Abstract: An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.

Abstract: An on-chip temperature sensor for generating a digital output signal representing a temperature value includes: a proportional to absolute temperature (PTAT) buffer for alternately generating a first voltage signal representing a first temperature of the PTAT buffer and a second voltage signal representing a second temperature of the PTAT buffer; an analog to digital (A/D) converter, coupled to the PTAT buffer, for converting the first voltage signal to a first digital voltage signal and for converting the second voltage signal to a second digital voltage signal; and a digital output generating block, for receiving the first digital voltage signal and the second digital voltage signal, and comparing a difference between the first digital voltage signal and the second digital voltage signal with a digital voltage reference signal to generate the digital output signal.

Abstract: A catalyst ink for plating and a method for electrochemically manufacturing an electronic device by using same are disclosed. The present invention provides a catalyst ink for plating, comprising: a polymer binder; a metal ion as a catalyst; a silane coupling agent for coupling the metal ion and the polymer; and a solvent, wherein the polymer has a lower critical solution temperature in the temperature-composition phase diagram for a solvent-polymer binary system, and the lower critical solution temperature is 30° C. or higher. According to the present invention, a high resolution plated pattern having a line width and a width between lines can be manufactured.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: The present invention relates to silver ink for printing a three dimensional microstructure and a 3D printing method using the same. The present invention provides a method for printing a 3-dimensional silver structure pattern, the method including: a step of providing a nozzle with liquid ink including capped silver nanoparticles and exhibiting Newtonian fluid behavior; a step of forming, at a predetermined point on a substrate, a meniscus of the liquid ink with ink extruded from the nozzle; a step of allowing the ink of the nozzle to be extruded by means of the surface tension of the meniscus while moving the nozzle along a path in a direction perpendicular to the substrate, in a direction parallel to the substrate, or according to a combination of said directions; and a step of forming a silver structure pattern corresponding to the movement path of the nozzle by evaporating a solvent from the extruded ink from the region closer to the substrate.

Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.

Abstract: A continuous casting and rolling apparatus according to one embodiment of the present invention provides: a continuous caster for generating a steel sheet; a first rolling unit associated with the continuous caster; and a second rolling unit which is spaced apart in the outlet of the first rolling unit and comprises: a rolling mill for pressing down the steel sheet; and a cutter for cutting a portion of the steel sheet, wherein the cutter is spaced from the second rolling unit by a length corresponding to the length of the steel sheet discharged in an at least discontinuous rolling mode, and may comprise a cut withdrawal unit provided between the first rolling unit and the second rolling unit.

Abstract: A hot rolling device, according to one embodiment of the present invention, may comprise: a cast part supply portion for producing a cast part; a hot roller, linked to the cast part supply portion, for receiving and hot-rolling the cast part; and a heating unit, arranged between the cast part supply portion and the hot roller, for reheating an outer surface portion in the widthwise direction of the cast part while latent heat is maintained in the center portion of the widthwise direction of the cast part from preheating.

Abstract: Provided is a solidification apparatus that makes variations in the surface height of a molten metal relatively non-affected by the proceeding speed of a metal sheet to significantly increase the proceeding speed of the metal sheet and to increase the productivity of the metal sheet. The solidification apparatus for producing a metal sheet by solidifying molten metal includes rows of rollers arranged in a proceeding direction of the metal sheet, wherein when the rows of rollers are grouped into a plurality of sections, an average of roller pitches each being a distance between centers of rollers adjacent in the proceeding direction of the metal sheet is smaller in a given section than in a preceding section.

Abstract: A coil assembly for an induction heating device comprises: a first coil part which has, on one surface thereof, a first cooling-pipe insertion groove indented to the inside thereof; a first cooling pipe coupled to the first cooling-pipe insertion groove so that a part of the outer surface can be exposed; a second coil part which is disposed to be opposite to one surface of the first coil part provided with the first cooling-pipe insertion groove and has, on one surface opposite to the one surface of the first coil part, a second cooling-pipe insertion groove indented to the inside thereof; and a second cooling pipe coupled to the second cooling-pipe insertion groove so that a part of the outer surface can be exposed.

