Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: The present disclosure relates to a digital data management system implemented, at least in part, on a server, where the server includes: one or more processors; non-transitory computer-readable media storing instructions executable by the one or more processors to perform operations including: receives a request to sell a digital asset; generating one or more sale offer terms associated with the request to sell the digital asset; receiving an offer to purchase the digital asset from a prospective buyer; verifying that the offer to purchase the digital asset conforms to the one or more sale offer terms; facilitating the purchase of the digital asset at least in part by executing a smart contract on a distributed ledger, the smart contract including at least one self-executing term; and storing information associated with the sale of the digital asset in the distributed ledger.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: Methods, devices, and systems are disclosed that generally perform a time delay determination of a voltage change on a signal node to determine a corresponding signal value on another node causing the voltage change. In an example the circuit device includes a first circuit configured to couple, when enabled, a signal value onto a first node, and a read circuit having an input coupled to the first node. The read circuit is configured to effect a voltage transition of a signal node at a variable rate corresponding to the voltage of the first node, and to determine the signal value based upon a time-to-transition measurement of the signal node.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: The present disclosure relates to circuits, systems, and methods of operation for a memory device. In an example, a memory device includes a plurality of memory cells, each memory cell having a variable impedance that varies in accordance with a respective data value stored therein; and a read circuit configured to read the data value stored within a selected memory cell based upon a variable time delay determination of a signal node voltage change corresponding to the variable impedance of the selected memory cell.

Abstract: Methods, devices, and systems are disclosed that generally perform a time delay determination of a voltage change on a signal node to determine a corresponding signal value on another node causing the voltage change. In an example the circuit device includes a first circuit configured to couple, when enabled, a signal value onto a first node, and a read circuit having an input coupled to the first node. The read circuit is configured to effect a voltage transition of a signal node at a variable rate corresponding to the voltage of the first node, and to determine the signal value based upon a time-to-transition measurement of the signal node.

Abstract: In certain aspects, a circuit includes a dynamic differential logic gate having first and second outputs, and a first static differential logic gate having first and second outputs, and first and second inputs coupled to the first and second outputs, respectively, of the dynamic differential logic gate. The dynamic differential logic gate is configured to receive a clock signal and to preset both the first and second outputs of the dynamic differential logic gate to a first preset value during a first phase of the clock signal. The first static differential logic gate is configured to preset both the first and second outputs of the first static differential logic gate to a second preset value when the first preset value is input to both the first and second inputs of the first static differential logic gate.

Abstract: A method and system are provided for error correction in a memory. Error correction code (ECC) for data stored in a portion of the memory is enabled. A location and number of errors for the portion of the memory is then stored. It is determined if the number of errors exceeds a predetermined number of errors. If the number of errors exceeds the predetermined number, then the data stored in the portion of the memory is refreshed. If refreshing does not correct the errors, then a different ECC may be used.

Abstract: A temperature sensor circuit implemented in electronic circuitry that senses the temperature at a site, digitizes the sensed temperature, and then outputs a signal representing such a sensed temperature. The temperature sensor circuit converts a voltage signal that is proportional to the temperature to a first digital value. The temperature sensor circuit converts a voltage signal that is inversely proportional to the temperature to a second digital value. The sensed temperature is determined as a function of a difference between the first and second digital values.

Abstract: Structures for substituting single bits in an array may include a first array having a plurality of word lines, and for each of the plurality of word lines a memory operable to store a bit substitution column value, and a first data output line operable to communicate the bit substitution column value to a write data shifter. The bit substitution column value may be associated with a bit substitution column in a second array, and the write data shifter may be operable to substitute the bit by shifting data to a redundancy column in the first array.

Abstract: A method and data processing system for accessing an entry in a memory array by placing a tag memory unit (114) in parallel with an operand adder circuit (112) to enable tag lookup and generation of speculative way hit/miss information (126) directly from the operands (111, 113) without using the output sum of the operand adder. PGZ-encoded address bits (0:51) from the operands (111, 113) are applied with a carry-out value (Cout48) to a content-addressable memory array (114) having compact bitcells with embedded partial A+B=K logic to generate two speculative hit/miss signals under control of a delayed evaluate signal. A sum value (EA51) computed from the least significant base and offset address bits determines which of the speculative hit/miss signals is selected for output (126).

Abstract: Temperature sensing circuitry implemented on a semiconductor integrated circuit that senses the temperature at a site, digitizes the sensed temperature, and then outputs a signal representing such a sensed temperature. The temperature sensing circuitry converts a voltage signal that is proportional to the temperature to a frequency-based signal, which is converted to a digital bit value. A scalar factor is applied to another voltage signal that is inversely proportional to the temperature to produce a scaled voltage signal. The scaled voltage signal is converted to a second frequency-based signal, which is converted to a digital bit value, and then the two digital bit values are compared. The temperature is determined when the digital bit values substantially match.

Abstract: A nonvolatile memory device includes a shared port block, a plurality of decoded address signals, a read signal, and a read word line. The shared port block includes a shared port communicatively coupled to a block, the block comprising a plurality of memory cells, wherein the shared port is operable to sense a voltage level at each of the plurality of memory cells. The plurality of decoded address signals are communicatively coupled to the block. Each of the plurality of decoded address signals is operable to enable a corresponding one of the plurality of memory cells. The read signal is communicatively coupled to the shared port. The read signal is operable to enable a read operation associated with the block. The read word line signal is communicatively coupled to the shared port block. The read word line signal is operable to enable the read operation.

Abstract: A method and system are provided for error correction in a memory. Error correction code (ECC) for data stored in a portion of the memory is enabled. A location and number of errors for the portion of the memory is then stored. It is determined if the number of errors exceeds a predetermined number of errors. If the number of errors exceeds the predetermined number, then the data stored in the portion of the memory is refreshed. If refreshing does not correct the errors, then a different ECC may be used.

Abstract: A method for repairing a memory includes executing an Error Correction Code (ECC) for a page of the memory. The page includes a plurality of bits having an inherent number of failed bits equal to or greater than zero. The ECC is configured to correct a correctable number of failed bits from the plurality of bits. A location of a failure prone bit in the page is determined from a cache in response to the correctable number of failed bits being less than the inherent number of failed bits. A state of the failure prone bit is changed to a new state in response to determining the location of the failure prone bit. The ECC is executed in response to the state of the failure prone bit being changed to the new state.

Abstract: Circuits and methods are provided for compensating an offset voltage measured between a first transistor and a second transistor of a sense amplifier circuit that is configured to sense a bit line signal during a sensing phase. The first transistor and the second transistor are cross-coupled. The first transistor is coupled to a first capacitor and the second transistor is coupled to a second capacitor. The first capacitor is further coupled to the second capacitor, and the first and second capacitors are coupled to a third transistor. The first capacitor applies a first bias voltage to the first transistor during a pre-sensing phase prior to the sensing phase, and the second capacitor applies a second bias voltage to the second transistor during the pre-sensing phase.

Abstract: Circuits and methods are provided for compensating an offset voltage measured between a first transistor and a second transistor of a sense amplifier circuit that is configured to sense a bit line signal during a sensing phase. The first transistor and the second transistor are cross-coupled. The first transistor is coupled to a first capacitor and the second transistor is coupled to a second capacitor. The first capacitor is further coupled to the second capacitor, and the first and second capacitors are coupled to a third transistor. The first capacitor applies a first bias voltage to the first transistor during a pre-sensing phase prior to the sensing phase, and the second capacitor applies a second bias voltage to the second transistor during the pre-sensing phase.