Abstract: One embodiment of the present disclosure provides an electrolytic copper foil includes a copper layer and has a width direction weight deviation of 5% or less calculated according to Equation 1 below, a tensile strength of 25 kgf/mm2 to 62 kgf/mm2, and a valley depth-to-thickness (VDT) of 3.5 to 66.9 calculated according to Equation 2 below. width direction weight deviation (%)=(standard deviation of weight/arithmetic mean of weight)×100, and??[Equation 1] VDT=[thickness of electrolytic copper foil]/[maximum valley depth of roughness profile(Rv)].

Abstract: The present disclosure relates to an apparatus for accommodating copper foil. The apparatus includes an accommodation body in which an accommodation space for accommodating copper foil wound on a core is provided, a first support portion coupled to the accommodation body to support one side of the core, a second support portion coupled to the accommodation body to support the other side of the core, a first damper portion coupled to the first support portion to be disposed between the first support portion and the one side of the core, and a second damper portion coupled to the second support portion to be disposed between the second support portion and the other side of the core, wherein the first damper portion includes a first damper body coupled to the first support portion and a plurality of first damper protrusions protruding from the first damper body.

Abstract: Embodiments include a method comprising identifying, by an instruction scheduler of a processor core, a first high power instruction in an instruction stream to be executed by an execution unit of the processor core. A pre-charge signal is asserted indicating that the first high power instruction is scheduled for execution. Subsequent to the pre-charge signal being asserted, a voltage boost signal is asserted to cause a supply voltage for the execution unit to be increased. A busy signal indicating that the first high power instruction is executing is received from the execution unit. Based at least in part on the busy signal being asserted, de-asserting the voltage boost signal. More specific embodiments include decreasing the supply voltage for the execution unit subsequent to the de-asserting the voltage boost signal. More Further embodiments include delaying asserting the voltage boost signal based on a start delay time.

Abstract: Disclosed is a method for mass-producing densified carbon nanotube fiber. The method includes preparing carbon nanotube fiber, swelling the carbon nanotube fiber by applying an acid solution thereto, and stretching the carbon nanotube fiber, coagulating the stretched carbon nanotube fiber so as to remove the acid solution present therein, and drying the coagulated carbon nanotube fiber.

Abstract: The present disclosure provides an apparatus capable of continuously producing carbon nanotubes having high crystallinity, a low residual catalyst content and a high aspect ratio. The apparatus for producing carbon nanotubes includes: a reaction unit configured to synthesize carbon nanotubes (CNTs), a supply unit configured to supply a carbon source to the reaction unit through a supply pipe; and a collection unit configured to collect carbon nanotubes discharged from the reaction unit, wherein the reaction unit may include a chemical vapor deposition reactor.

Abstract: The present invention relates to a copper foil current collector having superior adhesion to an active material of a Li secondary battery. The electrolytic copper foil of the present invention having a first surface and a second surface comprises: a first protective layer at the first surface; a second protective layer at the second surface; and a copper film between the first and second protective layers, wherein an oxygen-containing part at the second surface has a thickness (OT) of not less than 1.5 nm. According to the present invention, an electrolytic copper foil current collector for a Li secondary battery, which has low electric resistance and high adhesion to an active material, can be provided.

Abstract: Disclosed are an electrolytic copper foil the fold and/or wrinkle of which can be avoided or minimized during a roll-to-roll process, a method for manufacturing the same, and an electrode and a secondary battery which are produced with such electrolytic copper foil so that high productivity can be guaranteed. An electrolytic copper foil of the disclosure has a longitudinal rising of 30 mm or less and a transverse rising of 25 mm or less, and the transverse rising is 8.5 times the longitudinal rising or less.

Abstract: The present invention relates to an electrolytic copper foil having excellent handling characteristics in the manufacture of copper foil and in post-processing for manufacturing a secondary battery. The present invention provides an electrolytic copper foil having a first surface and a second surface, wherein the texture coefficient of the (220) plane of the electrolytic copper foil is 0.4-1.32, the difference (|?(Rz/Ra)|) between Rz/Ra on the first surface and Rz/Ra on the second surface, of the electrolytic copper foil, is less than 2.42, and the difference (|?PD|) in peak density (PD) between the first surface and the second surface, of the electrolytic copper foil, is 96 ea or less.

Abstract: The present invention relates to: an electrolytic copper foil having high dimensional stability and texture stability in a high temperature environment of a process for manufacturing an Li secondary battery; and a manufacturing method therefor. The electrolytic copper foil of the present invention has a thermal expansion coefficient of 17.1-22 ?m/(m·° C.) in a temperature region of 30-190° C., has a variation of full width at half maximum of the (220) plane of 0.81-1.19 according to heat treatment for 30 minutes at 190° C., and has a weight deviation of 5% or less in the transverse direction.

Abstract: An easily handleable electrolytic copper foil securing a highly durable secondary battery, an electrode including same, a secondary battery including same, and a method of manufacturing same. The electrolytic copper foil including first and second surfaces includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, a first protective layer formed on the matte surface of the copper layer, and a second protective layer formed on the shiny surface of the copper layer. A coefficient of thermal expansion of the electrolyte copper foil measured using thermomechanical analyzer while heating the electrolytic copper foil from 30 to 190° C. at 5° C./min ranges from 16 to 22 ?m/(m·° C.), tensile strength of the electrolytic copper foil measured after heat treatment at 190° C., ranges from 21 to 36 kgf/mm2, and weight deviation of the electrolytic copper foil is 5% or less.

Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 ?m and a texture coefficient bias [TCB(220)] of 0.52 or less.

Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/?m+peak density/30+amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.

Abstract: Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 ?m to 3.5 ?m, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.

Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.

Abstract: An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.

Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 ?m.

Abstract: An electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein when a correlation between a thermal treatment temperature of the electrolytic copper foil for a lithium secondary battery, which corresponds to a variable x, and an elongation increment ratio of the electrolytic copper foil for a lithium secondary battery, which corresponds to a variable y, is expressed as y=ax+b (100?x?200) on an x-y two-dimensional graph, the “a” value is in the range of 0.0009 to 0.0610.

Abstract: An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.

Abstract: Embodiments include a method comprising identifying, by an instruction scheduler of a processor core, a first high power instruction in an instruction stream to be executed by an execution unit of the processor core. A pre-charge signal is asserted indicating that the first high power instruction is scheduled for execution. Subsequent to the pre-charge signal being asserted, a voltage boost signal is asserted to cause a supply voltage for the execution unit to be increased. A busy signal indicating that the first high power instruction is executing is received from the execution unit. Based at least in part on the busy signal being asserted, de-asserting the voltage boost signal. More specific embodiments include decreasing the supply voltage for the execution unit subsequent to the de-asserting the voltage boost signal. More Further embodiments include delaying asserting the voltage boost signal based on a start delay time.

Abstract: Embodiments include an apparatus comprising an execution unit coupled to a memory, a microcode controller, and a hardware controller. The microcode controller is to identify a global power and performance hint in an instruction stream that includes first and second instruction phases to be executed in parallel, identify a local hint based on synchronization dependence in the first instruction phase, and use the first local hint to balance power consumption between the execution unit and the memory during parallel executions of the first and second instruction phases. The hardware controller is to use the global hint to determine an appropriate voltage level of a compute voltage and a frequency of a compute clock signal for the execution unit during the parallel executions of the first and second instruction phases. The first local hint includes a processing rate for the first instruction phase or an indication of the processing rate.