Abstract: Provided are photomasks, methods of fabricating the photomasks, and methods of fabricating a semiconductor device by using the photomasks, in which a critical dimension (CD) of a pattern of a specific region of the photomask is corrected to improve the distribution of CDs of the pattern formed on a wafer. The photomasks may include a substrate and a light-blocking pattern formed on the substrate that includes an absorber layer and an anti-reflection coating (ARC) layer. The light-blocking pattern may include at least one of a first corrected area in which a top surface of the absorber layer is exposed, and a second corrected area in which a correction layer is formed on the ARC layer.

Abstract: A continuous casting and rolling apparatus according to one embodiment of the present invention provides: a continuous caster for generating a steel sheet; a first rolling unit associated with the continuous caster; and a second rolling unit which is spaced apart in the outlet of the first rolling unit and comprises: a rolling mill for pressing down the steel sheet; and a cutter for cutting a portion of the steel sheet, wherein the cutter is spaced from the second rolling unit by a length corresponding to the length of the steel sheet discharged in an at least discontinuous rolling mode, and may comprise a cut withdrawal unit provided between the first rolling unit and the second rolling unit.

Abstract: A hot rolling device, according to one embodiment of the present invention, may comprise: a cast part supply portion for producing a cast part; a hot roller, linked to the cast part supply portion, for receiving and hot-rolling the cast part; and a heating unit, arranged between the cast part supply portion and the hot roller, for reheating an outer surface portion in the widthwise direction of the cast part while latent heat is maintained in the center portion of the widthwise direction of the cast part from preheating.

Abstract: A method for fabricating a semiconductor device improving the process speed is provided. The method includes forming a fin on a substrate, forming a gate electrode on the fin, first ion-implanting a first impurity to amorphize a region including portions of the fin positioned at opposite sides of the gate electrode, forming a stress inducing layer on the substrate and the fin, and annealing the substrate to recrystallize the amorphized region, wherein after the forming of the fin and before the annealing, the method further includes second ion-implanting a second impurity different from the first impurity into the fin.

Abstract: Provided are photomasks, methods of fabricating the photomasks, and methods of fabricating a semiconductor device by using the photomasks, in which a critical dimension (CD) of a pattern of a specific region of the photomask is corrected to improve the distribution of CDs of the pattern formed on a wafer. The photomasks may include a substrate and a light-blocking pattern formed on the substrate that includes an absorber layer and an anti-reflection coating (ARC) layer. The light-blocking pattern may include at least one of a first corrected area in which a top surface of the absorber layer is exposed, and a second corrected area in which a correction layer is formed on the ARC layer.

Abstract: A mandrel of a coil box comprises: a cylindrical mandrel body having a center shaft disposed therein and a slot into which a front end portion of a hot bar is inserted; and a guide part which is arranged towards the inside of the mandrel body from a peripheral wall of one side of the slot so as to prevent the cooling and plastic deformation of the front end portion of the bar inserted through the slot.

Abstract: A method of cleaning a photomask, the method including placing the photomask in a chamber, the photomask including a mask substrate and a reflective layer, a capping layer, and a light absorbing layer pattern stacked on the mask substrate, and wherein the photomask has contaminants thereon; supplying a gas into the chamber such that the gas does not react with the capping layer or reacts with the capping layer to form an anti-oxidant layer; ionizing the gas by irradiating an inside of the chamber with an energy beam such that the contaminants react with the ionized gas to be converted to a by-product; and removing the by-product from the chamber.

Abstract: In one embodiment there is set forth a method comprising providing a semiconductor structure having an electrode, wherein the providing includes providing a phase transition material region and wherein the method further includes imparting energy to the phase transition material region to induce a phase transition of the phase transition material region. By inducing a phase transition of the phase transition material region, a state of the semiconductor structure can be changed. There is further set forth an apparatus comprising a structure including an electrode and a phase transition material region, wherein the apparatus is operative for imparting energy to the phase transition material region to induce a phase transition of the phase transition material region without the phase transition of the phase transition material region being dependent on electron transport through the phase transition material region.

Abstract: A method and apparatus for a modified noise-coupled modulator using zero optimization technique is disclosed. By realizing the resonator coefficient as a part of branches other than those of the main transfer function, the problem of improving SQNR without degrading other specifications is solved. Second order noise coupling is used to implement zeros without using feedback branches going into the first integrator. Embodiments use a first-order modulator, second-order noise coupling and a resonator. It allows lower power consumption and smaller size by removing small capacitor values and gain factors and reducing the number of amplifiers.