Patents by Inventor Sang Ick Lee

Sang Ick Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220018017
    Abstract: The present invention provides a method for manufacturing a molybdenum-containing thin film and a molybdenum-containing thin film manufactured thereby. By using a molybdenum (0)-based hydrocarbon compound and a predetermined reaction gas, the method for manufacturing a molybdenum-containing thin film according to the present invention enables easy manufacturing of a highly pure thin film in a simple process.
    Type: Application
    Filed: November 13, 2019
    Publication date: January 20, 2022
    Inventors: Myong Woon KIM, Sang Ick LEE, Jang Woo SEO, Sang Yong JEON, Haeng Don LIM
  • Publication number: 20210222294
    Abstract: Provided are a novel metal triamine compound, a method for preparing the same, a composition for depositing a metal-containing thin film including the same, and a method for preparing a metal-containing thin film using the same. The metal triamine compound of the present invention has excellent reactivity, is thermally stable, has high volatility, and has high storage stability, and thus, it may be used as a metal-containing precursor to easily prepare a high-purity metal-containing thin film having high density.
    Type: Application
    Filed: April 26, 2018
    Publication date: July 22, 2021
    Applicant: DNF Co., Ltd.
    Inventors: Myong Woon KIM, Sang Ick LEE, Sang Jun YIM, Won Mook CHAE, Jeong Hyeon PARK, Kang Yong LEE, A Ra CHO, Joong Jin PARK, Heang Don LIM
  • Patent number: 11062940
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: July 13, 2021
    Assignees: Samsung Electronics Co., Ltd., DNF Co., Ltd.
    Inventors: Chang-Woo Sun, Ji-Eun Yun, Jae-Soon Lim, Youn-Joung Cho, Myong-Woon Kim, Kang-yong Lee, Sang-Ick Lee, Sung-Woo Cho
  • Publication number: 20210147451
    Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.
    Type: Application
    Filed: April 19, 2018
    Publication date: May 20, 2021
    Inventors: Sung Gi KIM, Se Jin JANG, Byeong-il YANG, Joong Jin PARK, Sang-Do LEE, Jeong Joo PARK, Sam Dong LEE, Gun-Joo PARK, Sang Ick LEE, Myong Woon KIM
  • Patent number: 10919819
    Abstract: Provided is a method for oligomerization of ethylene, and more particularly, a method for producing 1-hexene and 1-octene at a high selectivity under an ethylene atmosphere by inducing a remarkably improved catalytic activity while effectively reducing a production amount of polyethylene by introducing the oligomerization catalyst and a cocatalyst mixture containing at least two aluminums together and adjusting the kind of oligomerization catalyst and injection conditions thereof.
    Type: Grant
    Filed: July 5, 2017
    Date of Patent: February 16, 2021
    Assignees: SK Innovation Co., Ltd., SK Global Chemical Co., Ltd.
    Inventors: Sudevan Sujith, So Hee Sim, Hyo Seung Park, Sun Young Kim, Sang Ick Lee, Han Sol Lee
  • Patent number: 10913755
    Abstract: The present invention relates to: a novel transition metal compound; a preparation method therefor; a composition for depositing a transition metal-containing thin film, containing the same; a transition metal-containing thin film using the composition for depositing a transition metal-containing thin film; and a method for preparing a transition metal-containing thin film. The transition metal compound of the present invention has high thermal stability, high volatility, and high storage stability, and thus a transition metal-containing thin film having high-density and high-purity can be easily prepared by using the same as a precursor.
    Type: Grant
    Filed: April 6, 2017
    Date of Patent: February 9, 2021
    Assignee: DNF CO., LTD.
    Inventors: Myong Woon Kim, Sang Ick Lee, Won Mook Chae, Sang Jun Yim, Kang Yong Lee, A Ra Cho, Sang Yong Jeon, Haeng Don Lim
  • Patent number: 10894799
    Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.
    Type: Grant
    Filed: April 19, 2018
    Date of Patent: January 19, 2021
    Assignee: DNF CO., LTD.
