Abstract: The invention relates to a method for producing magnetic sliders having a permanent protective coating of carbon over the air bearing surface. The method comprises the steps of: (a) depositing a temporary protective coating on a surface of the slider, the temporary protective coating comprising a layer carbon; (b) depositing a photoresist layer onto the temporary protective coating; (c) imagewise exposing the photoresist layer to radiation; (d) developing the image in the photoresist layer to expose the temporary protective coating; (e) transferring the image through the temporary protective coating and into the slider to form the air bearing pattern in the slider; (f) removing the temporary protective coating using nonreactive plasma; and (g) depositing a permanent protective coating comprising a layer of carbon.

Abstract: The magnetic head of the present invention includes a narrow, high aspect ratio P2 pole tip and a high aspect ratio, fine pitch induction coil. Electroplating trenches for the P2 pole tip and the induction coil are fabricated in a single RIE process step, and the P2 pole tip and the induction coil are thereafter separately plated up into their respective trenches to complete the fabrication of these structures.

Abstract: The invention relates to a magnetic recording device comprising (a) a disk comprising a substrate, a metallic magnetic layer, a carbon layer and a lubricant layer; (b) a motor associated with a disk operable for rotating the disk; (c) a head supported on an air bearing slider for magnetically reading data to or magnetically writing data from the magnetic layer on the disk, the trailing surface of the slider coated with a multilayered film having low surface energy; and (d) an actuator connected to the slider for moving the head across the disk. The multilayered film on the trailing surface of the slider substantially reduces stiction of the slider.

Abstract: To protect the MR read head element from ESD damage during wafer level manufacturing, a lead from the MR element is electrically connected to one or both of the read head element shields during manufacturing. In a preferred embodiment of the present invention, the electrical connection is fabricated in the kerf area between adjacent magnetic heads as they are fabricated upon a wafer substrate. Thereafter, when the magnetic heads are separated by saw cutting through the kerf areas, the electrical connections are thereby removed, such that the MR element electrical leads and the shields are electrically isolated. In an alternative embodiment, one or more of the shields, as well as the MR element leads can also be electrically connected to the substrate upon which the magnetic head is fabricated.

Abstract: The electroplated components of a magnetic head of the present invention are fabricated utilizing a seed layer that is susceptible to reactive ion etch removal techniques. A preferred seed layer is comprised of tungsten or titanium and it is fabricated in a sputter deposition process. The seed layer is electrically conductive and the electroplated components, such as induction coil members and magnetic poles, are effectively electroplated into photolithographically created photoresist trenches that are fabricated upon the seed layer. Following the electroplating of the components, the photoresist layer is removed utilizing a standard wet chemical process to expose the seed layer. Next, utilizing a fluorine species reactive ion etch process the seed layer is removed, and significantly, the fluorine RIE process creates a gaseous tungsten or titanium fluoride compound removal product.

Abstract: The invention relates to a method for producing magnetic sliders having a permanent protective coating of carbon over the air bearing surface. The method comprises the steps of: (a) depositing a protective coating on a surface of the slider, the protective coating comprising an underlayer of carbon and a top layer selected from silicon and titanium; (b) depositing a photoresist layer onto the protective coating; (c) imagewise exposing the photoresist layer to radiation; (d) developing the image in the photoresist layer to expose the protective coating; (e) transferring the image through the protective layer and into the slider to form the air bearing pattern in the slider; and (f) removing the top layer of the protective coating.

Abstract: A first read gap layer has a resistance RG1 between a first shield layer and one of the first and second lead layers of a read head and the second read gap layer has a resistance RG2 between a second shield layer and said one of the first and second lead layers of the read head. A connection is provided via a plurality of resistors between a first node and each of the first and second shield layers wherein the plurality of resistors includes at least first and second resistors RS1 and RS2 and the first node is connected to said one of the first and second lead layers. A second node is located between the first and second resistors RS1 and RS2. An operational amplifier has first and second inputs connected to the first and second nodes respectively so as to be across the first resistor RS1 and has an output connected to the first node for maintaining the first and second nodes at a common voltage potential. In a first embodiment the first and second shield layers are shorted together.

