Patents by Inventor Robert A. May

Robert A. May has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200319660
    Abstract: A power supply control system includes a power supply controller configured to selectively supply electrical power to a venue; and a booking controller located remotely from the venue, the booking controller configured to maintain third party booking information, wherein the power supply controller is configured to control the supply of electrical power based on the third party booking information. A power supply controller and booking controller for the power supply control system are also provided.
    Type: Application
    Filed: April 1, 2020
    Publication date: October 8, 2020
    Applicant: Pirate Studios Limited
    Inventor: Robert May
  • Patent number: 10798061
    Abstract: Systems and methods for automated learning of externally defined network assets by a network security device are provided. According to one embodiment, updated information for a network asset associated with a private network is received by a network security device from an external asset management device associated with the private network. The updated information includes a change in a definition or an attribute of the network asset. The existence of a current definition and attribute information for the network asset is determined by the network security device. The current definition and attribute information is dynamically updated based on the updated information by the network security system within a run-time representation of security policy rules within a kernel of a network security operating system without disrupting on-going application of one or more security policy rules defined for the network asset to network traffic directed to or originated by the network asset.
    Type: Grant
    Filed: March 26, 2018
    Date of Patent: October 6, 2020
    Assignee: Fortinet, Inc.
    Inventors: Robert A. May, Mathieu Nantel
  • Patent number: 10791146
    Abstract: Systems and methods are described for analysing, sharing and comparing security configurations. According to one embodiment, a security metric for a network segment of a private network is generated based on determination and analysis of network assets, network topology, and one or more defined security criteria representing security features being implemented by one or more network security devices that form part of the network segment, wherein the scoring metric is a quantitative representation of protection level and/or exposure level of the network segment. In an embodiment, the security metric can be shared and compared with security metrics of other network segments.
    Type: Grant
    Filed: March 28, 2018
    Date of Patent: September 29, 2020
    Assignee: Fortinet, Inc.
    Inventors: Michael Xie, Robert A. May
  • Publication number: 20200303309
    Abstract: Embodiments disclosed herein include electronic packages for PoINT architectures. Particularly, embodiments include electronic packages that include reinforcement substrates to minimize warpage. In an embodiment, an electronic package comprises, a reinforcement substrate, a plurality of through substrate vias through the reinforcement substrate, a dielectric substrate over the reinforcement substrate, a cavity into the dielectric substrate, and a component in the cavity.
    Type: Application
    Filed: March 18, 2019
    Publication date: September 24, 2020
    Inventors: Robert SANKMAN, Robert MAY
  • Publication number: 20200304533
    Abstract: Systems and methods for a security rating framework that translates compliance requirements to corresponding desired technical configurations to facilitate generation of security ratings for network elements is provided. According to one embodiment, a host network element executes a collection of security checks on at least a first network element. The execution is performed by receiving configuration data of the first network element pertaining to each security check of the collection of security checks in response to a request by the host network element and validating each security check by comparing the received configuration data pertaining to each security check with a pre-defined or configurable network security configuration recommendation to generate a compliance result. Further, the host network element generates a compliance report by aggregating the compliance results obtained by executing each security check of the collection of security checks.
    Type: Application
    Filed: March 19, 2019
    Publication date: September 24, 2020
    Applicant: Fortinet, Inc.
    Inventors: Robert A. May, Tarlok Birdi
  • Publication number: 20200286847
    Abstract: A patch structure of an integrated circuit package comprises a core having a first side facing downwards and a second side facing upwards. Forming a first solder resist (SR) layer on the first side of the core, wherein the first SR layer comprises a first layer interconnect (FLI) and has a first set of one or more microbumps thereon to bond to one or more logic die. Forming a second solder resist (SR) layer on the second side of the core, wherein the second SR layer has a second set of one or more microbumps thereon to bond with a substrate. One or more bridge dies includes a respective sets of bumps, wherein the one or more bridge dies is disposed flipped over within the core such that the respective sets of bumps face downward and connect to the first set of one or more microbumps in the FLI.
