Patents by Inventor Sang-kyun Kim

Sang-kyun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • DIGITAL RF RECEIVER
    Publication number: 20140044221
    Abstract: Embodiments provide a digital RF receiver including a signal converting unit which converts an RF signal received from an external device into a digital signal, a plurality of functional modules which processes the digital signal in accordance with a predetermined algorithm when the digital signal is input, and a signal processing controller which selects at least one of the plurality of functional modules to control the digital signal to be processed in consideration of whether an IF signal component is included in the digital signal or a sampling rate related with sampling information of the digital signal.
    Type: Application
    Filed: August 6, 2013
    Publication date: February 13, 2014
    Applicant: Electronics and Telecommunications Research Institute
    Inventors: Ik Soo EO, Sang Kyun Kim, Seon Ho Han
  • Resin composition for protection layer of color filter, protection layer of color filter using same and image sensor including same
    Patent number: 8628698
    Abstract: Disclosed is a resin composition for a protective layer of a color filter including an acrylate-based resin including a repeating unit represented by each of Chemical Formulae 1 to 3, a melamine-based resin represented by Chemical Formula 4, a thermal acid generator (TAG), and a solvent.
    Type: Grant
    Filed: July 23, 2010
    Date of Patent: January 14, 2014
    Assignee: Cheil Industries Inc.
    Inventors: Se-Young Choi, Jae-Hyun Kim, Nam-Gwang Kim, Eui-June Jeong, Sang-Kyun Kim, Kwen-Woo Han, Hyun-Hoo Sung
  • Silicon-based hardmask composition and process of producing semiconductor integrated circuit device using the same
    Patent number: 8524851
    Abstract: A silicon-based hardmask composition, including an organosilane polymer represented by Formula 1: {(SiO1.5—Y—SiO1.5)x(R3SiO1.5)y(XSiO1.5)z}(OH)e(OR6)f??(1).
    Type: Grant
    Filed: July 12, 2010
    Date of Patent: September 3, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Sang Kyun Kim, Hyeon Mo Cho, Sang Ran Koh, Mi Young Kim, Hui Chan Yun, Yong Jin Chung, Jong Seob Kim
  • Optical sheets
    Patent number: 8506149
    Abstract: Disclosed is an optical sheet for use in liquid crystal displays, which simultaneously functions to uniformly diffuse light emitted from a light guide plate and a diffusion plate and to increase brightness, decreases the loss of light, and enables the fabrication of thinner liquid crystal displays.
    Type: Grant
    Filed: March 19, 2008
    Date of Patent: August 13, 2013
    Assignee: Kolon Industries, Inc.
    Inventors: Kyung Nam Kim, Hyun Jung Kim, Sang Kyun Kim, Hyun Jin Kim, Jong Min Park, Chung Seock Kang
  • Positive Photosensitive Resin Composition, and Photosensitive Resin Layer and Display Device Using the Same
    Publication number: 20130171568
    Abstract: Disclosed are a positive photosensitive resin composition that includes (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a phenol compound, (D) at least one organic dye having an absorption wavelength of about 400 nm to about 700 nm, and (E) a solvent, wherein the organic dye (D) is included in an amount of about 1 to about 40 parts by weight based on about 100 parts by weight of the alkali soluble resin (A), and a photosensitive resin layer and a display device using the same.
    Type: Application
    Filed: September 5, 2012
    Publication date: July 4, 2013
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Ji-Yun KWON, Jin-Hee KANG, Dae-Yun KIM, Sang-Kyeon KIM, Sang-Kyun KIM, Sang-Soo KIM, Kun-Bae NOH, Eun-Kyung YOON, Jong-Hwa LEE, Jun-Ho LEE, Jin-Young LEE, Hwan-Sung CHEON, Hyun-Yong CHO, Chung-Beom HONG, Eun-Ha HWANG
  • Positive Photosensitive Resin Composition, and Display Device and Organic Light Emitting Device Using the Same
    Publication number: 20130171564
    Abstract: Disclosed are a positive photosensitive resin composition including (A) an alkali soluble resin including a polybenzoxazole precursor, a polyimide precursor, or a combination thereof, (B) a photosensitive diazoquinone compound, (C) a compound represented by the following Chemical Formula 1, and (D) a solvent, and a display device and an organic light emitting device using the same. The Chemical Formula 1 is the same as defined in the detailed description.
    Type: Application
    Filed: September 5, 2012
    Publication date: July 4, 2013
    Applicant: CHEIL INDUSTRIES INC.
    Inventors: Eun-Kyung YOON, Eun-Ha HWANG, Jong-Hwa LEE, Ji-Yun KWON, Dae-Yun KIM, Sang-Kyeon KIM, Sang-Kyun KIM, Sang-Soo KIM, Kun-Bae NOH, Jun-Ho LEE, Jin-Young LEE, Hyun-Yong CHO, Chung-Beom HONG
  • DIGITAL FRONT END RECEIVER USING DC OFFSET COMPENSATION SCHEME
    Publication number: 20130163699
    Abstract: The present invention relates to a digital front end receiver using a DC offset compensation scheme. The digital front end receiver includes a DC offset compensation filter configured to remove DC offset components from signals received from a digital mixer and a Cascaded Integrator-Comb (CIC) decimation filter configured to reduce a sampling rate of the signals received from the DC offset compensation block.