Abstract: The method for controlling the depth of polishing during a CMP process involves the deposition of a polishing stop layer at an appropriate point in the device fabrication process. The stop layer is comprised of a substance that is substantially more resistant to polishing with a particular polishing slurry that is utilized in the CMP process than a polishable material layer. Preferred stop layer materials of the present invention are tantalum and diamond-like carbon (DLC), and the polishable layer may consist of alumina. In one embodiment of the present invention the stop layer is deposited directly onto the top surface of components to be protected during the CMP process. A polishable layer is thereafter deposited upon the stop layer, and the CMP polishing step removes the polishable material layer down to the portions of the stop layer that are deposited upon the top surfaces of the components. The stop layer is thereafter removed from the top surface of the components.

Abstract: To protect the MR read head element from ESD damage during wafer level manufacturing, a lead from the MR element is electrically connected to one or both of the read head element shields during manufacturing. In a preferred embodiment of the present invention, the electrical connection is fabricated in the kerf area between adjacent magnetic heads as they are fabricated upon a wafer substrate. Thereafter, when the magnetic heads are separated by saw cutting through the kerf areas, the electrical connections are thereby removed, such that the MR element electrical leads and the shields are electrically isolated. In an alternative embodiment, one or more of the shields, as well as the MR element leads can also be electrically connected to the substrate upon which the magnetic head is fabricated.

Abstract: A magnetic transducer including an electrically conductive shield (ECS) which is disposed between the substrate and first magnetic shield is described. The ECS is preferably embedded in an insulating undercoat layer. The ECS is preferably electrically isolated from the magnetic sensor element and is externally connected to a ground available in the disk drive through the arm electronics. Two alternative ways for connecting the ECS to a ground are described. In one embodiment which is only effective with single-ended input type arm electronics, the ECS is connected to a ground through a via to a lead pad for the read head which is connected to the ground of the arm electronics. In a second and more preferred embodiment a separate lead pad is included on the head to allow the ECS to be connected to electronic or case ground when the head is installed in the arm. The extent of the ECS should be sufficiently large to cover the read head portion of the transducer, i.e.

Abstract: A method is provided for making a well-defined, highly-predictable chevron type MR sensor for a read head. A first material is selected for a first gap layer. A selected second material is deposited on the first gap layer followed by a resist frame that has elongated openings exposing elongated top portions of the first gap layer that extend at an acute angle to a head surface of the read head. A selected reactive ion etch (RIE) is employed to etch away the exposed portions of the second material layer down to the first material of the first gap layer. The material of the second material layer is chosen to be etched by the RIE while the material of the first gap layer is chosen not to be etched by the RIE. An example is Al2O3 for the first gap layer, SiO2 for the second material layer and a RIE that is fluorine based. The resist frame is removed leaving elongated strips of the second material layer extending at the aforementioned angle to the head surface.

Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: A hard disk drive of the present invention includes a magnetic head having a high aspect ratio induction coil. The magnetic head includes a first pole tip piece that is formed upon a first magnetic pole and a second pole tip piece that is part of the second magnetic pole, where the write gap is formed between the first pole tip piece and the second pole tip piece. The use of the two pole tip pieces increases the spacing between the first magnetic pole layer and the second magnetic pole layer such that an induction coil having high aspect ratio coil turns can be formed within the insulation layers. A reactive ion etch (RIE) process is used to form the coil trenches within which the high aspect ratio coil turns are created. An RIE etch stop layer is formed upon the first magnetic pole layer to prevent the RIE etch process from creating coil turn trenches that make contact with the first magnetic pole layer.

Abstract: A fabrication method using a bottom anti-reflective coating (BARC) eliminating deleterious effects of unwanted reflected light during the photo exposure step of a photolithographic process. The BARC coating comprises a carbon coating having a thickness of 300 angstroms, deposited by a carbon ion beam deposition tool, and an initial silicon BARC coating layer having thickness of 20 angstroms deposited before the carbon coating. Where the BARC layer is utilized in a photolithographic NiFe pole tip fabrication process, a NiFe seed layer is first deposited upon a substrate. The BARC layer is then formed on the NiFe seed layer and the pole tip trench is then photolithographically created. Thereafter, the BARC layer is removed from the bottom of the trench, utilizing a reactive ion etch process, exposing the NiFe seed layer. The NiFe pole tip is then fabricated into the trench, and any remaining photoresist and BARC layer are removed.

