Abstract: The magnetic head of the present invention, includes a second magnetic pole (P2 pole) that is fabricated upon a write gap layer that is deposited upon a flat surface. To achieve the flat surface, a P1 pole pedestal is formed upon the P1 pole layer with a sufficient thickness that the induction coil structure can be fabricated beneath the write gap layer. In the preferred embodiment, an etch stop layer is formed upon the P1 pole layer and an ion etching process is utilized to form the induction coil trenches in an etchable material that is deposited upon the etch stop layer. Following the fabrication of the induction coil structure a CMP process is conducted to obtain a polished flat surface upon which to deposit the write gap layer, and the P2 pole is then fabricated upon the flat write gap layer.

Abstract: A method of making read sensor with self-aligned low resistance leads is provided. In the method a masking step has been eliminated by employing first, second and third protective capping layers in the construction of the read sensor and first and second lead layers. The first capping layer serves as a protective layer for the read sensor sites, the second capping layer protects low resistance lead layer portions during removal of the first capping layer from high resistance lead layer sites and then serves as a sacrificial layer during removal of spin valve material from the low resistance lead layer sites. The third capping layer protects the first and second lead layers during milling of low resistance lead layer material in field regions about the read sensor and first and second lead layers. The method aligns front edges of the low resistance lead layer portions with a rear edge of the read sensor so as to lower the overall resistance of the lead layers.

Abstract: The present invention presents a method for fabricating coil elements for magnetic write heads. A coil pattern is formed on a substrate using photolithographic techniques. The substrate is etched using reactive ion etching, creating a coil-shaped trench in the substrate. Thin film seed layers are deposited using ion beam deposition. The substrate is electroplated with metal filling the trenches with metal. The substrate is chemical mechanical polished to remove excess metal and planarize the air bearing surface of the write head.

Abstract: A multi-layer electrically conductive shunt is located on the exterior surface of a slider in electrical contact and extending between first and second lead ends of leads that are connected to a sensor of a read head. Electrically conductive spaced apart first and second read pads are located on the conductive shunt in electrical contact with the first and second lead ends via the conductive shunt. The conductive shunt includes a thick gold layer which is located between and interfaces an adhesion layer and a cap layer wherein the adhesion layer makes direct electrical contact with the aforementioned first and second lead ends.

Abstract: A method of manufacturing includes 2 mushroom plating process starts with an overplated component which includes an enlarged mushroom head having outer portions which overhang a resist layer. The next step in the first process embodiment is a heating step in which the resist layer is hard baked. Thereafter, using a dry etch process, such as a reactive ion etch (RIE) process, the hard baked resist layer is removed in all areas except beneath the overhang of the mushroom head. The area beneath the overhang thereby remains filled with hard baked resist. Thereafter, the device is ultimately encapsulated such that no voids and/or redeposition problems exist under the overhang due to the presence of the hard baked resist. In an alternative process embodiment of the present invention the dry etch process is conducted first upon the resist layer, such that the resist layer is removed in all areas except under the overhang. Thereafter, the device is baked, such that hard baked resist remains beneath the overhang.

Abstract: Methods and apparatus for protecting read sensors from damage caused by electrostatic discharge (ESD) during manufacturing are described. Two electrical connections are formed and utilized for ESD protection: one primarily for early protection of the sensors (i.e. prior to cutting and lapping the wafer to form the ABS) and the other primarily for later protection of the sensors (i.e. after cutting and lapping the wafer to form the ABS). The first electrical connection is created between the read sensor and the first and second shields, and is severed when the wafer is cut and lapped along the ABS. The second electrical connection is formed between the sensor leads and the first and second shields, and is exposed on an outside surface of the magnetic head. The second electrical connection is severed late in the manufacturing process, preferably by laser-deletion.

Abstract: A Damascene process is provided for manufacturing a coil structure for a magnetic head. During the manufacturing process, an insulating layer is initially deposited after which a photoresist layer is deposited. A silicon dielectric layer is then deposited on the photoresist layer. After masking the silicon dielectric layer, at least one channel is etched in the photoresist layer and the silicon dielectric layer. Then, a conductive seed layer is deposited in the at least one channel. The at least one channel is then ready to be filled with a conductive material and chemically/mechanically polished to define a coil structure.