    Type: Application
    Filed: September 11, 2012
    Publication date: June 27, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Sang-Kyun Kim, Ik Soo Eo, Hyun Kyu Yu
  • DIGITAL RADIO FREQUENCY (RF) RECEIVER
    Publication number: 20130156141
    Abstract: A digital RF receiver does not use a separate receiver according to a mode and a band for multi-mode reception, MIMO reception, and bandwidth extension reception, and changes only setting variables in a single receiver structure so as to implement multi-mode reception, MIMO reception, bandwidth extension reception, and/or simultaneous multi-mode operation, such that complexity of the receiver, development cost, and power consumption can be reduced.
    Type: Application
    Filed: September 11, 2012
    Publication date: June 20, 2013
    Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE
    Inventors: Ik Soo Eo, Sang-Kyun Kim, Mun Yang Park, Seon-Ho Han, Hyun Kyu Yu
  • ADHESIVE COMPOSITION FOR SEMICONDUCTOR AND ADHESIVE FILM COMPRISING THE SAME
    Publication number: 20130143363
    Abstract: An adhesive film for a semiconductor may include about 60 wt % to about 80 wt % of a thermoplastic resin based on a total solid content of the adhesive film, a phenolic curing agent, and an amine curing agent, and the adhesive film may have a storage modulus of about 2 MPa or more and a reaction curing rate of about 50% or more when cured at 150° C. for 20 minutes.
    Type: Application
    Filed: December 5, 2012
    Publication date: June 6, 2013
    Inventors: Sang Jin KIM, Kyoung Tae WI, Jae Won CHOI, Sang Kyun KIM, Cheol Su KIM
  • Resin composition for transparent encapsulation material and electronic device formed using the same
    Patent number: 8455605
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Grant
    Filed: June 28, 2012
    Date of Patent: June 4, 2013
    Assignee: Cheil Industries, Inc.
    Inventors: Sang-Ran Koh, June-Ho Shin, Hyun-Jung Ahn, Sung-Hwan Cha, Young-Eun Choi, Doo-Young Jung, Sang-Kyun Kim, Jong-Seob Kim
  • Slurry Composition For Polishing And Method Of Manufacturing Phase Change Memory Device Using The Same
    Publication number: 20130112914
    Abstract: A slurry composition includes an abrasive agent, an oxidizing agent, and a first adsorption inhibitor including a polyethylene oxide copolymer. A method of manufacturing a phase change memory device may include providing a substrate including an interlayer insulating film having a trench and a phase change material layer on the interlayer insulating film filling the trench, and performing chemical mechanical polishing on the phase change material layer using the slurry composition to form a phase change material pattern layer.
    Type: Application
    Filed: September 14, 2012
    Publication date: May 9, 2013
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Choong-Ho HAN, Sang-Kyun KIM, Ye-Hwan KIM, Joon-Sang PARK, Jin-Woo BAE, Won-Jun LEE, Kyoung-Moon KANG, Jae-Dong LEE
  • SYSTEM AND METHOD FOR PROCESSING SENSORY EFFECTS
    Publication number: 20130103703
    Abstract: A system and method for processing sensory effects. According to an embodiment of the present disclosure, sensory effects included in content may be implemented in the real world by generating command data for controlling a sensory device based on sensory effect information and specific information about the sensory device. In addition, the data transmission rate is high and a low bandwidth may be used by encoding metadata as binary before transmission, or encoding as XML before transmission, or encoding as XML and then further encoding as binary before transmission.
    Type: Application
    Filed: April 6, 2011
    Publication date: April 25, 2013
    Applicants: Myongji University Industry and Academia Cooperation Foundation, Samsung Electronics Co., Ltd.
    Inventors: Seung Ju Han, Jae Joon Han, Won Chul Bang, Do Kyoon Kim, Sang Kyun Kim
  • RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING SAME
    Publication number: 20130037921
    Abstract: A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product of hydrolyzed products produced from a compound represented by Chemical Formula 1, a compound represented by Chemical Formula 2, and a compound represented by Chemical Formula 3.
    Type: Application
    Filed: August 10, 2012
    Publication date: February 14, 2013
    Inventors: Kwen-Woo HAN, Mi-Young KIM, Woo-Jin LEE, Han-Song LEE, Seung-Hee HONG, Sang-Kyun KIM, Jin-Wook LEE
  • FILLER FOR FILLING A GAP, METHOD OF PREPARING THE SAME AND METHOD OF MANUFACTURING SEMICONDUCTOR CAPACITOR USING THE SAME
    Publication number: 20130017662
    Abstract: A filler for filling a gap includes a compound represented by the following Chemical Formula 1. [Chemical Formula 1] SiaNbOcHd. In Chemical Formula 1, a, b, c, and d represent relative amounts of Si, N, O, and H, respectively, in the compound, 1.96<a<2.68, 1.78<b<3.21, 0?c<0.19, and 4<d<10.
