Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A semiconductor device having a substrate, a dielectric layer over the substrate, a first gate conductor, an inter-gate dielectric structure and a second gate conductor is disclosed. A gate dielectric structure is disposed between the first gate conductor and the dielectric layer, and may include two or more dielectric films disposed in an alternating manner. The inter-gate dielectric structure may be disposed between the first gate conductor and the second gate conductor, and may include two or more dielectric films disposed in an alternating manner. The second gate conductor is formed in an L shape such that the second gate has a relatively low aspect ratio, which allows for a reduction in spacing between adjacent gates, while maintaining the required electrical isolation between the gates and contacts that may subsequently be formed.

Abstract: Integrated capacitor structures and methods for fabricating same are provided. In an embodiment, the integrated capacitor structures exploit the capacitance that can be formed in a plane that is perpendicular to that of the substrate, resulting in three-dimensional capacitor structures. This allows for integrated capacitor structures with higher capacitance to be formed over relatively small substrate areas. Embodiments are suitable for use by charge pumps and can be fabricated to have more or less capacitance as desired by the application.

Abstract: A split gate device that includes a memory gate and a select gate disposed side by side, a dielectric structure having a first portion disposed between the memory gate and a substrate and a second portion disposed along an inner sidewall of the select gate to separate the select gate from the memory gate, and a spacer formed over the select gate along an inner sidewall of the memory gate. Other embodiments of embedded split gate devices including high voltage and low voltage transistors are also disclosed.

Abstract: A memory device includes a memory array arranged in rows and columns. The memory array may have at least four non-volatile memory (NVM) cells coupled in the same column of the memory array, in which each NVM cell may include a memory gate. The first and second NVM cells of the at least four NVM cells may share a first source region, and the third and fourth NVM cells may share a second source region. The memory gates of the first and second NVM cells may not be electrically coupled with one another, and the first and second source regions may not be electrically coupled with one another. Each of the first and second source regions may be electrically coupled with at least another source region of the same column in the memory array.

Abstract: A memory string is disclosed including a plurality of core cells serially connected between a source select gate and a drain select gate along a channel. Each core cell includes a wordline separated from the channel by a stack of layers including a charge trapping layer. At least one of the source and drain select gates is a stacked select gate with a plurality of components, including a first component adjacent to the plurality of core cells and a second component separated from the core cells by the first component. The first component includes a wordline separated from the channel by a stack of layers including a charge trapping layer, and a distance between the wordline of the first component and the wordline of a first core cell in the plurality of core cells is substantially the same as distances between each wordline in the plurality of word core cells.

Abstract: A semiconductor device having a substrate, a dielectric layer over the substrate, a first gate conductor, an inter-gate dielectric structure and a second gate conductor is disclosed. A gate dielectric structure is disposed between the first gate conductor and the dielectric layer, and may include two or more dielectric films disposed in an alternating manner. The inter-gate dielectric structure may be disposed between the first gate conductor and the second gate conductor, and may include two or more dielectric films disposed in an alternating manner. The second gate conductor is formed in an L shape such that the second gate has a relatively low aspect ratio, which allows for a reduction in spacing between adjacent gates, while maintaining the required electrical isolation between the gates and contacts that may subsequently be formed.

Abstract: A semiconductor device and method of making the same are disclosed. The semiconductor device includes a memory gate on a charge storage structure formed on a substrate, a select gate on a gate dielectric on the substrate proximal to the memory gate, and a dielectric structure between the memory gate and the select gate, and adjacent to sidewalls of the memory gate and the select gate, wherein the memory gate and the select gate are separated by a thickness of the dielectric structure. Generally, the dielectric structure comprises multiple dielectric layers including a first dielectric layer adjacent the sidewall of the memory gate, and a nitride dielectric layer adjacent to the first dielectric layer and between the memory gate and the select gate. Other embodiments are also disclosed.

Abstract: A memory device includes a memory array arranged in rows and columns. The memory array may have at least four non-volatile memory (NVM) cells coupled in the same column of the memory array, in which each NVM cell may include a memory gate. The first and second NVM cells of the at least four NVM cells may share a first source region, and the third and fourth NVM cells may share a second source region. The memory gates of the first and second NVM cells may not be electrically coupled with one another, and the first and second source regions may not be electrically coupled with one another. Each of the first and second source regions may be electrically coupled with at least another source region of the same column in the memory array.

Abstract: A memory device includes a memory array arranged in rows and columns. The memory array may have at least four non-volatile memory (NVM) cells coupled in the same column of the memory array, in which each NVM cell may include a memory gate. The first and second NVM cells of the at least four NVM cells may share a first source region, and the third and fourth NVM cells may share a second source region. The memory gates of the first and second NVM cells may not be electrically coupled with one another, and the first and second source regions may not be electrically coupled with one another. Each of the first and second source regions may be electrically coupled with at least another source region of the same column in the memory array.

