Abstract: Inter-device communication with a pulse-amplitude modulation (PAM) signal can have at least two data eyes with different Vref levels. A physical interface (PHY) can be trained for the PAM signal by training a first data eye separately from the second data eye. The training can include adjusting the first Vref level separately from the second Vref level to center each reference voltage on its respective data eye.

Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.

Abstract: Processes, apparatuses, and systems associated with usage and contextual-based elevator operations management that have the capability to learn and to constantly adapt to usage patterns on a temporal basis through continuous monitoring of elevator journeys. An elevator journey may include a start and termination floor for an individual. Elevator journey data may be used to predict patterns of usage and maybe used, for example, to optimize the number of elevators operational at any time, determine the optimal parking position of each elevator, and/or determine an efficient allocation of elevators to groups or related floors.

Abstract: Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.

Abstract: A patch antenna system comprising: an integrated circuit die having an active side including an active layer, and a backside; a dielectric layer formed on the backside; and a redistribution layer formed on the dielectric layer wherein the redistribution layer forms an array of patches. The patch antenna further comprises a plurality of through-silicon vias (TSV), wherein the TSVs electrically connect the array of patches to the active layer.

Abstract: In an embodiment, a system includes voltage sensing logic to determine a first source voltage Vfirst source corresponding to a first source, and a controller to receive an indication of Vfirst source from the voltage sensing logic. The controller is to, responsive to Vfirst source>a first output voltage (V1), select a first source first regulator to input Vfirst source and provide V1; responsive to Vfirst source>a second output voltage (V2), select a first source second voltage regulator that inputs Vfirst source, and provide V2; responsive to Vfirst source?V1, select a second source first voltage regulator that inputs a second source voltage Vsecond source that corresponds to a second source and is substantially constant in time where Vsecond source>V1, and provide V1 independent of the first source first regulator and the first source second voltage regulator. Other embodiments are described and claimed.

Abstract: An ocular control system arranged to determine electric potentials associated with a set of sensor. The ocular control system may determine direction of gaze or motion based on the determined electric potentials. The determined direction of gaze or motion may be used to provide data input for a computing device.

Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.

Abstract: Described is an apparatus which comprises: a backside of a first die having a redistribution layer (RDL); and one or more passive planar devices disposed on the backside, the one or more passive planar devices formed in the RDL.

Abstract: Embodiments of the present disclosure provide techniques and configurations for an orthotic device. In one instance, the device may include an orthotic device body and at least two sensors spatially disposed inside the orthotic device body. A first sensor may provide a first output responsive to pressure resulting from application of mechanical force to the orthotic device body. A second sensor may provide a second output responsive to flexing resulting from the application of mechanical force to the orthotic device body. The device may also include a control unit communicatively coupled with the sensors to receive and process the outputs provided by the sensors in response to pressure and flexing. Other embodiments may be described and/or claimed.

Abstract: Technologies for the sensing of biofeedback signals of a user include a body area network (BAN) system comprising one or more biofeedback sensors and one or more BAN controllers. The biofeedback sensors are configured to sense BAN signals, which may include biofeedback signals and body-coupled communication (BCC) signals. To facilitate communication, the biofeedback sensors may demultiplex the sensed BAN signals into biofeedback signals and incoming BCC signals. Similarly, the biofeedback sensors may multiplex outgoing BCC signals with sensed biofeedback signals. The BAN controller may communicate in a similar manner. Additionally, the BAN controller may process incoming BCC signals and provide feedback to the user based on BCC signals received from the biofeedback sensors.

Abstract: Embodiments of the present disclosure provide techniques and configurations for a wearable device with power state control. In one instance, the device a functional module to operate in a first power state or in a second power state that is different from the first power state; a power source coupled with the functional module to provide operational power to the functional module; and a power state control module coupled with the functional module, to cause the functional module to transition from the first power state to the second power state in response to an input. The power state control module may comprise a power generating device to generate power responsive to the input, independent of the power source, and in response to the generated power, cause the functional module to transition from the first power state to the second power state. Other embodiments may be described and/or claimed.

