensity in the structural element using the captured acoustic emission data and calculating the probability of future failure of the structural element using the predicted future stress intensity.
    Type: Grant
    Filed: February 10, 2012
    Date of Patent: February 28, 2017
    Assignee: University of South Carolina
    Inventors: Juan M. Caicedo, Boris A. Zarate, Paul H. Ziehl, Jianguo Peter Yu
  • Publication number: 20160338610
    Abstract: Disclosed is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire and is suitable for use during imaging procedures such as, without limitation, CT scans or Mill. The connector assembly includes a housing having. An engagement member is pivotably disposed within the housing to retain the connector on an ECG electrode fixed to a patient's body, an arcuate stiffener is deposed between the engagement member and a pivot member and a radiolucent resilient member configured to bias the engagement member.
    Type: Application
    Filed: August 8, 2016
    Publication date: November 24, 2016
    Inventors: David Zhou, Peter Yu
  • Publication number: 20160281719
    Abstract: According to an embodiment of the invention, a pump motor controller for managing energy usage of a pump motor and for receiving signals from a signal sending device corresponding to the status of a climate control device is provided. The motor controller is adapted to receive the signal and to control the pump motor at least partially based on the signal.
    Type: Application
    Filed: March 27, 2015
    Publication date: September 29, 2016
    Inventors: Peter Yu-Pu Wung, Stephen Douglas O'Brien, Howard Ray Richardson
  • Patent number: 9408547
    Abstract: Disclosed is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire and is suitable for use during imaging procedures such as, without limitation, CT scans or MRI. The connector assembly includes a housing having. An engagement member is pivotably disposed within the housing to retain the connector on an ECG electrode fixed to a patient's body, an arcuate stiffener is deposed between the engagement member and a pivot member and a radiolucent resilient member configured to bias the engagement member.
    Type: Grant
    Filed: January 22, 2014
    Date of Patent: August 9, 2016
    Assignee: Covidien LP
    Inventors: David Zhou, Peter Yu
  • Publication number: 20160192851
    Abstract: Disclosed is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire, provides enhanced ergonomics to the clinician, and may alleviate patient discomfort associated with the attachment and removal of ECG leads. The connector may be engaged and disengaged with little or no force imparted to the patient or the ECG pad, which significantly minimizes the risk of inadvertent dislodgement of the pad. In one embodiment the disclosed connector provides a thumb cam lever which affirmatively engages the press stud to the connector, and provides tactile feedback to the clinician that the connector is properly engaged. In other embodiments, the connector provides a pushbutton to enable the clinician to easily engage and disengage the connector from the ECG stud. The disclosed connectors may also decrease clinician fatigue, and may provide more reliable ECG results.
    Type: Application
    Filed: August 13, 2015
    Publication date: July 7, 2016
    Inventors: David Selvitelli, Peter Meyer, Peter Yu
  • Patent number: 9107594
    Abstract: Shown is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire, provides enhanced ergonomics to the clinician, and may alleviate patient discomfort associated with the attachment and removal of ECG leads. The connector may be engaged and disengaged with little or no force imparted to the patient or the ECG pad, which significantly minimizes the risk of inadvertent dislodgement of the pad. In one embodiment the shown connector provides a thumb cam lever which affirmatively engages the press stud to the connector, and provides tactile feedback to the clinician that the connector is properly engaged. In other embodiments, the connector provides a pushbutton to enable the clinician to easily engage and disengage the connector from the ECG stud. The shown connectors may also decrease clinician fatigue, and may provide more reliable ECG results.
    Type: Grant
    Filed: July 7, 2014
    Date of Patent: August 18, 2015
    Inventors: David Selvitelli, Peter Meyer, Peter Yu
  • Publication number: 20140322945
    Abstract: Disclosed is an ECG electrode lead wire connector which provides improved electrical and mechanical coupling of the ECG electrode press stud to the lead wire, provides enhanced ergonomics to the clinician, and may alleviate patient discomfort associated with the attachment and removal of ECG leads. The connector may be engaged and disengaged with little or no force imparted to the patient or the ECG pad, which significantly minimizes the risk of inadvertent dislodgement of the pad. In one embodiment the disclosed connector provides a thumb cam lever which affirmatively engages the press stud to the connector, and provides tactile feedback to the clinician that the connector is properly engaged. In other embodiments, the connector provides a pushbutton to enable the clinician to easily engage and disengage the connector from the ECG stud. The disclosed connectors may also decrease clinician fatigue, and may provide more reliable ECG results.
    Type: Application
    Filed: July 7, 2014
    Publication date: October 30, 2014
    Inventors: David Selvitelli, Peter Meyer, Peter Yu
  • Patent number: D721230
    Type: Grant
    Filed: March 18, 2014
    Date of Patent: January 20, 2015
    Assignee: Travelers Club Luggage, Inc.
    Inventor: Peter Yu
  • Patent number: D725907
    Type: Grant
    Filed: February 10, 2014
    Date of Patent: April 7, 2015
    Assignee: Travelers Club Luggage, Inc.
    Inventor: Peter Yu
  • Patent number: D731182
    Type: Grant
    Filed: December 11, 2014
    Date of Patent: June 9, 2015
    Assignee: Travelers Club Luggage, Inc.
    Inventor: Peter Yu
  • Patent number: D737979
    Type: Grant
    Filed: March 26, 2014
    Date of Patent: September 1, 2015
    Inventors: David Selvitelli, Peter Meyer, Peter Yu