Abstract: Embodiments provide a split gate device, methods for fabricating a split gate device, and integrated methods for fabricating a split gate device and a periphery device. In an embodiment, the split gate device is a charge trapping split gate device, which includes a charge trapping layer. In another embodiment, the split gate device is a non-volatile memory cell, which can be formed according to embodiments as standalone or embedded with a periphery device.

Abstract: Semiconductor devices and methods of manufacturing such devices are described herein. According to embodiments, the semiconductor device can be made by forming a dielectric layer at a first region and at a second region of a semiconductor substrate. A gate conductor layer is disposed over the dielectric formed in the first and the second regions of the semiconductor substrate, and the second region is masked. A split gate memory cell is formed in the first region of the semiconductor substrate with a first gate length. The first region is then masked, and the second region is etched to define a logic gate that has a second gate length. The first and second gate lengths can be different.

Abstract: A semiconductor device includes a substrate comprising a source region and a drain region, a bit storing element formed on the substrate, a memory gate structure, a first insulating layer formed on the substrate, a second insulating layer formed on the substrate, and a select gate structure formed on the first insulating layer. The second insulating layer is formed on the memory gate structure and the select gate structure and between the memory gate structure and the select gate structure.

Abstract: A method to fabricate a non-planar memory device including forming a multi-layer silicon nitride structure substantially perpendicular to a top surface of the substrate. There may be multiple non-stoichiometric silicon nitride layers, each including a different or same silicon richness value from one another.

Abstract: A semiconductor device having a first gate stack on a substrate is disclosed. The first gate stack may include a first gate conductor over a first gate dielectric structure. A dielectric structure can be formed over the first gate stack and the substrate. The dielectric structure layer can include four or more layers of two or more dielectric films disposed in an alternating manner. The dielectric structure can be selectively etched to form an inter-gate dielectric structure. A second gate conductor can be formed over a second gate dielectric structure, adjacent to the integrate dielectric structure. A dielectric layer can be formed over the substrate, the first and second gate conductors, and the inter-gate dielectric structure. The first gate conductor may be used to make a memory gate and the second gate conductor can be used to make a select gate of a split-gate memory cell.

Abstract: Embodiments described herein generally relate to methods of manufacturing n-type lightly doped drains and p-type lightly doped drains. In one method, photoresist mask is used to etch a transistor, and the mask is left in place (i.e., reused) to protect other devices and poly while a high energy implantation is performed in alignment with the photoresist mask, such that the implantation is adjacent to the etched transistor. One example of a high energy implantation is forming lightly doped source and dram regions. This technique of reusing a photoresist mask can be employed for creating lightly doped source and drain regions of one conductivity followed by using the technique a second time to create lightly doped source and drain regions of the complementary conductivity type. This may prevent use of at least one hard mask during manufacturing.

Abstract: A semiconductor device that has a split gate charge trapping memory cell having select and memory gates of different heights is presented herein. In an embodiment, the semiconductor device also has a low voltage transistor and a high voltage transistor. In one embodiment, the gates of the transistors are the same height as the select gate. In another embodiment, the gates of the transistors are the same height as the memory gate.

Abstract: A semiconductor device having a substrate, a dielectric layer over the substrate, a first gate conductor, an inter-gate dielectric structure and a second gate conductor is disclosed. A gate dielectric structure is disposed between the first gate conductor and the dielectric layer, and may include two or more dielectric films disposed in an alternating manner. The inter-gate dielectric structure may be disposed between the first gate conductor and the second gate conductor, and may include two or more dielectric films disposed in an alternating manner. The second gate conductor is formed in an L shape such that the second gate has a relatively low aspect ratio, which allows for a reduction it spacing between adjacent gates, while maintaining the required electrical isolation between the gates and contacts that may subsequently be formed.

Abstract: A semiconductor device and method of making the same are disclosed. The semiconductor device includes a memory gate on a charge storage structure formed on a substrate, a select gate on a gate dielectric on the substrate proximal to the memory gate, and a dielectric structure between the memory gate and the select gate, and adjacent to sidewalls of the memory gate and the select gate, wherein the memory gate and the select gate are separated by a thickness of the dielectric structure. Generally, the dielectric structure comprises multiple dielectric layers including a first dielectric layer adjacent the sidewall of the memory gate, and a nitride dielectric layer adjacent to the first dielectric layer and between the memory gate and the select gate. Other embodiments are also disclosed.

Abstract: A charge-trapping NOR (CT-NOR) memory device and methods of fabricating a CT-NOR memory device utilizing silicon-rich nitride (SiRN) in a charge-trapping (CT) layer of the CT-NOR memory device.