Abstract: A main object of the present invention is to provide beneficial improvements relating to a method for producing a fiber reinforced plastic product, the method including curing while pressurizing a prepreg preform by using a core having a fusible part as means for pressurizing.

Abstract: An electronic apparatus includes a sub-system that receives, from a wireless LAN module, incoming data including wireless LAN packets according to plural communication methods and a main system including a processor that process the incoming data. The sub-system includes an interface circuit and a sub-processor. The interface circuit acquires a data length of each of the wireless LAN packets from a header of the wireless LAN packet. Based on MAC addresses included in the wireless LAN packet, the interface circuit identifies a communication method of the wireless LAN packet. Based on the data length and the communication method of the wireless LAN packet, the interface circuit transfers the wireless LAN packet to one of different storage areas respectively corresponding to the communication methods. The sub-processor transfers the wireless LAN packet from the one of the different storage areas to the main system.

Abstract: There is provided a technique for suppressing interference between processes respectively performed in the plurality of reactors. According to one aspect thereof, a substrate processing apparatus includes: a first vessel including a transfer port and a process chamber; a second vessel adjacent to the first vessel and communicating with the first vessel via the transfer port; a lid for closing the transfer port; a seal arranged between the transfer port and the lid; and a controller for controlling the inner pressure of the first vessel to be lower than the inner pressure of the second vessel with the transfer port closed by the lid while the substrate is processed in the process chamber and the inner pressure of the first vessel to be higher than the inner pressure of the second vessel after the substrate is processed and before the first vessel comes into communication with the second vessel.

Abstract: A dental curable composition capable of use as a dental material that can substitute part or all of a natural tooth, in particular, a resin material for dental cutting and machining in the field of dental care. When a block shape usable as the resin material is produced, while mechanical properties and aesthetic properties required for a crown prosthetic appliance are maintained, the dental curable composition can be molded and processed with pressure and heating while strain generated in the block is reduced and no cracks and chipping occur. The dental curable composition includes (a) a polymerizable monomer and (b) a filler in a weight ratio of 10:90 to 70:30, and 0.01 to 10 parts by weight of (c) a polymerization initiator and 0.001 to 1 part by weight of (d) a chain transfer agent being a terpenoid compound based on 100 parts by weight of the polymerizable monomer (a).

Abstract: A technique capable of suppressing a displacement of a substrate with respect to a mounting table when transferring the substrate by rotating an arm and placing the substrate transferred by the arm on the mounting table is provided. According to one aspect thereof, there is provided a substrate processing apparatus including: a transfer device including: a shaft; and an arm extending from the shaft, wherein the transfer device transferring a substrate to a location above a mounting table by rotating the arm supporting the substrate; a detector configured to detect the substrate; a transfer controller controlling the transfer device to detect a transfer displacement of the substrate with respect to the arm based on a result detected by the detector and to correct a positional displacement of the substrate with respect to the mounting table; and a processing structure in which a process with respect to the substrate is performed.

Abstract: A flush toilet apparatus includes a toilet body that includes a rim water spout port, a tank that stores washing water, a rim side water supply channel that supplies washing water to the rim water spout port, a tank side water supply channel that supplies washing water to the tank, a flow channel switching part that adjusts an amount of washing water that is supplied to one or both of the rim side water supply channel and the tank side water supply channel, and an electrical power failure detection part that detects electrical power failure, wherein, in a case where electrical power failure is caused when washing water is supplied to the tank side water supply channel, the flow channel switching part decreases washing water that is supplied to the tank side water supply channel and increases washing water that is supplied to the rim side water supply channel.

Abstract: A flush toilet apparatus includes a toilet body that includes a rim water spout port, a tank that stores washing water, a rim side water supply channel that supplies washing water to the rim water spout port, a tank side water supply channel that supplies washing water to the tank, a flow channel switching part that adjusts an amount of washing water that is supplied to one or both of the rim side water supply channel and the tank side water supply channel, and an electrical power failure detection part that detects electrical power failure, wherein, in a case where electrical power failure is caused when washing water is supplied to the tank side water supply channel, the flow channel switching part decreases washing water that is supplied to the tank side water supply channel and increases washing water that is supplied to the rim side water supply channel.

