Patents by Inventor Seung-Min Kim

Seung-Min Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10787752
    Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 ?m and a texture coefficient bias [TCB(220)] of 0.52 or less.
    Type: Grant
    Filed: September 10, 2018
    Date of Patent: September 29, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Jeong Gil Lee
  • Publication number: 20200277705
    Abstract: The present invention relates to an electrolytic copper foil current collector where the surface properties are controlled to achieve a high adhesiveness to a negative electrode material. An electrolytic copper foil has a first surface and the second surface, the electrolytic copper foil comprising a first protective layer on the first surface side, a second protective layer on the second surface side, and a copper film between the first and second protective layers, wherein the coupling coefficient at the first surface or second surface of the electrolytic copper foil is 1.5 to 9.4 as represented by coupling coefficient=Rp/?m+peak density/30+amount of Cr adhesion/(mg/m2) (here, peak density is measured according to ASME standard B46.1). The electrolytic copper foil has a high adhesiveness to a negative electrode material and a low electrical resistance can be provided by controlling the surface properties of the electrolytic copper foil surface.
    Type: Application
    Filed: August 24, 2018
    Publication date: September 3, 2020
    Inventors: Seung Min KIM, Ho Gun KIM
  • Patent number: 10741848
    Abstract: Provided is a copper foil. The copper foil includes a copper layer and a protective layer disposed on the copper layer, wherein a surface of the protective layer has a maximum height roughness (Rmax) of 0.6 ?m to 3.5 ?m, a peak density (PD) of 5 to 110, and an oxygen atomic amount of 22 at % (atomic %) to 67 at %.
    Type: Grant
    Filed: March 7, 2018
    Date of Patent: August 11, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD
    Inventors: Seung Min Kim, Shan Hua Jin
  • Publication number: 20200181790
    Abstract: Disclosed is a copper foil including a copper layer having a matte surface and a shiny surface, and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a residual stress of 0.5 to 25 Mpa, based on absolute value, and the copper layer has a plurality of crystal planes, wherein a ratio [TCR (220)] of a texture coefficient (TC) of (220) crystal plane of the copper layer to a total of texture coefficients (TC) of (111), (200), (220) and (311) crystal planes of the copper layer is 5 to 30%.
    Type: Application
    Filed: July 25, 2018
    Publication date: June 11, 2020
    Inventors: Shan Hua JIN, An Na LEE, Seung Min KIM
  • Patent number: 10644320
    Abstract: An electrolytic copper foil capable of securing a secondary battery having a high capacity retention rate, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite to the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first protective layer includes chromium (Cr) and the first surface of the electrolytic copper foil has an adhesion factor of 1.5 to 16.3.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: May 5, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventor: Seung Min Kim
  • Patent number: 10547081
    Abstract: An electrolytic copper foil capable of improving a capacity retention rate of a secondary battery, an electrode including the same, a secondary battery including the same, and a method of manufacturing the same. The electrolytic copper foil, which includes a first surface and a second surface opposite the first surface, includes a copper layer including a matte surface facing the first surface and a shiny surface facing the second surface, and a first protective layer on the matte surface of the copper layer, wherein the first surface has a peak density (PD) of 3 to 110, a texture coefficient [TC(220)] of a (220) plane of 1.32 or less, and a surface roughness (Rz) of 0.5 to 2.7 ?m.
    Type: Grant
    Filed: July 28, 2017
    Date of Patent: January 28, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Shan Hua Jin
  • Patent number: 10530007
    Abstract: An electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein when a correlation between a thermal treatment temperature of the electrolytic copper foil for a lithium secondary battery, which corresponds to a variable x, and an elongation increment ratio of the electrolytic copper foil for a lithium secondary battery, which corresponds to a variable y, is expressed as y=ax+b (100?x?200) on an x-y two-dimensional graph, the “a” value is in the range of 0.0009 to 0.0610.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: January 7, 2020
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung-Min Kim, Soo-Yeol Kim, Dae-Young Kim, Jeong-Gil Lee
  • Publication number: 20200006777
    Abstract: An embodiment of the present invention provides a copper foil which comprises a copper layer and an anticorrosive film placed on the copper layer, and has a Young's modulus of 3800 to 4600 kgf/mm2 and a modulus bias factor (MBF) less than 0.12, wherein the modulus bias factor (MBF) is obtained by formula 1 below.