Abstract: Described is an apparatus which comprises: a first bridge to be coupled to a first load; a first Pulse Width Modulation (PWM) circuit to drive the first bridge; a second bridge to be coupled to a second load; and a second PWM circuit to drive the second bridge, wherein the first PWM circuit is controlled by a first digital word separate from a second digital word, wherein the second PWM circuit is controlled by the second digital, and wherein the second digital word is derived from the first digital word.

Abstract: Magnetically enhanced inductors integrated with microelectronic devices at chip-level. In embodiments, magnetically enhanced inductors include a through substrate vias (TSVs) with fill metal to carry an electrical current proximate to a magnetic layer disposed on a substrate through which the TSV passes. In certain magnetically enhanced inductor embodiments, a TSV fill metal is disposed within a magnetic material lining the TSV. In certain magnetically enhanced inductor embodiments, a magnetically enhanced inductor includes a plurality of interconnected TSVs disposed proximate to a magnetic material layer on a side of a substrate. In embodiments, voltage regulation circuitry disposed on a first side of a substrate is integrated with one or more magnetically enhanced inductors utilizing a TSV passing through the substrate.

Abstract: Techniques are disclosed for forming a through-body-via (TBV) isolated coaxial capacitor in a semiconductor die. In some embodiments, a cylindrical capacitor provided using the disclosed techniques may include, for example, a conductive TBV surrounded by a dielectric material and an outer conductor plate. The TBV and outer plate can be formed, for example, so as to be self-aligned with one another in a coaxial arrangement, in accordance with some embodiments. The disclosed capacitor may extend through the body of a host die such that its terminals are accessible on the upper and/or lower surfaces thereof. Thus, in some cases, the host die can be electrically connected with another die to provide a die stack or other three-dimensional integrated circuit (3D IC), in accordance with some embodiments. In some instances, the disclosed capacitor can be utilized, for example, to provide integrated capacitance in a switched-capacitor voltage regulator (SCVR).

Abstract: In at least one embodiment there is provided a method for managing bulk capacitance of a power supply system. The method includes precharging first and second bulk capacitors of the power supply system to approximately a first output voltage level and a second output voltage level, respectively; receiving a first command signal to generate, by the power supply, the first output voltage level; coupling the first bulk capacitance to load circuitry coupled to the power supply; receiving a second command signal to generate, by the power supply, the second output voltage level; and coupling the second bulk capacitance to the load circuitry coupled to the power supply.

Abstract: An ocular control system arranged to determine electric potentials associated with a set of sensor. The ocular control system may determine direction of gaze or motion based on the determined electric potentials. The determined direction of gaze or motion may be used to provide data input for a computing device.

Abstract: Processes, apparatuses, and systems associated with usage and contextual-based elevator operations management are disclosed herein. The operations management system may have the capability to learn and to constantly adapt to usage patterns on a temporal basis through continuous monitoring of elevator journeys. In embodiments, an elevator journey may include a start and termination floor for an individual. This data may be used to predict patterns of usage and maybe used, for example, to optimize the number of elevators operational at any time, determine the optimal parking position of each elevator, and/or determine an efficient allocation of elevators to groups or related floors. Other embodiments may be described and/or claimed.

Abstract: Embodiments of the present disclosure describe a die with integrated microphone device using through-silicon vias (TSVs) and associated techniques and configurations. In one embodiment, an apparatus includes an apparatus comprising a semiconductor substrate having a first side and a second side disposed opposite to the first side, an interconnect layer formed on the first side of the semiconductor substrate, a through-silicon via (TSV) formed through the semiconductor substrate and configured to route electrical signals between the first side of the semiconductor substrate and the second side of the semiconductor substrate, and a microphone device formed on the second side of the semiconductor substrate and electrically coupled with the TSV. Other embodiments may be described and/or claimed.

Abstract: Particular embodiments described herein provide for an electronic device, such as a wrist worn electronic device. One particular example implementation of the electronic device may include a main housing, a main display in the main housing, a wrist strap that allows the main housing to be secured to a user such that the main display is located on top of a wrist of the user, and a secondary display located on the wrist strap, where the secondary display communicates information to the user without the user having to turn the wrist.