Patents by Inventor Satheesh Chellappan

Satheesh Chellappan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SUPERSPEED INTER-CHIP INTERFACE
    Publication number: 20150134866
    Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
    Type: Application
    Filed: January 20, 2015
    Publication date: May 14, 2015
    Inventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar
  • Superspeed inter-chip interface
    Patent number: 8972646
    Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
    Type: Grant
    Filed: March 30, 2012
    Date of Patent: March 3, 2015
    Assignee: Intel Corporation
    Inventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar
  • CONFIGURING A REMOTE M-PHY
    Publication number: 20130297833
    Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface, wherein the SSIC is configured to issue remote register access protocol (RRAP) commands through a local M-PHY to a remote M-PHY in a low speed burst mode.
    Type: Application
    Filed: May 2, 2012
    Publication date: November 7, 2013
    Inventors: Karthi R. Vadivelu, Sridharan Ranganathan, Anoop Mukker, Satheesh Chellappan
  • SUPERSPEED INTER-CHIP COMMUNICATIONS
    Publication number: 20130262731
    Abstract: An interface for low power, high bandwidth communications between units in a device in provided herein. The interface comprises a USB 3.0 system interface and a SuperSpeed inter-chip (SSIC) protocol adaptor configured to facilitate communications between the USB 3.0 system interface and an M-PHY interface.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Inventors: Sridharan Ranganathan, David J. Harriman, Anoop Mukker, Satheesh Chellappan, Karthi R. Vadivelu, Shalini Sharma, Zeeshan Sarwar