    Type: Application
    Filed: January 12, 2018
    Publication date: September 10, 2020
    Inventors: Changhua LIU, Xiaoying GUO, Aleksandar ALEKSOV, Steve S. CHO, Leonel ARANA, Robert MAY, Gang DUAN
  • Publication number: 20200258800
    Abstract: Embodiments disclosed herein include electronic packages and methods of forming such packages. In an embodiment, the electronic package comprises a substrate and a conductive feature over the substrate. In an embodiment, a metallic mask is positioned over the conductive feature. In an embodiment, the metallic mask extends beyond a first edge of the conductive feature and a second edge of the conductive feature.
    Type: Application
    Filed: February 12, 2019
    Publication date: August 13, 2020
    Inventors: Jeremy ECTON, Oscar OJEDA, Leonel ARANA, Suddhasattwa NAD, Robert MAY, Hiroki TANAKA, Brandon C. MARIN
  • Patent number: 10727185
    Abstract: An apparatus is provided which comprises: a plurality of first conductive contacts having a first pitch spacing on a substrate surface, a plurality of second conductive contacts having a second pitch spacing on the substrate surface, and a plurality of conductive interconnects disposed within the substrate to couple a first grouping of the plurality of second conductive contacts associated with a first die site with a first grouping of the plurality of second conductive contacts associated with a second die site and to couple a second grouping of the plurality of second conductive contacts associated with the first die site with a second grouping of the plurality of second conductive contacts associated with the second die site, wherein the conductive interconnects to couple the first groupings are present in a layer of the substrate above the conductive interconnects to couple the second groupings. Other embodiments are also disclosed and claimed.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: July 28, 2020
    Assignee: Intel Corporation
    Inventors: Aleksandar Aleksov, Adel A. Elsherbini, Kristof Darmawikarta, Robert A. May, Sri Ranga Sai Boyapati
  • Publication number: 20200236144
    Abstract: Systems and methods for implementing a cooperative security fabric (CSF) protocol are provided. According to one embodiment, an NSD of multiple NSDs participates in the dynamic construction of a CSF interconnecting the NSDs in a form of a tree, having multiple nodes each representing one of the NSDs, based on hierarchical interconnections between the NSD and directly connected upstream and downstream NSDs. A communication channel is established by a backend daemon of the NSD with a directly connected upstream node of the NSD within the CSF through which queries and replies are communicated and through which periodic keep-alive messages and responses are exchanged between the upstream node and the NSD. A CSF protocol is enforced by a forward daemon of the NSD that limits issuance of query messages to those originated by a source NSD representing an upstream node and directed to a destination NSD representing a downstream node.
    Type: Application
    Filed: March 30, 2020
    Publication date: July 23, 2020
    Applicant: Fortinet, Inc.
    Inventors: Michael Xie, Robert A. May, Xiadong Xu, Yong Wang, Jordan E. Thompson, Shenghe Wang
  • Patent number: 10686839
    Abstract: Systems and methods for implementing a cooperative security fabric (CSF) protocol are provided. According to one embodiment, a CSF of multiple network security devices (NSDs) deployed within a protected network is constructed in a form of a tree, having a root node, one or more intermediate nodes and one or more leaf nodes, based on hierarchical interconnections among the NSDs by determining a relative upstream or downstream relationship among each NSD. Backend daemons of the NSDs establish and maintain a bi-directional tunnel between each parent node within the CSF and its respective child nodes through which queries and replies are communicated and through which periodic keep-alive messages and responses are exchanged. Forward daemons of the NSDs enforce a CSF protocol that limits the issuance of query messages to those originated by an upstream node within the CSF and directed to a downstream node within the CSF.
    Type: Grant
    Filed: December 27, 2017
    Date of Patent: June 16, 2020
    Assignee: Fortinet, Inc.
    Inventors: Michael Xie, Robert A. May, Xiadong Xu, Yong Wang, Jordan E. Thompson, Shenghe Wang
  • Publication number: 20200176355
    Abstract: A semiconductor device package structure is provided, which includes a substrate, one or more dies coupled to the substrate, and a heat pipe device. In an example, the heat pipe device may include a conduit that is at least partially embedded within the substrate. The heat pipe device may have a first region coupled to the one or more dies. In an example, the conduit may include a first path for flow of vapor from the first region to an opposing second region. The conduit may further include a second path for flow of liquid from the second region to the first region.
