Abstract: Two-stage bake photoresists with releasable quenchers for fabricating back end of line (BEOL) interconnects are described. In an example, a photolyzable composition includes an acid-deprotectable photoresist material having substantial transparency at a wavelength, a photo-acid-generating (PAG) component having substantial transparency at the wavelength, and a base-generating component having substantial absorptivity at the wavelength.

Abstract: Approaches based on differential hardmasks for modulation of electrobucket sensitivity for semiconductor structure fabrication, and the resulting structures, are described. In an example, a method of fabricating an interconnect structure for an integrated circuit includes forming a hardmask layer above an inter-layer dielectric (ILD) layer formed above a substrate. A plurality of dielectric spacers is formed on the hardmask layer. The hardmask layer is patterned to form a plurality of first hardmask portions. A plurality of second hardmask portions is formed alternating with the first hardmask portions. A plurality of electrobuckets is formed on the alternating first and second hardmask portions and in openings between the plurality of dielectric spacers. Select ones of the plurality of electrobuckets are exposed to a lithographic exposure and removed to define a set of via locations.

Abstract: Lined photoresist structures to facilitate fabricating back end of line (BEOL) interconnects are described. In an embodiment, a hard mask has recesses formed therein, wherein liner structures are variously disposed each on a sidewall of a respective recess. Photobuckets comprising photoresist material are also variously disposed in the recesses. The liner structures variously serve as marginal buffers to mitigate possible effects of misalignment in the exposure of photoresist material to photons or an electron beam. In another embodiment, a recess has disposed therein a liner structure and a photobucket that are both formed by self-assembly of a photoresist-based block-copolymer.

Abstract: Disclosed herein are structures and techniques utilizing directed self-assembly for microelectronic device fabrication. For example, a microelectronic structure may include a patterned region including a first conductive line and a second conductive line, wherein the second conductive line is adjacent to the first conductive line; and an unordered region having an unordered lamellar pattern, wherein the unordered region is coplanar with the patterned region.

Abstract: Spacer-based patterning for tight-pitch and low-variability random access memory (RAM) bit cells, and the resulting structures, are described. In an example, a semiconductor structure includes a substrate having a top layer. An array of non-volatile random access memory (RAM) bit cells is disposed on the top layer of the substrate. The array of non-volatile RAM bit cells includes columns of non-volatile RAM bit cells along a first direction and rows of non-volatile RAM bit cells along a second direction orthogonal to the first direction. A plurality of recesses is in the top layer of the substrate, along the first direction between columns of the array of non-volatile RAM bit cells.

Abstract: Lined photoresist structures to facilitate fabricating back end of line (BEOL) interconnects are described. In an embodiment, a hard mask has recesses formed therein, wherein liner structures are variously disposed each on a sidewall of a respective recess. Photobuckets comprising photoresist material are also variously disposed in the recesses. The liner structures variously serve as marginal buffers to mitigate possible effects of misalignment in the exposure of photoresist material to photons or an electron beam. In another embodiment, a recess has disposed therein a liner structure and a photobucket that are both formed by self-assembly of a photoresist-based block-copolymer.

Abstract: Techniques are disclosed for forming vias for integrated circuit structures. During an additive via formation process, a dielectric material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is desired to have vias, openings are etched in the dielectric material through the removed regions, and the openings are filled with a first via material. This is then repeated for a second via material. During the subtractive via formation process, a first via material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is not desired to have vias, openings are etched in the first via material through the removed regions. This is then repeated for a second via material.

Abstract: Magneto-electric spin orbital (MESO) structures having functional oxide vias, and method of fabricating magneto-electric spin orbital (MESO) structures having functional oxide vias, are described. In an example, a magneto-electric spin orbital (MESO) device includes a source region and a drain region in or above a substrate. A first via contact is on the source region. A second via contact is on the drain region, the second via contact laterally adjacent to the first via contact. A plurality of alternating ferromagnetic material lines and non-ferromagnetic conductive lines is above the first and second via contacts. A first of the ferromagnetic material lines is on the first via contact, and a second of the ferromagnetic material lines is on the second via contact. A spin orbit coupling (SOC) via is on the first of the ferromagnetic material lines. A functional oxide via is on the second of the ferromagnetic material lines.

Abstract: Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.

Abstract: Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects is described. In an example, a back end of line (BEOL) metallization layer for a semiconductor structure includes an inter-layer dielectric (ILD) layer disposed above a substrate. A plurality of conductive lines is disposed in the ILD layer along a first direction. A conductive tab is disposed in the ILD layer, the conductive tab coupling two of the plurality of conductive lines along a second direction orthogonal to the first direction. A conductive via is coupled to one of the plurality of conductive lines, the conductive via having a via hardmask thereon. An uppermost surface of each of the ILD layer, the plurality of conductive lines, the conductive tab, and the via hardmask is planar with one another.