Abstract: Methods of making a read head with improved contiguous junctions are described. After sensor layer materials are deposited over a substrate, a lift-off mask is formed over the sensor layer materials in a central region which is surrounded by end regions. Ion milling is performed with use of the lift-off mask such that the sensor layer materials in the end regions are removed and those in the central region remain to form a read sensor. A high-angle ion mill (e.g. between 45-80 degrees) is then performed to remove redeposited material from side walls of the lift-off mask Next, a reactive ion etch (RIE) is used to reduce the thickness and the width of the lift-off mask and to remove capping layer materials from the top edges of the read sensor.

Abstract: A method of altering the topography of a trailing edge or ABS of a slider is disclosed, the slider having a substrate surface, at least one magnetic recording head on top of the alumina, and an overcoat of a material, preferably SiO2. The steps include first applying an SiO2 overcoat at the wafer level followed by slicing the wafer into rows, then lapping the rows. The rows are then placed on a bias electrode, exposing the trailing edge to a plasma generated from a controlled source in a reactive ion etching process. The plasma is generated using an chemical etchant such as CHF3 and other F-containing compounds, the plasma being generated with a combination of an inert gas such as Argon and the chemical etchant. In the plasma, the electrode is charged to accelerate the plasma ions towards the exposed surface. Reacted material is drawn from the surface of the slider. The SiO2 trailing edge reacts preferentially with the plasma, thus effectuating a change in the trailing edge topography.

Abstract: The electroplated components of a magnetic head of the present invention are fabricated utilizing a seed layer that is susceptible to reactive ion etch removal techniques. A preferred seed layer is comprised of tungsten or titanium. Following the electroplating of the components utilizing a fluorine species reactive ion etch process the seed layer is removed, and significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product. The problem of seed layer redeposition along the sides of the electroplated components is overcome because the gaseous fluoride compound is not redeposited. The present invention also includes an enhanced two part seed layer, where the lower part is tungsten, titanium or tantalum and the upper part is composed of the material that constitutes the component to be electroplated.

Abstract: An electronic lapping guide (ELG) and method of making are provided for precisely lapping a read sensor to a designed air bearing surface (ABS). In the method a sensor material layer is formed on a wafer after which a portion of the sensor material layer is removed and ELG material is deposited therein. This is followed by forming track widths and back edges for each of the ELG and the read sensor to be followed by lapping to the ABS. Various films are employed for the ELG to minimize magnetoresistance and optimize the resistance of the ELG. The resistance of the ELG is then sensed by a computer for controlling a lapping tool to lap to the aforementioned ABS.

Abstract: A multi-layer electrically conductive shunt is located on the exterior surface of a slider in electrical contact and extending between first and second lead ends of leads that are connected to a sensor of a read head. Electrically conductive spaced apart first and second read pads are located on the conductive shunt in electrical contact with the first and second lead ends via the conductive shunt. The conductive shunt includes a thick gold layer which is located between and interfaces an adhesion layer and a cap layer wherein the adhesion layer makes direct electrical contact with the aforementioned first and second lead ends.

Abstract: The induction coil of the magnetic head of the present invention is fabricated in a patterned electrical insulation material, preferably utilizing reactive ion etch (RIE) techniques. The electrical insulation material is particularly patterned such that it is formed away from the ABS surface and in the location of the induction coil. A fill layer is deposited around the patterned electrical insulation material layer, such that the fill layer is disposed at the ABS surface. In a preferred embodiment, the patterned electrical insulation material is initially fabricated from hard baked photoresist and subsequent to the deposition of the fill layer the hard baked photoresist material is removed and replaced by SiO2. The SiO2 is thereby located away from the ABS surface and the induction coil is subsequently fabricated within the SiO2 material.

Abstract: Provided is a reactive ion etching (RIE) method for use in altering the flatness of a slider, whereby a slider or row of sliders is placed within a RIE apparatus. The apparatus comprises essentially an electrode within a chamber having an inlet and an outlet. The electrode is controlled by a bias power source. A source power is provided to the chamber to generate the plasma, wherein a gas or gas mixture is first introduced to the chamber and the source power is adjusted to maximize the plasma composition of ions and reactive neutral species. The ions and reactive neutral species are generated from reactive chemical species such as CHF3 and other F-containing species. An inert gas such as Argon may also be present. Typically, TiC within the Al2O3 matrix of the slider substrate surface is etched at a faster rate than other substrate species.