    Type: Application
    Filed: July 13, 2012
    Publication date: January 17, 2013
    Inventors: Eun-Su PARK, Bong-Hwan Kim, Sang-Hak Lim, Taek-Soo Kwak, Jin-Hee Bae, Hui-Chan Yun, Sang-Kyun Kim, Jin-Wook Lee
  • PHOTORESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE BY USING THE SAME
    Publication number: 20120282776
    Abstract: A photoresist underlayer composition includes a solvent, and a polysiloxane resin represented by Chemical Formula 1: {(SiO1.5—Y—SiO1.5)(SiO2)y(XSiO1.5)z}(OH)e(OR1)f.
    Type: Application
    Filed: July 2, 2012
    Publication date: November 8, 2012
    Inventors: Mi-Young KIM, Sang-Kyun KIM, Hyeon-Mo CHO, Chang-Soo WOO, Sang-Ran KOH, Hui-Chan YUN, Woo-Jin LEE, Jong-Seob KIM
  • RESIN COMPOSITION FOR TRANSPARENT ENCAPSULATION MATERIAL AND ELECTRONIC DEVICE FORMED USING THE SAME
    Publication number: 20120270998
    Abstract: A resin composition for a transparent encapsulation material, the resin composition including a polysiloxane obtained by copolymerization of a first silicon compound represented by the following Chemical Formula 1 and a second silicon compound including a compound represented by the following Chemical Formula 2,
    Type: Application
    Filed: June 28, 2012
    Publication date: October 25, 2012
    Inventors: Sang-Ran KOH, June-Ho SHIN, Hyun-Jung AHN, Sung-Hwan CHA, Young-Eun CHOI, Doo-Young JUNG, Sang-Kyun KIM, Jong-Seob KIM
  • RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THE SAME
    Publication number: 20120270981
    Abstract: A resist underlayer composition includes a solvent, and an organosilane condensation polymerization product of: a compound represented by the following Chemical Formula 1, a compound represented by the following Chemical Formula 2, and a compound represented by the following Chemical Formula 3, [R1O]3Si—X ??[Chemical Formula 1] [R2O]3Si—R3 ??[Chemical Formula 2] [R4O]3Si—Si[OR5]3.
    Type: Application
    Filed: July 2, 2012
    Publication date: October 25, 2012
    Inventors: Mi-Young KIM, Woo-Jin LEE, Kwen-Woo HAN, Han-Song LEE, Sang-Kyun KIM, Jong-Seob KIM
  • RESIST UNDERLAYER COMPOSITION AND METHOD OF MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICES USING THE SAME
    Publication number: 20120270143
    Abstract: A resist underlayer composition, including a solvent, and an organosilane condensation polymerization product including about 10 to about 40 mol % of a structural unit represented by Chemical Formula 1:
    Type: Application
    Filed: July 2, 2012
    Publication date: October 25, 2012
    Inventors: Hui-Chan YUN, Sang-Kyun KIM, Hyeon-Mo CHO, Mi-Young KIM, Sang-Ran KOH, Yong-Jin CHUNG, Jong-Seob KIM
  • RESIST UNDERLAYER COMPOSITION AND PROCESS OF PRODUCING INTEGRATED CIRCUIT DEVICES USING THE SAME
    Publication number: 20120267766
    Abstract: A resist underlayer composition includes a solvent and an organosilane condensation polymerization product, the organosilane condensation polymerization product including about 40 to about 80 mol % of a structural unit represented by the following Chemical Formula 1,
    Type: Application
    Filed: July 2, 2012
    Publication date: October 25, 2012
    Inventors: Mi-Young KIM, Sang-Kyun KIM, Hyeon-Mo CHO, Sang-Ran KOH, Hui-Chan YUN, Yong-Jin CHUNG, Jong-Seob KIM
  • Hardmask composition and associated methods
    Patent number: 8273519
    Abstract: A hardmask composition includes a solvent and an organosilicon copolymer. The organosilicon copolymer may be represented by Formula A: (SiO1.5—Y—SiO1.5)x(R3SiO1.5)y??(A) wherein x and y may satisfy the following relations: x is about 0.05 to about 0.9, y is about 0.05 to about 0.9, and x+y=1, R3 may be a C1-C12 alkyl group, and Y may be a linking group including a substituted or unsubstituted, linear or branched C1-C20 alkyl group, a C1-C20 group containing a chain that includes an aromatic ring, a heterocyclic ring, a urea group or an isocyanurate group, or a C2-C20 group containing one or more multiple bonds.
    Type: Grant
    Filed: November 21, 2007
    Date of Patent: September 25, 2012
    Assignee: Cheil Industries, Inc.
    Inventors: Mi Young Kim, Sang Kyun Kim, Sang Hak Lim, Sang Ran Koh, Hui Chan Yun, Do Hyeon Kim, Dong Seon Uh, Jong Seob Kim