Abstract: An industrial roll includes: a substantially cylindrical shell having an outer surface; a polymeric cover circumferentially overlying the shell outer surface; and a sensing system. The sensing system includes: a plurality of sensors embedded in the cover, each sensor configured to sense a data parameter; and a plurality of wireless transceivers, each transceiver connected to a respective sensor and embedded in the cover adjacent thereto. Each wireless transceiver is configured to transmit data signals from the respective sensor. Related methods and systems are also discussed.

Abstract: Information handling system (IHS) personalization includes receiving a request for a replacement IHS. A plurality of customer IHS data is then collected. The plurality of customer IHS data is transferred to the replacement IHS during the manufacture of the replacement IHS. The replacement IHS is then provided to a user of the customer IHS data.

Abstract: An industrial roll includes: a substantially cylindrical shell having an outer surface; a polymeric cover circumferentially overlying the shell outer surface; and a sensing system. The sensing system includes: a plurality of sensors embedded in the cover, each sensor configured to sense a data parameter; and a plurality of wireless transceivers, each transceiver connected to a respective sensor and embedded in the cover adjacent thereto. Each wireless transceiver is configured to transmit data signals from the respective sensor. Related methods and systems are also discussed.

Abstract: An industrial roll includes: a substantially cylindrical shell having an outer surface; a polymeric cover circumferentially overlying the shell outer surface; and a sensing system. The sensing system includes: a plurality of sensors embedded in the cover, each sensor configured to sense a data parameter; and a plurality of wireless transceivers, each transceiver connected to a respective sensor and embedded in the cover adjacent thereto. Each wireless transceiver is configured to transmit data signals from the respective sensor. Related methods and systems are also discussed.

Abstract: An in-situ interferometer includes an image modifying optic that produces light ray bundles. The light ray bundles are projected onto a reticle with a plurality of measurement fiducials encoded onto a face of the reticle. The measurement fiducials are exposed onto a sensing plane and their locations measured. Aberrations in the projection system are determined from the measurements of the exposed reticles.

Abstract: According to some embodiments of the present invention, a system for determining characteristics of two rolls configured in a nip press includes a strip configured to be placed in the nip press. A plurality of sensors embedded in the strip is configured to generate signals representative of the pressure and/or the nip width between the two rolls. Interface circuitry facilitates addressing of individual ones of the plurality of sensors via a data processing system.

Abstract: A wafer stage overlay error map is created using standard overlay targets and a special numerical algorithm. A reticle including a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic exposure tool. After exposure, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then supplied to a software program that generates a 2-dimensional wafer stage distortion and yaw overlay error map.

Abstract: An ink jet cartridge which includes an ink jet housing including a first valve and a primer portion coupled to the ink jet housing and covering the first valve is disclosed The primer portion includes a priming bulb and a second valve in the priming bulb, air flowing into the ink jet housing via the first bulb when the priming valve is actuated, air flowing into the priming portion via the second valve when the priming bulb is released.

Abstract: An apparatus and method for manufacturing and using a calibrated registration reference wafer in a semiconductor manufacturing facility where an archive media includes etched alignment attributes. Exposing a pattern of complementary alignment attributes onto the archive media such that the pattern of complementary alignment attributes overlay and interlock with the etched alignment attributes thereby forming completed alignment attributes. Then, measuring offsets in the completed alignment attributes and constructing a calibration file for the archive media based upon the offset measurements and other characteristic data of the exposure tool.

Abstract: A wafer stage overlay error map is created using standard overlay targets and a special numerical algorithm. A reticle including a 2-dimensional array of standard overlay targets is exposed several times onto a photoresist coated silicon wafer using a photolithographic exposure tool. After exposure, the overlay targets are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is then supplied to a software program that generates a 2-dimensional wafer stage distortion and yaw overlay error map.

Abstract: An apparatus and method for the simultaneous determination of focus and source boresighting error for photolithographic steppers and scanners is described. A reticle containing custom arrays of box-in-box test structures specifically designed for performing source or exit pupil division using an aperture plate is exposed onto a resist coated wafer several times. The resulting exposure patterns are measured with a conventional overlay tool. The overlay data is processed with a slope-shift algorithm for the simultaneous determination of both focus and source telecentricity as a function of field position. Additionally, methods for ameliorating metrology induced effects and methods for producing precision Bossung curves are also described. This Abstract is provided for the sole purpose of complying with the Abstract requirement rules, it shall not be used to interpret or to limit the scope or the meaning of the claims.

Abstract: Oxazole derivatives, which are useful as VEGFR2, CDK2, and CDK4 inhibitors are described herein. The described invention also includes methods of making such oxazole derivatives as well as methods of using the same in the treatment of hyperproliferative diseases.

