Abstract: A memory module includes at least one CAR and a plurality of DRAMs provided so as to be close and adjacent to one another on one face and the other face of a module substrate. The DRAMs are divided into a plurality of memory groups. Memory groups adjacent to each other of these memory groups are paired with each other. One of this pair is a 1-ranked memory group and the other is a 2-ranked memory group. This pair of the memory groups is connected to the CAR via short wiring with a T-branch structure having a short stub. One of the pair of the memory groups on the signal-reception side functions as an open end. Active termination is performed by a termination resistor of the other of the pair of the memory groups on the signal-non-reception side. Subsequently, signal reflections can be reduced.

Abstract: There is the problem that since C/A signals in a DIMM are distributed to respective DRAMs through a register in the DIMM and DQ signals are wired directly from terminals in the DIMM, their timing is difficult to synchronize. The register for speeding up the C/A signals of the DIMM that operates with high speed is provided, and a wiring from the register is set to a daisy-chain wiring. Then, by a timing adjustment circuit provided in the DRAM, a wiring delay time difference between the C/A signals and the clock signals, which are different depending on positions of the DRAMs, is such that the sum of a delay time from the register to each DRAM and a delay amount due to the timing adjustment circuit is made equal to a delay time of the farthest DRAM.

Abstract: A COC DRAM including a plurality of stacked DRAM chips is mounted on a motherboard by using an interposer. The interposer includes a Si unit and a PCB. The Si unit includes a Si substrate and an insulating-layer unit in which wiring is installed. The PCB includes a reference plane for the wiring in the Si unit. The wiring topology between a chip set and the COC DRAM is the same for every signal. Accordingly, a memory system enabling a high-speed operation, low power consumption, and large capacity is provided.

Abstract: A memory module includes at least one CAR and a plurality of DRAMs provided so as to be close and adjacent to one another on one face and the other face of a module substrate. The DRAMs are divided into a plurality of memory groups. Memory groups adjacent to each other of these memory groups are paired with each other. One of this pair is a 1-ranked memory group and the other is a 2-ranked memory group. This pair of the memory groups is connected to the CAR via short wiring with a T-branch structure having a short stub. One of the pair of the memory groups on the signal-reception side functions as an open end. Active termination is performed by a termination resistor of the other of the pair of the memory groups on the signal-non-reception side. Subsequently, signal reflections can be reduced.

Abstract: A point-to-point bus and a daisy chain bus are provided for supplying signals to stacked memories, and the stacked memories are mounted mutually apart by a distance equivalent to the length of the stacked memory on both surfaces of a module substrate. Furthermore, the memory chips arranged in a stacked memory mounted on one surface are set in an active state at the same time alternately with the memory chips arranged in a stacked memory mounted on another surface of the module substrate.

Abstract: Each of stacked memory chips has an ID generator circuit for generating identification information in accordance with its manufacturing process. Since the memory chip manufacturing process implies process variations, the IDs generated by the respective ID generator circuits are different from one another even though the ID generator circuits are identical in design. A memory controller instructs an ID detector circuit to detect the IDs of the respective memory chips, and individually controls the respective memory chips based on the detected IDs.

Abstract: Disclosed is an input/output circuit having a terminating circuit that contributes to a smaller chip area. The input/output includes an output buffer having a first series circuit, which comprises a first transistor and a resistor and a second series circuit, which comprises a second transistor and a resistor, connected in parallel between a high-potential power supply and an input/output pin, as well as a third series circuit, which comprises a third transistor and a resistor and a fourth series circuit, which comprises a fourth transistor and a resistor, connected in parallel between the input/output pin and a low-potential power supply.

Abstract: The present invention provides a semiconductor apparatus including an internal clock generating unit and a data storing unit. The internal clock generating unit generates an internal clock signal based on an external clock signal and a clock control signal. The data storing unit which operates data processing based on the internal clock signal. The internal clock generating unit carries out synchronous control such that the internal clock signal is synchronized with the external clock signal. The data storing unit generates the clock control signal based on the data processing and outputs the clock control signal to the internal clock generating unit to control the synchronous control. The data storing unit may controls the internal clock generating unit such that the synchronous control is adjourned or restrained temporarily while the data processing is a data reading process.

Abstract: Disclosed is an input/output circuit having a terminating circuit that contributes to a smaller chip area. The input/output includes an output buffer having a first series circuit, which comprises a first transistor and a resistor and a second series circuit, which comprises a second transistor and a resistor, connected in parallel between a high-potential power supply and an input/output pin, as well as a third series circuit, which comprises a third transistor and a resistor and a fourth series circuit, which comprises a fourth transistor and a resistor, connected in parallel between the input/output pin and a low-potential power supply.

Abstract: Semiconductor integrated circuit devices that operate under different power supply voltages are directly interconnected by a bidirectional bus which is a transmission line. A driver is of a push-pull type and a reception side is CTT-terminated. If a terminating resistor is in conformity with the characteristic impedance of the transmission line, the on resistance of the driver is equal to or lower than the characteristic impedance. If the on resistance of the driver is in conformity with the characteristic impedance of the transmission line, the value of the terminating resistor is equal to or lower than the characteristic impedance of the transmission line. If the reception side is VTT-terminated, the value of the VTT is {fraction (1/2)} of a lower one of power supply voltages that are supplied to the respective semiconductor integrated circuit devices. The value of the terminating resistor is in conformity with the characteristic impedance of the transmission line.