    Inventors: Sung Gi Kim, Se Jin Jang, Byeong-il Yang, Joong Jin Park, Sang-Do Lee, Jeong Joo Park, Sam Dong Lee, Gun-Joo Park, Sang Ick Lee, Myong Woon Kim
  • Patent number: 10882873
    Abstract: A tin compound, tin precursor compound for atomic layer deposition (ALD), a method of forming a tin-containing material film, and a method of synthesizing a tin compound, the tin compound being represented by Chemical Formula (I): wherein R1, R2, Q1, Q2, Q3, and Q4 are each independently a C1 to C4 linear or branched alkyl group.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: January 5, 2021
    Assignees: SAMSUNG ELECTRONICS CO., LTD., DNF Co., Ltd.
    Inventors: Seung-min Ryu, Youn-soo Kim, Jae-soon Lim, Youn-joung Cho, Myong-woon Kim, Kang-yong Lee, Sang-ick Lee, Sang-yong Jeon
  • Publication number: 20200392294
    Abstract: Provided are a silylamine compound, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition, and more particularly, to a silylamine compound capable of being usefully used as a precursor of a silicon-containing thin film, a composition for depositing a silicon-containing thin film containing the same, and a method for manufacturing a silicon-containing thin film using the composition.
    Type: Application
    Filed: March 28, 2018
    Publication date: December 17, 2020
    Inventors: Sung Gi KIM, Jeong Joo PARK, Joong Jin PARK, Se Jin JANG, Byeong-il YANG, Sang-Do LEE, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20200361966
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a trisilylamine compound and a method for producing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film containing a trisilylamine compound which is capable of forming a silicon-containing thin film at a very high deposition rate at a low temperature to be usable as a precursor of a silicon-containing thin film and an encapsulant of a display, and a method for producing a silicon-containing thin film by using the same.
    Type: Application
    Filed: November 22, 2018
    Publication date: November 19, 2020
    Inventors: Sung Gi KIM, Joong Jin PARK, Byeong-il YANG, Se Jin JANG, Gun-Joo PARK, Jeong Joo PARK, Hee Yeon JEONG, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20200339617
    Abstract: Provided are a method of manufacturing a ruthenium-containing thin film and a ruthenium-containing thin film manufactured therefrom, and the method of manufacturing a ruthenium-containing thin film of the present invention uses a ruthenium(0)-based hydrocarbon compound and specific reaction gas, whereby a high-purity thin film may be easily manufactured by a simple process.
    Type: Application
    Filed: November 1, 2018
    Publication date: October 29, 2020
    Inventors: Myong Woon KIM, Sang Ick LEE, Sung Woo CHO, Mi Jeong HAN, Haeng Don LIM
  • Publication number: 20200231610
    Abstract: A tin compound, a tin precursor compound for forming a tin-containing layer, and a method of forming a thin layer, the tin compound being represented by Formula 1: wherein R1, R2, R3, R4, R5, R6, and R7 are each independently hydrogen, a linear alkyl group having 1 to 4 carbon atoms, or a branched alkyl group having 3 or 4 carbon atoms.
    Type: Application
    Filed: August 29, 2019
    Publication date: July 23, 2020
    Applicants: SAMSUNG ELECTRONICS CO., LTD., DNF Co., Ltd.
    Inventors: Seung-Min RYU, Myong Woon KIM, Younsoo KIM, Sang Ick LEE, Jaesoon LIM, Younjoung CHO, Jun Hee CHO, Won Mook CHAE
  • Publication number: 20200131205
    Abstract: Provided are a novel disilylamine compound, a method for preparing same, and a composition for depositing a silicon-containing thin film including the same. A disilylamine compound of the present invention has excellent reactivity, is thermally stable, and has high volatility, and thus, is used as a silicon-containing precursor, thereby manufacturing a high-quality silicon-containing thin film.
    Type: Application
    Filed: April 19, 2018
    Publication date: April 30, 2020
    Inventors: Sung Gi KIM, Se Jin JANG, Byeong-il YANG, Joong Jin PARK, Sang-Do LEE, Jeong Joo PARK, Sam Dong LEE, Gun-Joo PARK, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20200111664
    Abstract: Provided are a composition for depositing a silicon-containing thin film containing a bis(aminosilyl)alkylamine compound and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing the bis(aminosilyl)alkylamine compound capable of being usefully used as a precursor of the silicon-containing thin film, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Application
    Filed: March 28, 2018
    Publication date: April 9, 2020
    Inventors: Sung Gi KIM, Jeong Joo PARK, Joong Jin PARK, Se Jin JANG, Byeong-il YANG, Sang-Do LEE, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Publication number: 20200111665
    Abstract: Provided are a composition containing a silylamine compund and a method for manufacturing a silicon-containing thin film using the same, and more particularly, a composition for depositing a silicon-containing thin film, containing a silylamine compound capable of forming a silicon-containing thin film having a significantly excellent water vapor transmission rate to thereby be usefully used as a precursor of the silicon-containing thin film and an encapsulant of a display, and a method for manufacturing a silicon-containing thin film using the same.