Abstract: An automatically adjustable locking pliers or tool includes a jaw fixed to a first handle and a jaw that pivots about the first handle. The pivoting jaw is connected to a lower tightening handle. A lever connects the tightening handle and first handle. A self-adjusting sizing and locking mechanism includes a thumb jaw sizing piece located near the jaws and movable to open the jaws so that they can be sized around a workpiece. When the thumb jaw sizing piece is released, the jaws automatically size and clamp lightly around the workpiece. The locking mechanism uses balls between a locking rod and a tapered surface. Locking occurs when the balls wedge between the rod and the tapered surface. A release cylinder is connected to a release paddle movable to unlock the mechanism. The sizing piece and locking mechanism are operable to automatically size and lock the pliers or tool.

Abstract: An apparatus and method for manufacturing and using a calibrated registration reference wafer in a semiconductor manufacturing facility where an archive media includes etched alignment attributes. Exposing a pattern of complementary alignment attributes onto the archive media such that the pattern of complementary alignment attributes overlay and interlock with the etched alignment attributes thereby forming completed alignment attributes. Then, measuring offsets in the completed alignment attributes and constructing a calibration file for the archive media based upon the offset measurements and other characteristic data of the exposure tool.

Abstract: A process for the determination of focal plane deviation uniquely due to the scanning dynamics associated with a photolithographic scanner is described. A series of lithographic exposures is performed on a resist coated silicon wafer using a photolithographic scanner. The lithographic exposures produce an array of focusing fiducials that are displaced relative to each other in a unique way. The resulting measurements are fed into a computer algorithm that calculates the dynamic scanning field curvature in an absolute sense in the presence of wafer height variation and other wafer/reticle stage irregularities. The dynamic scan field curvature can be used to improve lithographic modeling, overlay modeling, and advanced process control techniques related to scanner stage dynamics.

Abstract: An apparatus and method for manufacturing and using a calibrated registration reference wafer in a semiconductor manufacturing facility. A reference reticle consisting of a 2-dimensional array of standard alignment attributes is exposed several times onto a photoresist coated semiconductor wafer using a photolithographic exposure tool. After the final steps of the lithographic development process the resist patterned wafer is physically etched using standard techniques to create a permanent record of the alignment attribute exposure pattern. The permanently recorded alignment attributes are measured for placement error using a conventional overlay metrology tool. The resulting overlay error data is used to generate a calibration file that contains the positions of the alignment attributes on the reference wafer. The reference wafer and calibration file can be used to determine the wafer stage registration performance for any photolithographic exposure tool.

Abstract: A syntactic foam and water-based explosive comprising glass microbubbles formed by heating feed having a size distribution with a span of less than 0.9 that are dispersed in a polymeric matrix or emulsion explosive. A method for making glass microbubbles, syntactic foam and water-based explosives is described.

Abstract: Intra-field distortion for a projection imaging tool is determined using a self-referenced rectangular grid reticle pattern, that includes at least two arrays of alignment attributes that are complementary to each other, is exposed multiple times onto a substrate with a recording media. A reference reticle pattern is exposed onto the substrate, wherein the reference reticle pattern overlaps the grid alignment attributes thereby creating completed grid alignment attributes. Positional offsets of the completed alignment attributes and completed grid alignment attributes are measured and an intra-field distortion from the offsets is determined.

Abstract: Methods and apparatus for correcting imaging defects, particularly focus defects induced by the lens or scan, in a projection imaging tool (PIT) are described. An illumination source is provided that can operate either simultaneously or alternately, at two or more discrete wavelength settings. The repeatable imaging defects of the PIT are measured. The cross field lens chromatic response is characterized at multiple discrete wavelength settings. Then, a compensating arrangement is designed tailored to compensate for the imaging defects and is used in the PIT.

Abstract: A method and apparatus for resolving both the angular (nx,ny) and spatial (x,y) dependence of the effective source coherence matrix for lithographic steppers and scanners is described. First an in-situ source metrology instrument is combined with in-situ polarization elements to create an in-situ source imaging polarizer or ISIP. The ISIP is loaded into a photolithographic exposure tool, aligned, and then exposed onto a suitable recording media or recording sensor. The recording sensor comprising either resist coated wafers or electronic sensors capture the image intensity at a multiplicity of different field points. The resulting measurements are entered into a computer program that reconstructs the source coherence matrix as a function of direction cosine at multiple field points. Alternative ISIP configurations are discussed in some detail. Applications of the ISIP include polarization source mapping for deep-UV and EUV lithography, process optimization, process monitoring, and chip manufacturing.