Abstract: Provided are an equalizer and a semiconductor memory device including the same. The equalizer includes a delay circuit and an inverting circuit. The delay circuit is configured to output, in response to a select signal, one of a delay signal delaying an input signal applied to an input/output node and an inverted signal inverting the input signal. The inverting circuit is configured to invert a signal provided from the delay circuit and output the inverted signal to the input/output node. The equalizer is configured such that when the delay circuit outputs the delay signal, the equalizer operates as an inductive bias circuit amplifying the input signal and outputting the amplified input signal, and when the delay circuit outputs the inverted signal, the equalizer operates as a latch circuit storing and outputting the input signal.

Abstract: A semiconductor memory device includes; a memory cell array comprising a first sub-memory cell array storing first data having a first characteristic and a second sub-memory cell array storing second data having a second characteristic different from the first characteristic, a first peripheral circuit operatively associated with only the first sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the first sub-memory cell array, and a second peripheral circuit operatively associated with only the second sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the second sub-memory cell array.

Abstract: A buffer circuit includes a first differential amplifier, second differential amplifier, third differential amplifier, and mixer. The first differential amplifier generates a positive differential signal and a negative differential signal based on an input signal and a reference voltage signal. The second differential amplifier generates a first signal based on the positive differential signal and the negative differential signal. The third differential amplifier generates a second signal having a different phase from the first signal based on the positive differential signal and the negative differential signal. The mixer outputs a signal, generated by mixing the first signal and the second signal, as an output signal.

Abstract: An on-die termination (ODT) circuit includes a calibration unit, an offset-code generating unit, an adder, and an ODT unit. The calibration unit generates a pull-up code and a pull-down code. The offset-code generates a pull-up offset code and a pull-down offset code based on a mode-register-set signal, the pull-up code, and the pull-down code. The adder adds the pull-up offset code and the pull-down offset code to the pull-up code and the pull-down code, respectively, and generates a pull-up calibration code and a pull-down calibration code. The ODT unit changes ODT resistance in response to the pull-up calibration code and the pull-down calibration code.

Abstract: An input buffer includes a first buffer, a feedback circuit and a second buffer circuit. The feedback circuit includes a feedback resistor and a feedback inverter. The first buffer may be configured to output an amplification signal to an output node of the first buffer based on an input signal. The feedback circuit connected to the output node of the first buffer may be configured to control the amplification signal. The second buffer circuit may be configured to output a buffer output signal by buffering the amplification signal. The feedback resistor may receive the amplification signal from the output node of the first buffer and provide a feedback signal to a feedback node. The feedback inverter is connected between the feedback node and the output node. The feedback inverter may be configured to control the amplification signal based on the feedback signal.

Abstract: A semiconductor memory device includes a ZQ calibration unit configured to generate a pull-up VOH code according to a first target VOH proportional to a power supply voltage and an output driver configured to generate a data signal having a VOH proportional to the power supply voltage based on the pull-up VOH code, wherein VOH means “output high level voltage.

Abstract: An input buffer includes a first buffer, a feedback circuit and a second buffer circuit. The feedback circuit includes a feedback resistor and a feedback inverter. The first buffer may be configured to output an amplification signal to an output node of the first buffer based on an input signal. The feedback circuit connected to the output node of the first buffer may be configured to control the amplification signal. The second buffer circuit may be configured to output a buffer output signal by buffering the amplification signal. The feedback resistor may receive the amplification signal from the output node of the first buffer and provide a feedback signal to a feedback node. The feedback inverter is connected between the feedback node and the output node. The feedback inverter may be configured to control the amplification signal based on the feedback signal.

Abstract: An input data alignment circuit includes a data sampler, a frequency divider, a polarity determination block, and a data alignment block. The data sampler provides a data sequence based on data serially input according to a data strobe signal. The frequency divider generates a data alignment signal based on a divided frequency of the data strobe signal. The polarity determination block determines a polarity of the data alignment signal and provides a control signal based on the determined polarity. The data alignment block aligns the data sequence in parallel according to data alignment signal and control signal and generates output data.

Abstract: An injection-locked phase-locked loop (ILPLL) circuit includes a delay-locked loop (DLL) and an ILPLL. The DLL is configured to generate a DLL clock by performing a delay-locked operation on a reference clock. The ILPLL includes a voltage-controlled oscillator (VCO), and is configured to generate an output clock by performing an injection synchronous phase-locked operation on the reference clock. The DLL clock is injected into the VCO as an injection clock of the VCO.

Abstract: An integrated circuit device includes an external power supply input configured to be coupled to an external power supply and a digital circuit, such as a clock signal generator circuit, that generates noise at a power supply input thereof. The device further includes a replica load circuit and a power supply circuit coupled to the external power supply input, to a power supply input of the digital circuit and to a power supply input of the replica load circuit. The power supply circuit is configured to selectively couple the external power supply node to the power supply input of the digital circuit responsive to a voltage at the power supply input of the replica load circuit. The replica load circuit may be configured to provide a load that varies responsive to a voltage at the power supply input of the digital circuit.

Abstract: A touch screen device and an operating method are provided in which only a specific position on a touch screen is activated to receive signals. The touch screen device includes a screen including a display configured to display menu images thereon and a detector configured to detect a screen touch, and a controller configured to control operations of the device according to the screen touch detected by the detector. The controller may cause the detector to be divided into an execution area configured to execute a menu when the menu placed on the execution area is touched, and a selection area configured to sequentially move the menu images to the execution area when the selection area is touched. Alternatively, the controller may cause the detector to be divided into a moving area configured to move a menu from a touch point along a drag line while the menu is dragged, and an execution area configured to execute the relevant menu when the touch on the execution area is released.