Abstract: A hard disk drive of the present invention includes a magnetic head having a high aspect ratio induction coil. The magnetic head includes a first pole tip piece that is formed upon a first magnetic pole and a second pole tip piece that is part of the second magnetic pole, where the write gap is formed between the first pole tip piece and the second pole tip piece. The use of the two pole tip pieces increases the spacing between the first magnetic pole layer and the second magnetic pole layer such that an induction coil having high aspect ratio coil turns can be formed within the insulation layers. A reactive ion etch (RIE) process is used to form the coil trenches within which the high aspect ratio coil turns are created. An RIE etch stop layer is formed upon the first magnetic pole layer to prevent the RIE etch process from creating coil turn trenches that make contact with the first magnetic pole layer.

Abstract: The magnetic head of the present invention includes a dual layer induction coil having coil turns that are more accurately and reliably spaced due to the use of reactive ion etching fabrication techniques. Following the fabrication of the first magnetic pole (P1) an etch stop layer is deposited. Thereafter, a layer of an etchable insulation material is deposited, followed by the fabrication of an induction coil etching mask thereon. Utilizing a reactive ion etch process, induction coil trenches are thereafter etched into the etchable insulation material down to the etch stop layer. The first induction coil is then fabricated into the induction coil trenches, preferably utilizing standard electrodeposition techniques. Following a chemical mechanical polishing (CMP) step to remove excess induction coil material and the first induction coil etching mask, a second etch stop layer is deposited upon the first induction coil.

Abstract: The magnetic head includes a P2 pole tip in which the P2 pole tip material is electroplated upon a sidewall of the P2 pole tip photolithographic trench. To accomplish this, a block of material is deposited upon a write gap layer, such that a generally straight, vertical sidewall of the block of material is disposed at the P2 pole tip location. Thereafter, an electroplating seed layer is deposited upon the sidewall. A P2 pole tip trench is photolithographically fabricated such that the sidewall (with its deposited seed layer) is exposed within the P2 pole tip trench. Thereafter, the P2 pole tip is formed by electroplating pole tip material upon the seed layer and outward from the sidewall within the trench, The width of the P2 pole tip is thus determined by the quantity of pole tip material that is deposited upon the sidewall.

Abstract: A magnetic head including a dual layer induction coil. Following the deposition of a first magnetic pole (P1) a first induction coil is fabricated. Following a chemical mechanical polishing (CMP) step a layer of etchable insulation material is deposited followed by the fabrication of a second induction coil etching mask. A reactive ion etch process is then conducted to etch the second induction coil trenches into the second etchable insulation material layer. The etching depth is controlled by the width of the trenches in an aspect ratio dependent etching process step. The second induction coil is next fabricated into the second induction coil trenches, preferably utilizing electrodeposition techniques. Thereafter, an insulation layer is deposited upon the second induction coil, followed by the fabrication of a second magnetic pole (P2) upon the insulation layer.

Abstract: The first and second side surfaces of either a bottom spin valve sensor or a top spin valve sensor are notched so as to enable a reduction in the magnetoresistive coefficient of side portions of the sensor beyond the track width region thereby minimizing side reading by the sensor. The first and second notches of the spin valve sensor are then filled with layers in various embodiments of the invention to complete the spin valve sensor.

Abstract: A magnetic head including a dual layer induction coil fabricated by reactive ion etching (RIE) techniques. An etch stop layer and an etchable insulation material layer and an induction coil etching mask are fabricated on a first magnetic pole. Induction coil trenches are thereafter RIE etched into the insulation material to the etch stop layer, and the first induction coil is fabricated into the induction coil trenches. Following a chemical mechanical polishing (CMP) step, a second etch stop layer, a second layer of etchable insulation material and a second induction coil etching mask are fabricated. Second induction coil trenches are RIE etched into the second insulation material layer to the second etch stop layer, and a second induction coil is fabricated into the second induction coil trenches. A second CMP step is followed by an insulation layer and the fabrication of a second magnetic pole (P2) upon the insulation layer.