    Type: Application
    Filed: December 4, 2018
    Publication date: June 4, 2020
    Applicant: Intel Corporation
    Inventors: Robert A. May, Kristof Darmawikarta, Rahul Jain, Lilia May, Maroun Moussallem, Prithwish Chatterjee
  • Publication number: 20200135679
    Abstract: Embodiments described herein include electronic packages and methods of forming such packages. An electronic package includes a package substrate, first conductive pads formed over the package substrate, where the first conductive pads have a first surface area, and second conductive pads over the package substrate, where the second conductive pads have a second surface area greater than the first surface area. The electronic package also includes a solder resist layer over the first and second conductive pads, and a plurality of solder resist openings that expose one of the first or second conductive pads. The solder resist openings of the electronic package may include conductive material that is substantially coplanar with a top surface of the solder resist layer. The electronic package further includes solder bumps over the conductive material in the solder resist openings, where the solder bumps have a low bump thickness variation (BTV).
    Type: Application
    Filed: October 31, 2018
    Publication date: April 30, 2020
    Inventors: Kristof DARMAWAIKARTA, Robert MAY, Sashi KANDANUR, Sri Ranga Sai BOYAPATI, Srinivas PIETAMBARAM, Steve CHO, Jung Kyu HAN, Thomas HEATON, Ali LEHAF, Ravindranadh ELURI, Hiroki TANAKA, Aleksandar ALEKSOV, Dilan SENEVIRATNE
  • Publication number: 20200118917
    Abstract: The present disclosure is directed to systems and methods for providing a dielectric layer on a semiconductor substrate capable of supporting very high density interconnects (i.e., ?100 IO/mm). The dielectric layer includes a maleimide polymer in which a thiol-terminated functional group crosslinks with an epoxy resin. The resultant dielectric material provides a dielectric constant of less than 3 and a dissipation factor of less than 0.001. Additionally, the thiol functional group forms coordination complexes with noble metals present in the conductive structures, thus by controlling the stoichiometry of epoxy to polyimide, the thiol-polyimide may beneficially provide an adhesion enhancer between the dielectric and noble metal conductive structures.
    Type: Application
    Filed: May 12, 2017
    Publication date: April 16, 2020
    Applicant: Intel Corpooration
    Inventors: Robert A. MAY, Andrew J. BROWN, Sri Ranga Sai BOYAPATI, Kristof DARMAWIKARTA
  • Publication number: 20200093978
    Abstract: An ophthalmic irrigator-aspirator has a handpiece with aspiration and irrigation openings through its distal end. A tip component connects to the handpiece and has an aspiration cannula. A flexible sleeve has an annular hub for watertight connection to the handpiece or a base portion of the tip. The sleeve has an intermediate portion that forms a channel for an irrigation fluid along the exterior of the cannula to an irrigation port in the sleeve. The distal end portion of the sleeve is sized for a watertight connection over the distal portion of the cannula. Such distal end portion of the sleeve has an aspiration port in communication with the cannula aspiration port. The sleeve proximate, intermediate, and distal portions are integral with each other and are formed of a resilient material that allows the sleeve to be tightly fitted on the handpiece or tip base portion and the cannula.
    Type: Application
    Filed: August 30, 2019
    Publication date: March 26, 2020
    Inventors: Kenneth J. Wiljanen, Robert May, Lawrence Laks
  • Publication number: 20200094433
    Abstract: An attachable rolling plate assembly which is attached as a single unit to a portable cutting tool to facilitate the safe rolling movement of the portable cutting tool on a workpiece. The invention comprises a frame assembly formed from a single piece of molded material such as fiber enriched high-impact nylon having a pair of oppositely disposed longitudinal sidewalls and a flat base portion having an opening through which a saw blade of a power saw extends. The invention also includes a cutting guide assembly to facilitate a straight cut, reduce torsional rotation of the saw blade and reduce kickback of the saw. A water spray hose is retained to spray water in front of a saw blade of a retained worm drive power saw.