Abstract: A read/write head is provided with an embedded planar dual coil write structure. The head includes generally parallel shield, shield/pole, and pole layers. The shield/pole layer abuts a generally coplanar planarization layer in one embodiment. A circuitous recess is defined in the shield/pole and planarization layer, spanning the junction twice and encircling a central hub of adjoining shield/pole and planarization layer material. A write structure is located in the recess, with the shield/pole layer, planarization layer, and embedded write structure forming a substantially flat surface for building the pole layer. The write structure includes first and second substantially co-planar multi-turn flat coils, where turns of the first write coil are interspersed with turns of the second write coil. The first and second write coils reside in the circuitous recess, winding around the central hub. An insulating material separates the first and second coils.

Abstract: A method is provided for forming a final second pole tip of a write head wherein the final second pole tip is bounded in part by a final top and final first and second side walls, the final first and second side walls being separated by a final track width at an air bearing surface (ABS). The method includes the steps of forming a preliminary second pole tip that is bounded in part by the final top and preliminary first and second side walls. The preliminary first and second side walls are separated by a preliminary width at the ABS that is wider than the final track width. Next, a non-magnetic sacrificial layer is formed on the final top of the preliminary second pole tip. Ion beam milling is then employed for milling the preliminary first and second side walls to form the final second pole tip with the final first and second side walls separated by the final track width with at least a portion of the sacrificial layer remaining on the final top of the final second pole tip.

Abstract: A read sensor with self-aligned low resistance leads and a method of making are provided. In the method a masking step has been eliminated by employing first, second and third protective capping layers in the construction of the read sensor and first and second lead layers. The first capping layer serves as a protective layer for the read sensor sites, the second capping layer protects low resistance lead layer portions during removal of the first capping layer from high resistance lead layer sites and then serves as a sacrificial layer during removal of spin valve material from the low resistance lead layer sites. The third capping layer protects the first and second lead layers during milling of low resistance lead layer material in field regions about the read sensor and first and second lead layers. The method aligns front edges of the low resistance lead layer portions with a rear edge of the read sensor so as to lower the overall resistance of the lead layers.

Abstract: The back end of an MR sensor and a flux guide are joined by a contiguous self-aligned junction so that a predictable overlap of the flux guide on the back end of the MR sensor can be achieved for optimizing signal flux density in the MR sensor. Lead/longitudinal bias layers for the MR sensor are also joined by a contiguous selfaligned junction to the flux guide for stabilizing the flux guide. By employing a single lift off resist mask the MR sensor and the lead/longitudinal bias layers can be patterned followed by deposition of the flux guide. The flux guide is a bilayer of an insulation material layer and a flux guide material layer. The insulation material layer is sandwiched between the MR sensor and the flux guide material layer and between the lead/longitudinal bias layers and the flux guide material layer. A heat guide or combined flux guide and heat guide may be substituted for the aforementioned flux guide.

Abstract: A write head has a second pole tip layer, a coil layer and a write coil insulation layer that are planarized at their top surfaces. A thin top insulation layer insulates the top of the coil layer from a yoke portion of the second pole piece which is connected to the second pole tip layer in the pole tip region and connected to a first pole piece layer in a back gap region. In a preferred embodiment the write gap layer extends throughout the yoke region and provides the only insulation between the first pole piece layer and the coil layer. Further, it is preferred that the write coil insulation layer be an inorganic material such as silicon dioxide (SiO2). Several embodiments of the write head are provided along with novel methods of making.

Abstract: A read sensor with self-aligned low resistance leads and a method of making are provided. In the method a masking step has been eliminated by employing first, second and third protective capping layers in the construction of the read sensor and first and second lead layers. The first capping layer serves as a protective layer for the read sensor sites, the second capping layer protects low resistance lead layer portions during removal of the first capping layer from high resistance lead layer sites and then serves as a sacrificial layer during removal of spin valve material from the low resistance lead layer sites. The third capping layer protects the first and second lead layers during milling of low resistance lead layer material in field regions about the read sensor and first and second lead layers. The method aligns front edges of the low resistance lead layer portions with a rear edge of the read sensor so as to lower the overall resistance of the lead layers.