Abstract: Advanced lithography techniques including sub-10 nm pitch patterning and structures resulting therefrom are described. Self-assembled devices and their methods of fabrication are described.

Abstract: Approaches based on photobucket floor colors with selective grafting for semiconductor structure fabrication, and the resulting structures, are described. For example, a grating structure is formed above an ILD layer formed above a substrate, the grating structure including a plurality of dielectric spacers separated by alternating first trenches and second trenches, grafting a resist-inhibitor layer in the first trenches but not in the second trenches, forming photoresist in the first trenches and in the second trenches, exposing and removing the photoresist in select ones of the second trenches to a lithographic exposure to define a set of via locations, etching the set of via locations into the ILD layer, and forming a plurality of metal lines in the ILD layer, where select ones of the plurality of metal lines includes an underlying conductive via corresponding to the set of via locations.

Abstract: Damascene plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects is described. In an example, a back end of line (BEOL) metallization layer for a semiconductor structure includes an inter-layer dielectric (ILD) layer disposed above a substrate. A plurality of conductive lines is disposed in the ILD layer along a first direction. A conductive tab is disposed in the ILD layer. The conductive tab couples two of the plurality of conductive lines along a second direction orthogonal to the first direction.

Abstract: Subtractive plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects is described. In an example, a back end of line (BEOL) metallization layer for a semiconductor structure includes an inter-layer dielectric (ILD) layer disposed above a substrate. A plurality of conductive lines is disposed in the ILD layer along a first direction. A conductive tab is disposed in the ILD layer, the conductive tab coupling two of the plurality of conductive lines along a second direction orthogonal to the first direction. A conductive via is coupled to one of the plurality of conductive lines, the conductive via having a via hardmask thereon. An uppermost surface of each of the ILD layer, the plurality of conductive lines, the conductive tab, and the via hardmask is planar with one another.

Abstract: Damascene plug and tab patterning with photobuckets for back end of line (BEOL) spacer-based interconnects is described. In an example, a back end of line (BEOL) metallization layer for a semiconductor structure includes an inter-layer dielectric (ILD) layer disposed above a substrate. A plurality of conductive lines is disposed in the ILD layer along a first direction. A conductive tab is disposed in the ILD layer. The conductive tab couples two of the plurality of conductive lines along a second direction orthogonal to the first direction.

Abstract: Surface-aligned lithographic patterning approaches for back end of line (BEOL) interconnect fabrication, and the resulting structures, are described. In an example, an integrated circuit structure includes a substrate. A plurality of alternating first and second conductive lines is along a first direction of a back end of line (BEOL) metallization layer in a first inter-layer dielectric (ILD) layer above the substrate. A conductive via is on and electrically coupled to one of the conductive lines of the plurality of alternating first and second conductive lines, the conductive via centered over the one of the conductive lines. A second ILD layer is above plurality of alternating first and second conductive lines and laterally adjacent to the conductive via. The second ILD layer has an uppermost surface substantially co-planar with the flat top surface of the conductive via.

Abstract: Techniques are disclosed for forming vias for integrated circuit structures. During an additive via formation process, a dielectric material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is desired to have vias, openings are etched in the dielectric material through the removed regions, and the openings are filled with a first via material. This is then repeated for a second via material. During the subtractive via formation process, a first via material is deposited, an etch stop layer is deposited, a checkerboard pattern is deposited on the etch stop layer, regions in the checkerboard pattern are removed where it is not desired to have vias, openings are etched in the first via material through the removed regions. This is then repeated for a second via material.

Abstract: Disclosed herein are quantum dot devices, as well as related computing devices and methods. For example, in some embodiments, a quantum dot device may include: a quantum well stack including a quantum well layer; and a plurality of gates disposed above the quantum well stack, wherein individual ones of the plurality of gates have a footprint shape with two opposing linear faces and two opposing curved faces.

Abstract: There is disclosed in an example an integrated circuit, including: a first layer having a dielectric, a first conductive interconnect and a second conductive interconnect; a second layer having a third conductive interconnect; a conductive via between the first layer and the second layer to electrically couple the second conductive interconnect to the third conductive interconnect; a dielectric plug disposed vertically between the first layer and second layer and disposed to prevent the via from electrically shorting to the first conductive interconnect; and a dielectric cap covering the dielectric plug.

Abstract: A computing device including tight pitch features and a method of fabricating a computing device using colored spacer formation is disclosed. The computing device includes a memory and an integrated circuit coupled to the memory. The integrated circuit includes a first multitude of features above a substrate. The integrated circuit die includes a second multitude of features above the substrate. The first multitude of features and the second multitude of features are same features disposed in a first direction. The first multitude of features interleave with the second multitude of features. The first multitude of features has a first size and the second multitude of features has a second size.