Abstract: An isolated gate driver has a first portion in a first voltage domain and a second portion in a second voltage domain. The first and second portions are coupled by an isolation communication channel. The isolated gate driver transmits across the isolation communication channel a serial word containing first drive strength information and simultaneously transmits gate information with the serial word across the isolation communication channel. The gate information indicates a state of a gate signal for a transistor coupled to the second portion of the isolated gate driver. A demodulator circuit demodulates a signal containing the gate information and the drive strength information transmitted across the isolation communication channel in the serial word. A gate signal output circuit coupled to the demodulator circuit supplies the gate signal based on the gate information with a drive strength of the gate signal being based on the drive strength information.

Abstract: A method, a system, and a computer program product for decompressing data. One or more compressed blocks in a set of stored compressed blocks responsive to a request to access data in the set of stored compressed blocks are identified. String prefixes inside the identified compressed blocks are decompressed using front coding. String suffixes inside the identified compressed blocks are decompressed using a re-pair decompression. Uncompressed data is generated.

Abstract: Various embodiments provide systems and methods for providing security in a ZTNA system.

Abstract: A device comprises a substrate and an IC die, which may be a photonic IC. The substrate comprises a first surface, a second surface opposite the first surface, an optical waveguide integral with the substrate, and a hole extending from the first surface to the second surface. The hole comprises a first sidewall. The optical waveguide is between the first surface and the second surface, parallel to the first surface, and comprises a first end which extends to the first sidewall. The IC die is within the hole and comprises a second sidewall and an optical port at the second sidewall. The second sidewall is proximate to the first sidewall and the first end of the optical waveguide is proximate to and aligned with the optical port. The substrate may include a recess to receive another device comprising a socket.

Abstract: Systems and methods for remote monitoring of a Security Operations Center (SOC) via a mobile application are provided. According to one embodiment, a management service retrieves information regarding multiple network elements that are associated with an enterprise network and extracts parameters of the monitored network elements from the retrieved information. The management service prioritizes the monitored network elements by determining a severity level associated with security-related issues of the network elements and generates various monitoring views that summarize in real time various categories of potential security-related issues detected by the SOC. Further, the management service assigns a priority to each monitoring view and displays a video on the display device that cycles through monitoring views in accordance with their respective assigned priorities.

Abstract: Various embodiments provide systems and methods for automating an SD-WAN setup process.

Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a substrate and a conductive feature over the substrate. In an embodiment, a metallic mask is positioned over the conductive feature. In an embodiment, the metallic mask extends beyond a first edge of the conductive feature and a second edge of the conductive feature.

Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).

Abstract: Systems, techniques, and devices are described that may be used in a minimally invasive bone realignment procedure. In some examples, a method of performing a minimally invasive metatarsal correction procedure involves using a bone preparation guide having a guide surface with a length less than a diameter of a bone to be cut using the guide surface. The clinician can guide a bone preparation instrument along the guide surface and angle the bone preparation instrument beyond one or both ends of the guide surface to cut the end of the underlying bone beyond one or both of the ends.

Abstract: In some implementations, a reliability modeler may receive a plurality of webpages associated with a first entity from an Internet scraping device. The reliability modeler may detect, within the plurality of webpages, at least one of a logo, a font, or a color. The reliability modeler may apply a model, trained on a set of guidelines associated with the first entity, to the logo, the font, or the color. Accordingly, the reliability modeler may determine, based on output from the model, that the plurality of webpages are unlikely to be authorized by the first entity. The reliability modeler may transmit, to a user device, an alert based on determining that the plurality of webpages are unlikely to be associated with the first entity.

Abstract: In some implementations, an augmented reality (AR) device may receive first images representing a webpage, an email, a product, or a store associated with a first entity. The AR device may detect, within the first images, a logo, a font, and/or a color. The AR device may apply a model, trained on a set of guidelines associated with the first entity, to the logo, the font, and/or the color. Accordingly, the AR device may receive, from the model, a first score associated with the webpage, the email, the product, or the store. The AR device may transmit an alert based on the first score. In some implementations, the AR device may further receive second images and apply the model to receive a second score associated with the webpage, the email, the product, or the store. Accordingly, the AR device may transmit an additional alert based on the second score.

Abstract: An orthopedic implant system can be used to fixate two bones (e.g., to portions of a single bone) relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: A computer-implemented method, system, and computer program product are provided. A processor defines and stores units of image data of a container image, where the units of image data are compressible. A processor represents the units as nodes in a dependency graph for a container image, including one or more nodes at a dependency level in the dependency graph.

Abstract: An orthopedic implant system can be used to fixate two bones (e.g., to portions of a single bone) relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: Aspects of the subject disclosure may include, for example, obtaining first data pertaining to an outage in a first portion of a communications system, obtaining second data pertaining to a relationship between the first portion of the communications system and a second portion of the communications system, analyzing the first data the second data to identify a risk to communication services facilitated by the second portion of the communications system, determining that the risk is greater than a threshold, and generating, based on the determining, a recommendation for reducing the risk. Other embodiments are disclosed.

Abstract: An orthopedic implant system can be used to fixate two vertebral bones relative to each other during a surgical procedure. In some configurations, the implant system includes a staple having at least two legs separated by a bridge. The staple can include at least two couplings on either side of the bridge accessible through a top surface of the staple connectable to two corresponding coupling shafts. The coupling shafts can attach through the top surface of the staple without extending below an underside of the staple. The coupling shafts can be used to bias the at least two legs of the staple away from each other for insertion into holes formed into two bones. By attaching the coupling shafts through the top of the staple, the staple can be inserted flush with the two bones before releasing the shafts.

Abstract: Embodiments include an electronic package with an embedded multi-interconnect bridge (EMIB) and methods of making such packages. Embodiments include a first layer, that is an organic material and a second layer disposed over the first layer. In an embodiment, a cavity is formed through the second layer to expose a first surface of the first layer. A bridge substrate is in the cavity and is supported by the first surface of the first layer. Embodiments include a first die over the second layer that is electrically coupled to a first contact on the bridge substrate, and a second die over the second layer that is electrically coupled to a second contact on the bridge substrate. In an embodiment the first die is electrically coupled to the second die by the bridge substrate.

Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, a method for forming an IC package support may include forming a first dielectric material having a surface; forming a first conductive via in the first dielectric material, wherein the first conductive via has tapered sidewalls with an angle that is equal to or less than 80 degrees relative to the surface of the first dielectric material; forming a second dielectric material, having a surface, on the first dielectric material; and forming a second conductive via in the second dielectric material, wherein the second conductive via is electrically coupled to the first conductive via, has tapered sidewalls with an angle that is greater than 80 degrees relative to the surface of the second dielectric material, and a maximum diameter between 2 microns and 20 microns.

Abstract: A method of controlling aphid pests including exposing the aphid pests on a host plant to a pest-controlling effective amount of a compound of formula (I):

Abstract: Various embodiments provide systems and methods for automatically defining and enforcing network sessions based upon at least four dimensions of segmentation.