    Type: Application
    Filed: February 26, 2018
    Publication date: January 2, 2020
    Inventor: Seung Min KIM
  • Publication number: 20190384603
    Abstract: Embodiments include a method comprising identifying, by an instruction scheduler of a processor core, a first high power instruction in an instruction stream to be executed by an execution unit of the processor core. A pre-charge signal is asserted indicating that the first high power instruction is scheduled for execution. Subsequent to the pre-charge signal being asserted, a voltage boost signal is asserted to cause a supply voltage for the execution unit to be increased. A busy signal indicating that the first high power instruction is executing is received from the execution unit. Based at least in part on the busy signal being asserted, de-asserting the voltage boost signal. More specific embodiments include decreasing the supply voltage for the execution unit subsequent to the de-asserting the voltage boost signal. More Further embodiments include delaying asserting the voltage boost signal based on a start delay time.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Jason Seung-Min Kim, Nitin N. Garegrat, Anitha Loke, Nasima Parveen, David Y. Fang, Kursad Kiziloglu, Dmitry Sergeyevich Lukiyanchenko, Fabrice Paillet, Andrew Yang
  • Publication number: 20190384370
    Abstract: Embodiments include an apparatus comprising an execution unit coupled to a memory, a microcode controller, and a hardware controller. The microcode controller is to identify a global power and performance hint in an instruction stream that includes first and second instruction phases to be executed in parallel, identify a local hint based on synchronization dependence in the first instruction phase, and use the first local hint to balance power consumption between the execution unit and the memory during parallel executions of the first and second instruction phases. The hardware controller is to use the global hint to determine an appropriate voltage level of a compute voltage and a frequency of a compute clock signal for the execution unit during the parallel executions of the first and second instruction phases. The first local hint includes a processing rate for the first instruction phase or an indication of the processing rate.
    Type: Application
    Filed: August 30, 2019
    Publication date: December 19, 2019
    Inventors: Jason Seung-Min Kim, Sundar Ramani, Yogesh Bansal, Nitin N. Garegrat, Olivia K. Wu, Mayank Kaushik, Mrinal Iyer, Tom Schebye, Andrew Yang
  • Patent number: 10480090
    Abstract: An electrolytic copper foil, a current collector including the same, an electrode including the same, a secondary battery including the same and a method for manufacturing the same which can secure secondary batteries with high capacity maintenance. The electrolytic copper foil includes a first surface and a second surface opposite to the first surface, wherein each of the first and second surfaces has a peak count roughness Rpc of 10 to 100.
    Type: Grant
    Filed: April 28, 2016
    Date of Patent: November 19, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Dae Young Kim, Seung Min Kim
  • Patent number: 10418635
    Abstract: An electrolytic copper foil for a lithium secondary battery, which is applied as a negative electrode current collector of a lithium secondary battery, wherein after a thermal treatment at 300° C. for 30 minutes, the electrolytic copper foil for a lithium secondary battery has an elongation of 5% to 30%.
    Type: Grant
    Filed: May 11, 2016
    Date of Patent: September 17, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung-Min Kim, Soo-Yeol Kim, Dae-Young Kim, Jeong-Gil Lee
  • Patent number: 10403898
    Abstract: A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
    Type: Grant
    Filed: July 27, 2017
    Date of Patent: September 3, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung Min Kim, Jeong Gil Lee, Shan Hua Jin
  • Publication number: 20190106688
    Abstract: Provided are a fusion protein used in a CRISPR/Cas system, a complex including the same, and uses thereof. The fusion protein may efficiently be used as an anticancer agent due to complexation with a guide RNA, remarkable intracellular delivery activity of the guide RNA in vivo or in vitro without any other cationic polymers or lipid carriers, and synergistic effects by co-administration with any other anticancer agent as well as anticancer activity by single treatment.