Abstract: A duty cycle corrector includes a sensing unit, a pad unit, a fuse unit, and a driver unit. The sensing unit generates at least one sensing signal based on the sensed duty cycle ratio of an output signal. The pad unit outputs at least one decision signal based on the at least one sensing signal. The fuse unit generates a duty cycle control signal based on at least one received fuse control signal. The driver unit adjusts a duty cycle ratio of an input signal to generate the output signal based on the duty cycle control signal. The driver unit adjusts the duty cycle ratio of the input signal by adjusting a pull-up strength or a pull-down strength of the input signal based on the duty cycle control signal.

Abstract: A semiconductor device may include a coding lookup table unit including a plurality of coding lookup tables each of which is selected by a respectively selection signal, and a selection unit configured to receive one of N-bit parallel data and extract respective encoded data corresponding to the selection signal and to which the N-bit parallel data is mapped from the coding lookup table unit, and encoded data and extract respective N-bit parallel data corresponding to the selection signal and to which the encoded data is mapped from the coding lookup table unit, wherein N is 2 or an integer greater than 2, and wherein the coding lookup tables respectively store a plurality of coded data patterns that respectively correspond to patterns of the N-bit parallel data and are random temporally and spatially.

Abstract: A touch screen device and an operating method are provided in which only a specific position on a touch screen is activated to receive signals. The touch screen device includes a screen including a display configured to display menu images thereon and a detector configured to detect a screen touch, and a controller configured to control operations of the device according to the screen touch detected by the detector. The controller may cause the detector to be divided into an execution area configured to execute a menu when the menu placed on the execution area is touched, and a selection area configured to sequentially move the menu images to the execution area when the selection area is touched. Alternatively, the controller may cause the detector to be divided into a moving area configured to move a menu from a touch point along a drag line while the menu is dragged, and an execution area configured to execute the relevant menu when the touch on the execution area is released.

Abstract: An input data alignment circuit includes a data sampler, a frequency divider, a polarity determination block, and a data alignment block. The data sampler provides a data sequence based on data serially input according to a data strobe signal. The frequency divider generates a data alignment signal based on a divided frequency of the data strobe signal. The polarity determination block determines a polarity of the data alignment signal and provides a control signal based on the determined polarity. The data alignment block aligns the data sequence in parallel according to data alignment signal and control signal and generates output data.

Abstract: A semiconductor memory device includes; a memory cell array comprising a first sub-memory cell array storing first data having a first characteristic and a second sub-memory cell array storing second data having a second characteristic different from the first characteristic, a first peripheral circuit operatively associated with only the first sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the first sub-memory cell array, and a second peripheral circuit operatively associated with only the second sub-memory cell array to execute at least one of a read operation and a write operation directed to a target memory cell of the second sub-memory cell array.

Abstract: A method of communication to a semiconductor device includes: transmitting a sampling clock signal from a first semiconductor device to a second semiconductor device; transmitting a training signal from the first semiconductor device to the second semiconductor device while transmitting of the sampling clock signal, the training signal comprising plural test patterns sent sequentially to the second semiconductor device, phases of at least some of the test patterns being adjusted to be different from each other during transmitting of the training signal; receiving first information from the second semiconductor device over a first signal line, the first signal line separate from a data bus connected between the first semiconductor device and the second semiconductor device; and transmitting a data signal over the data bus while transmitting the sampling clock signal, the data signal sent at a timing with respect to the sampling clock signal responsive to the received first information.

Abstract: An on-die termination (ODT) circuit includes a calibration unit, an offset-code generating unit, an adder, and an ODT unit. The calibration unit generates a pull-up code and a pull-down code. The offset-code generates a pull-up offset code and a pull-down offset code based on a mode-register-set signal, the pull-up code, and the pull-down code. The adder adds the pull-up offset code and the pull-down offset code to the pull-up code and the pull-down code, respectively, and generates a pull-up calibration code and a pull-down calibration code. The ODT unit changes ODT resistance in response to the pull-up calibration code and the pull-down calibration code.

Abstract: Provided are an equalizer and a semiconductor memory device including the same. The equalizer includes a delay circuit and an inverting circuit. The delay circuit is configured to output, in response to a select signal, one of a delay signal delaying an input signal applied to an input/output node and an inverted signal inverting the input signal. The inverting circuit is configured to invert a signal provided from the delay circuit and output the inverted signal to the input/output node. The equalizer is configured such that when the delay circuit outputs the delay signal, the equalizer operates as an inductive bias circuit amplifying the input signal and outputting the amplified input signal, and when the delay circuit outputs the inverted signal, the equalizer operates as a latch circuit storing and outputting the input signal.

Abstract: A memory device includes a clock receiving block, a data transceiver block, a phase detection block, and a phase information transmitter. The clock receiving block is configured to receive a clock signal from a memory controller through a clock signal line and generate a data sampling clock signal and an edge sampling clock signal. The data transceiver block is configured to receive a data signal from the memory controller through a data signal line. The phase detection block is configured to generate phase information in response to the data sampling clock signal, the edge sampling clock signal and the data signal. The phase information transmitter is configured to transmit the phase information to the memory controller through a phase information signal line that is separate from the data signal line.