Abstract: Described herein is a technique capable of forming a film so as to fill a recess of a substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate mounting table on which a substrate is placed; an adsorption inhibiting gas supplier configured to supply an adsorption inhibiting gas onto a surface of the substrate from above the substrate mounting table; and a source gas supplier configured to supply a source gas onto the surface of the substrate from above the substrate mounting table, wherein a distance D1 between a gas supply port provided in the adsorption inhibiting gas supplier and the substrate is greater than a distance D2 between a gas supply port provided in the source gas supplier and the substrate.

Abstract: A substrate processing technique includes a substrate mounting table including a substrate mounting surface for a substrate; a process container for accommodating the substrate mounting table and forming a process chamber for processing the substrate mounted on the substrate mounting surface; at least one gas supplier for suppling a processing gas to the process chamber; a first wall arranged on an outer peripheral side of the at least one substrate mounting table; a second wall arranged at an outer side of the first wall on the outer peripheral side of the substrate mounting table; at least one exhaust flow path formed between the first wall and the second wall and configured to discharge a gas in the process chamber; and a shield plate arranged below the substrate mounting table and extending at least to a lower side of a lower end of the second wall.

Abstract: According to one aspect of the present disclosure, there is provided a technique that includes: a substrate retainer; a reaction tube; a heater configured to heat an inside of the reaction tube; a gas supplier configured to supply a process gas to substrates accommodated in the reaction tube; an exhauster configured to exhaust the process gas from the inside of the reaction tube; a temperature detector configured to measure an inner temperature of the reaction tube; a reflectance detector configured to measure a reflectance of a film formed by supplying the process gas through the gas supplier; and a controller configured to be capable of performing a feedback control of film-forming conditions on the substrates accommodated in the reaction tube by using temperature information measured by the temperature detector and reflectance information measured by the reflectance detector.

Abstract: An electronic apparatus includes a sub-system that receives, from a wireless LAN module, incoming data including wireless LAN packets according to plural communication methods and a main system including a processor that process the incoming data. The sub-system includes an interface circuit and a sub-processor. The interface circuit acquires a data length of each of the wireless LAN packets from a header of the wireless LAN packet. Based on MAC addresses included in the wireless LAN packet, the interface circuit identifies a communication method of the wireless LAN packet. Based on the data length and the communication method of the wireless LAN packet, the interface circuit transfers the wireless LAN packet to one of different storage areas respectively corresponding to the communication methods. The sub-processor transfers the wireless LAN packet from the one of the different storage areas to the main system.

Abstract: Described herein is a technique capable of forming a film so as to fill a recess of a substrate. According to one aspect thereof, there is provided a substrate processing apparatus including: a substrate mounting table on which a substrate is placed; an adsorption inhibiting gas supplier configured to supply an adsorption inhibiting gas onto a surface of the substrate from above the substrate mounting table; and a source gas supplier configured to supply a source gas onto the surface of the substrate from above the substrate mounting table, wherein a distance D1 between a gas supply port provided in the adsorption inhibiting gas supplier and the substrate is greater than a distance D2 between a gas supply port provided in the source gas supplier and the substrate.

Abstract: The water conduit has: a first water-guiding portion extending from a water supply portion, where the flush water is supplied to the water conduit, to a first spout port located on one of right and left sides of the bowl portion; and a second water-guiding portion extending from the water supply portion to a second spout port located on the other side. The water supply portion is located at a position on the one side. The flush water is supplied to the water supply portion in a direction from the water supply portion toward the first water-guiding portion. A collision wall is provided on a way of the first water-guiding portion such that at least a part of the supplied flush water collides with the collision wall. The at least part of the flush water having collided with the collision wall is supplied to the second water-guiding portion.