    Type: Application
    Filed: March 29, 2018
    Publication date: April 9, 2020
    Inventors: Sung Gi KIM, Jeong Joo PARK, Joong Jin PARK, Se Jin JANG, Byeong-il YANG, Sang-Do LEE, Sam Dong LEE, Sang Ick LEE, Myong Woon KIM
  • Patent number: 10487163
    Abstract: The present invention relates to a new transition metal compound based on cyclopenta[b]fluorenyl group, a transition metal catalyst composition containing the same and having high catalytic activity for preparing an ethylene homopolymer or a copolymer of ethylene and one ?-olefin, a method of preparing an ethylene homopolymer or a copolymer of ethylene and ?-olefin using the same, and the prepared ethylene homopolymer or the copolymer of ethylene and ?-olefin.
    Type: Grant
    Filed: March 5, 2019
    Date of Patent: November 26, 2019
    Assignee: Sabic SK Nexlene Company Pte. Ltd.
    Inventors: Dong Cheol Shin, Jong Sok Hahn, Chan Woong Jeon, Jeong Hwan Kim, Seong Kyun Kim, Sun Young Kim, Ho Seong Lee, Sang Ick Lee
  • Publication number: 20190308178
    Abstract: The present invention relates to an oligomerization catalyst a transition metal or transition metal precursor, a halogen-substituted organic ligand, and a heteroatom ligand, and to a method for selectively preparing 1-hexene or 1-octene from ethylene using the catalyst.
    Type: Application
    Filed: May 11, 2017
    Publication date: October 10, 2019
    Inventors: Sang Ick Lee, Eun Jung Baek, Sun Young Kim, Hyo Seung Park, Min Seon Jung
  • Publication number: 20190304835
    Abstract: An organometallic precursor includes tungsten as a central metal and a cyclopentadienyl ligand bonded to the central metal. A first structure including an alkylsilyl group or a second structure including an allyl ligand is bonded to the cyclopentadienyl ligand or bonded to the central metal.
    Type: Application
    Filed: June 17, 2019
    Publication date: October 3, 2019
    Applicants: Samsung Electronics Co., Ltd., DNF Co., LTD
    Inventors: Chang-Woo Sun, Ji-Eun YUN, Jae-Soon LIM, Youn-Joung CHO, Myong-Woon KIM, Kang-yong LEE, Sang-Ick LEE, Sung-Woo CHO
  • Publication number: 20190284109
    Abstract: Provided is a method for oligomerization of ethylene, and more particularly, a method for producing 1-hexene and 1-octene at a high selectivity under an ethylene atmosphere by inducing a remarkably improved catalytic activity while effectively reducing a production amount of polyethylene by introducing the oligomerization catalyst and a cocatalyst mixture containing at least two aluminums together and adjusting the kind of oligomerization catalyst and injection conditions thereof.
    Type: Application
    Filed: July 5, 2017
    Publication date: September 19, 2019
    Inventors: Sudevan Sujith, So Hee Sim, Hyo Seung Park, Sun Young Kim, Sang Ick Lee, Han Sol Lee
  • Publication number: 20190249296
    Abstract: The present invention relates to a method for manufacturing a high-purity silicon nitride thin film using plasma atomic layer deposition. More specifically, the present invention can realize improved thin film efficiency and a step coverage by performing a two-stage plasma excitation step and can provide a high-purity silicon nitride thin film with an improved deposition rate despite a low film-forming temperature.
    Type: Application
    Filed: July 19, 2017
    Publication date: August 15, 2019
    Inventors: Se Jin JANG, Sang-Do LEE, Joong Jin PARK, Sung Gi KIM, Byeong-il YANG, Gun-Joo PARK, Jeong Joo PARK, Jang Hyeon SEOK, Sang Ick LEE, Myong Woon KIM