Abstract: A semiconductor unit constituting a memory device has a memory chip, a package substrate having three wiring layers. Power-supply surfaces (VDD surface) and (GND surface) are wired on the package substrate while an intra-package DQ bus is wired on an intermediate layer between both of the power-supply surfaces. The memory device has two DQ pins every one intra-package DQ bus. The intra-package DQ bus is connected to a signal terminal pad of the memory chip through a via hole. In view of the two DW pins, a via hole for connecting the intra-package DQ bus with the signal terminal pad constitutes a branch wire.

Abstract: A memory module has a plurality of DRAMs (115), which share a bus line, on the front surface and the back surface of a board. The bus line is connected through a via hole (113) from a terminal (111) to one end of a strip line (112), and the other end of the strip line is connected to a strip line in the other layer through a via hole (119) provided for looping back the line. A termination resistor (120), provided near a termination voltage terminal (VTT), is connected to the looped-back strip line in the other layer through a via hole. The DRAM terminals are connected to the strip line each through a via hole. This memory module is mounted on a motherboard, on which a memory controller is provided, through a connector. The effective characteristic impedance of the bus line is matched with the characteristic impedance of the line in the motherboard.

Abstract: First and second pre-processing flip-flops latch a command/address signal inputted to a register by a clock having a frequency of ½ of an external clock signal and an inverse clock thereof. Thus, the command/address signal is decomprossed to a set of signals which temporarily has two times. For example, one of the set of signals has only data contents of an odd-th command/address signal, and the other has only data contents of an even-th command/address signal. Since the set of signals has twice periods of the command/address signal, first and second post-processing flip-flop can latch signals in accordance with an internal clock signal generated by a delay locked loop circuit in a state in which a set-up time and a hold time are sufficiently assured.

Abstract: A memory module comprises a stab resistor between a pin and one end of a bus. A plurality of memory chips is connected to the bus between both ends thereof. A terminating resistor is connected to the other end of the bus.

Abstract: The present invention provides a semiconductor apparatus including an internal clock generating unit and a data storing unit. The internal clock generating unit generates an internal clock signal based on an external clock signal and a clock control signal. The data storing unit which operates data processing based on the internal clock signal. The internal clock generating unit carries out synchronous control such that the internal clock signal is synchronized with the external clock signal. The data storing unit generates the clock control signal based on the data processing and outputs the clock control signal to the internal clock generating unit to control the synchronous control. The data storing unit may controls the internal clock generating unit such that the synchronous control is adjourned or restrained temporarily while the data processing is a data reading process.

Abstract: Disclosed are a memory command address system and a memory module that can be operated not only for 266 MHzCLK but also for 200 MHzCLK, in which clock timings in the input sections of a PLL, a register, and a DRAM are matched to one another, a DLL (delay locked loop) is provided in the register, the output timing of CA signal from the register is controlled so that the setup time margin and the hold time margin of the CA signal with respect to the clock signal with the additional latency in the DRAM=1.5 or 2.0 are equated to each other, such that clock operation of 266 MHz, for example, is made possible. If both 266 MHz and 200 MHz are used, by taking account of the timing budget, control is made for retarding the timing of the CA signal input to the flip-flop which receives an internal clock signal (intCLK) supplied to the flip-flop for determining the CA signal output timing from the register.

Abstract: A module substrate has a plurality of module data terminal pairs individually provided in association with respective chip data terminals in a plurality of memory chips, and a plurality of module data wirings which respectively connect between the plurality of module data terminal pairs. The plurality of module data wirings are connected to their corresponding chip data terminals and are configured so as to be available as a memory access data bus. In a memory system in which a plurality of memory modules are arranged in parallel, module data wirings of each individual memory modules are connected in serial form, and each individual module data wirings do not constitute branch wirings with respect to a data bus on a motherboard of the memory system. In the memory modules, parallel access for the number of bits corresponding to the width of the memory access data bus is assured.

Abstract: Disclosed is an input/output circuit having a terminating circuit that contributes to a smaller chip area. The input/output includes an output buffer having a first series circuit, which comprises a first transistor and a resistor and a second series circuit, which comprises a second transistor and a resistor, connected in parallel between a high-potential power supply and an input/output pin, as well as a third series circuit, which comprises a third transistor and a resistor and a fourth series circuit, which comprises a fourth transistor and a resistor, connected in parallel between the input/output pin and a low-potential power supply.

Abstract: A semiconductor apparatus comprises a resistor formed in a driver to connect a driving device to a transmission line connecting the driver to a receiver. The resistor has resistance considerably larger than on-state resistance of the driving device on condition that the resistor matches output impedance of the driver with impedance of the transmission line. The transmission line has length decided so that a reflected wave from a receiver-side end of the transmission line reaches the driver while a driving signal supplied to the driver has a logical high or low level.

Abstract: In a memory device having a controller and multiple memory modules both of which are mounted together on a motherboard, a high-speed operation is executed by suppressing waveform distortion caused by signal reflection. Since signal reflection occurs when a controller performs the writing/reading of data relative to memory units on memory modules, active terminator units are included in the controller and the memory units. These active terminator units are provided for a data bus and/or a clock bus in order to terminate these buses in memory units. The active terminator units provided for the controller and the memory units may be put into an inactive state when data is to be received.