Abstract: A flush toilet includes a first rim spout port provided in a rim on one side in a left-right direction of a bowl and a second rim spout port provided in the rim on the other side in the left-right direction of the bowl. The first rim spout port is disposed further in the front than the front end of a well portion. The second rim spout port causes the second rim spout to traverse a swirling direction of a swirling flow of the first rim spout and guide the flush water interfering with the swirling flow of the first rim spout to a rear region of the bowl further on the rear side than the well portion.

Abstract: Disclosed is a substrate processing apparatus capable of improving the characteristic of a film formed on the surface of a wafer, using a single-wafer type substrate processing apparatus which heats and processes a wafer. The substrate processing apparatus may include: a processing vessel where a substrate is processed; a substrate supporter including: a first heater configured to heat the substrate to a first temperature; and a substrate placing surface where the substrate is placed; a heated gas supply system including a second heater configured to heat an inert gas, wherein the heated gas supply system is configured to supply a heated inert gas into the processing vessel; and a controller configured to control the first heater and the second heater such that a temperature of a front surface of the substrate and a temperature of a back surface of the substrate are in a predetermined range.

Abstract: The water conduit has: a first water-guiding portion extending from a water supply portion, where the flush water is supplied to the water conduit, to a first spout port located on one of right and left sides of the bowl portion; and a second water-guiding portion extending from the water supply portion to a second spout port located on the other side. The water supply portion is located at a position on the one side. The flush water is supplied to the water supply portion in a direction from the water supply portion toward the first water-guiding portion. A collision wall is provided on a way of the first water-guiding portion such that at least a part of the supplied flush water collides with the collision wall. The at least part of the flush water having collided with the collision wall is supplied to the second water-guiding portion.

Abstract: There is provided a technique that includes: a reactor including a process chamber where substrate is processed, the reactor being fixed to a vacuum transfer chamber; a substrate mounting stand disposed in the reactor and having substrate mounting surface where the substrate is mounted; a heater heating the substrate; a gas supply part supplying gas into the process chamber; an extraction part extracting basic information for estimating position of the substrate mounting surface; a calculation part calculating estimated position information of center of the substrate mounting surface based on the basic information; a transfer robot disposed in the vacuum transfer chamber and including an end effector supporting the substrate when the substrate is transferred; and a controller performing control to set target coordinate of the end effector according to the estimated position information, move the end effector to the target coordinate, and mount the substrate on the substrate mounting surface.

Abstract: There is provided a technique that includes: a reactor including a process chamber where substrate is processed, the reactor being fixed to a vacuum transfer chamber; a substrate mounting stand disposed in the reactor and having substrate mounting surface where the substrate is mounted; a heater heating the substrate; a gas supply part supplying gas into the process chamber; an extraction part extracting basic information for estimating position of the substrate mounting surface; a calculation part calculating estimated position information of center of the substrate mounting surface based on the basic information; a transfer robot disposed in the vacuum transfer chamber and including an end effector supporting the substrate when the substrate is transferred; and a controller performing control to set target coordinate of the end effector according to the estimated position information, move the end effector to the target coordinate, and mount the substrate on the substrate mounting surface.

Abstract: For enhancing productivity, an apparatus comprises a vertical type process furnace configured to simultaneously process N substrates (1<N); a loading chamber provided under the vertical type process furnace and configured to transfer the substrate retainer into or out of the vertical type process furnace; a plurality of single-wafer type process furnaces provided adjacent to the loading chamber, each of the plurality of single-wafer type process furnaces being stacked in at least 2 stages and configured to simultaneously process M substrates (M<N); and a transfer chamber module provided adjacent to the loading chamber and the plurality of the single-wafer type process furnaces and provided with a transfer device.

Abstract: A water passage in a front region of a bowl of a toilet includes an upstream side water passage and a downstream side water passage formed on the upstream side and on the downstream side, respectively, of a front end of the bowl surface. The curvature radius of the downstream side water passage in a plan view is set to be smaller than the curvature radius of the upstream side water passage in a plan view. The water passage in the front region of the bowl has a flow path vertical cross-section that is taken in the vertical direction and is formed between a shelf surface and an overhanging part. The cross-sectional area of the flow path vertical cross-section taken in the vertical direction is set to be the smallest in a front end of the water passage.