    Type: Application
    Filed: November 26, 2019
    Publication date: March 26, 2020
    Applicant: CircSaw Technologies LLC
    Inventors: Eric Knight, Robert May
  • Publication number: 20200086521
    Abstract: An attachable rolling plate assembly which is attached as a single unit to a portable cutting tool to facilitate the safe rolling movement of the portable cutting tool on a workpiece. The invention comprises a frame assembly formed from a single piece of molded material such as fiber enriched high-impact nylon having a pair of oppositely disposed longitudinal sidewalls and a flat base portion having an opening through which a saw blade of a power saw extends. The invention also includes a cutting guide assembly to facilitate a straight cut, reduce torsional rotation of the saw blade and reduce kickback of the saw. A water spray hose is retained to spray water in front of a saw blade of a retained sidewinder power saw.
    Type: Application
    Filed: November 25, 2019
    Publication date: March 19, 2020
    Applicant: CircSaw Technologies LLC
    Inventors: Eric Knight, Robert May
  • Patent number: 10594708
    Abstract: Systems and methods for optimizing system resources by selectively enabling various scanning functions of a network security device are provided. According to one embodiment, information specifying a set of reputable websites deemed to be trustworthy by one or more web filtering services is received by a network security device protecting a private network. One or more directives are received by the network security device from a network administrator via a GUI of the network security device identifying one or more security features that are to be disabled for the set of reputable websites. Network traffic is intercepted by the network security device from an external network. When it is determined by the network security device that the external network is among the set of reputable websites, the network security device foregoes application of the one or more identified security features to the network traffic.
    Type: Grant
    Filed: April 12, 2018
    Date of Patent: March 17, 2020
    Assignee: Fortinet, Inc.
    Inventor: Robert A. May
  • Publication number: 20200046916
    Abstract: A refill assembly for use in a medicinal inhaler, the refill assembly being configured to be removably coupled to a reusable assembly of a medicinal inhaler, the refill assembly comprising: a patient port; a canister actuable by the reusable assembly to deliver a dose of medicament to the patient port, a sleeve which is selectively actuable by a user independently of the reusable assembly so as to act on the canister to deliver a dose of medicament, the sleeve having a first position in which the sleeve cannot be actuated to cause a dose of medicament to be released from the canister and a second position in which the sleeve is actuable to cause a dose of medicament to be delivered to the patient port; the refill assembly further comprising: an override element which engages the sleeve, the override element being moveable from a first position in which the sleeve is retained in its first position by the override element and a second position in which the sleeve is permitted to move to its second position upon
    Type: Application
    Filed: April 25, 2018
    Publication date: February 13, 2020
    Inventors: Robert May, David M. Molony, Iain G. McDerment
  • Publication number: 20190383599
    Abstract: A method for determining the thickness of a plurality of coating layers, the method comprising: performing a calibration analysis on calibration data to determine initial values and search limits of optical parameters of said plurality of coating layers, irradiating the said plurality of layers with a pulse of THz radiation, said pulse comprising a plurality of frequencies in the range from 0.01 THz to 10 THz; detecting the reflected radiation to produce a sample response said sample response being derived from the reflected radiation; producing a synthesised waveform using the optical parameters and predetermined initial thicknesses of said layers; and varying said thicknesses and varying said optical parameters within the said search limits to minimise the error measured between the sample response and the synthesised waveform; and outputting the thicknesses of the layers.
    Type: Application
    Filed: January 26, 2018
    Publication date: December 19, 2019
    Inventors: Ian Stephen Gregory, Robert May, Daniel James
  • Publication number: 20190371621
    Abstract: Disclosed herein are integrated circuit (IC) package supports and related apparatuses and methods. For example, in some embodiments, an IC package support may include a non-photoimageable dielectric, and a conductive via through the non-photoimageable dielectric, wherein the conductive via has a diameter that is less than 20 microns. Other embodiments are also disclosed.
    Type: Application
    Filed: June 5, 2018
    Publication date: December 5, 2019
    Applicant: Intel Corporation
    Inventors: Kristof Kuwawi Darmawikarta, Robert May, Sri Ranga Sai Boyapati, Srinivas V. Pietambaram, Chung Kwang Christopher Tan, Aleksandar Aleksov