    Type: Application
    Filed: October 10, 2018
    Publication date: April 11, 2019
    Applicant: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seung Ja OH, Mi Hue JANG, Seung Min KIM
  • Patent number: 10246333
    Abstract: Provided is a method for continuously manufacturing carbon nanotube fibers with high strength and high conductivity, which includes synthesizing carbon nanotube fibers by direct spinning; treating the carbon nanotube fibers with a strong acid while applying tension thereto; and washing the carbon nanotube fibers treated with the strong acid.
    Type: Grant
    Filed: June 11, 2018
    Date of Patent: April 2, 2019
    Assignee: KOREA INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Seung Min Kim, Hyeon Su Jeong, Jae Geun Lee, Dong Myeong Lee, Hun Su Lee, Young Kwan Kim, Jun Beom Park
  • Patent number: 10243216
    Abstract: An electrolytic copper foil for a lithium secondary battery, wherein a curl indicator C of the electrolytic copper foil, which is defined as 1.21?R+1.12?Cr+0.01?G, is 0 or above and 4.0 or below, where ?R corresponds to an absolute value of a difference between roughness measured on a first surface of the electrolytic copper foil for a lithium secondary battery and roughness measured on a second surface thereof, ?Cr corresponds to an absolute value of a difference between a chrome-deposited amount of an anti-corrosion layer formed on the first surface of the electrolytic copper foil for a lithium secondary battery and a chrome-deposited amount of an anti-corrosion layer formed on the second surface, and ?G corresponds to an absolute value of a difference between glossiness measured on the first surface of the electrolytic copper foil for a lithium secondary battery and glossiness measured on the second surface.
    Type: Grant
    Filed: June 7, 2016
    Date of Patent: March 26, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Seung-Min Kim, Dae-Young Kim
  • Patent number: 10218004
    Abstract: An electrolytic copper foil for a lithium secondary battery has yield strength of 30 kgf/mm2 to 60 kgf/mm2, a surface area ratio of 1 to 3, and a weight deviation of 3% or below.
    Type: Grant
    Filed: April 8, 2016
    Date of Patent: February 26, 2019
    Assignee: KCF TECHNOLOGIES CO., LTD.
    Inventors: Dae-Young Kim, Seung-Min Kim
  • Publication number: 20190036126
    Abstract: A high strength electrolytic copper foil preventing generation of folds, wrinkles, pleats, and breaks during a roll-to-roll (RTR) process, a method of manufacturing the same, and an electrode and a secondary battery which allow high productivity to be secured by being manufactured with such an electrolytic copper foil. The electrolytic copper foil includes a copper film including 99 weight % or more of copper and a protective layer on the copper film, wherein the electrolytic copper foil has a tensile strength of 45 to 65 kgf/mm2.
    Type: Application
    Filed: July 27, 2017
    Publication date: January 31, 2019
    Inventors: Seung Min KIM, Jeong Gil LEE, Shan Hua JIN
  • Publication number: 20190017188
    Abstract: Disclosed is a copper foil including a copper layer and having a tensile strength of 29 to 65 kgf/mm2, a mean width of roughness profile elements (Rsm) of 18 to 148 ?m and a texture coefficient bias [TCB(220)] of 0.52 or less.
    Type: Application
    Filed: September 10, 2018
    Publication date: January 17, 2019
    Inventors: Seung Min KIM, Jeong Gil LEE
  • Publication number: 20190003066
    Abstract: Disclosed is a copper foil including a copper layer and an anticorrosive layer disposed on the copper layer, wherein the copper foil has a peak to arithmetic mean roughness (PAR) of 0.8 to 12.5, a tensile strength of 29 to 58 kgf/mm2, and a weight deviation of 3% or less, wherein the PAR is calculated in accordance with the following Equation 1: PAR=Rp/Ra??[Equation 1] wherein Rp is a maximum profile peak height and Ra is an arithmetic mean roughness.
    Type: Application
    Filed: August 17, 2018
    Publication date: January 3, 2019
    Inventors: Seung Min KIM, An Na LEE, Ho Gun KIM, Shan Hua JIN