Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.

Abstract: First and second semiconductor devices and first and second bypass circuits are mounted on a printed wiring board. The first bypass circuit and the second bypass circuit are provided closer to the first semiconductor device and to the second semiconductor device, respectively. The first bypass circuit has one end connected to a power plane through a first power supply via and the other end connected to a ground plane through a first ground via. The second bypass circuit has one end connected to the power plane through a second power supply via and the other end connected to the ground plane through a second ground via. The ground plane has a slit between the connecting portions of the first and second ground vias to increase the impedance between the connecting portions of the first and the second ground vias. Thus, jitters caused by power supply noise can be reduced.

Abstract: A method for forming a fat and oil composition for deep frying includes combining a crude oil or intermediate oil product with an edible oil and an ascorbic acid and/or an ascorbic acid derivative to form the fat and oil composition. The crude oil or intermediate oil product includes a phosphorus component such that the phosphorus component is provided in an amount of 0.1 ppm to 10 ppm of the oil and fat composition. The ascorbic acid and/or an ascorbic acid derivative in an ascorbic acid equivalent is provided in an amount of 2 ppm to 130 ppm of the oil and fat composition. The edible oil in the oil and fat composition includes a component such as soy bean oil, rapeseed oil, palm olein, or any one or more combinations thereof.

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract: A printed circuit board has a printed wiring board and a semiconductor package mounted on the printed wiring board. The printed wiring board and the semiconductor package are connected with a plurality of solder balls. An underfill material covering the plurality of solder balls is filled between the printed wiring board and the semiconductor package. The underfill material has a relative dielectric constant of 8.6 or more and 54.4 or less. Thus, crosstalk noise generated in wiring in the out-of-plane direction is reduced without increasing the mounting area.

Abstract: A printed circuit board includes signal transmitting units that transmit signals, signal receiving units that receive signals, and a plurality of signal lines that connect the signal transmitting units and the signal receiving units. A resistor having a value Rp [?] of resistance with a first tolerance is provided between two signal lines that are adjacent to each other. In addition, a capacitor element that is connected in series to the resistor and that has a value Cp [F] of capacitance with a second tolerance is also connected between the two signal lines. In relation to the rise time tr [s] of the signals output from the signal transmitting units, the value Rp of resistance of the resistor and the value Cp of capacitance of the capacitor element are set such that an expression (Cp×Rp)×0.9?tr/3?(Cp×Rp)×1.1 is satisfied.

Abstract: A printed wiring board includes a first conductive layer, a second conductive layer arranged at a gap with respective to the first conductive layer, a third conductive layer, a first via conductor and a second via conductor, and a third signal wiring pattern. A first signal wiring pattern is arranged on the first conductive layer, a second signal wiring pattern is arranged on the second conductive layer, and a third signal wiring pattern that is arranged on the third conductive layer. The third conductive layer is arranged between the first conductive layer and the second conductive layer via an insulating layer. The first via conductor and the second via conductor, which are arranged to be mutually adjacent, connect the first signal wiring pattern to the second signal wiring pattern. The third signal wiring pattern connects the first via conductor to the second via conductor.

Abstract: In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.

Abstract: First and second signal wiring patterns are formed in a first conductor layer. A first electrode pad electrically connected to the first signal wiring pattern through a first via and a second electrode pad electrically connected to the second signal wiring pattern through a second via are formed in a second conductor layer as a surface layer. A third conductor layer is disposed between the first conductor layer and the second conductor layer with an insulator interposed between those conductor layers. A first pad electrically connected to the first via is formed in the third conductor layer. The first pad includes an opposed portion which overlaps the second electrode pad as viewed in a direction perpendicular to the surface of a printed board and which is opposed to the second electrode pad through intermediation of the insulator. This enables reduction of crosstalk noise caused between the signal wirings.

Abstract: A cleaning agent or a rinsing agent having no flash point which comprises a chlorine-free fluorine-containing compound have a vapor pressure at 20° C. of 1.33×103 Pa or more and one or more components having a vapor pressure at 20° C. less than 1.33×103 Pa and optionally an additive such as an antioxidant; a method for cleaning which comprises cleaning with the cleaning agent and rinsing and/or vapor cleaning utilizing a vapor being generated by boiling the cleaning agent or a condensate thereof; a method for separating a soil which comprises contacting a cleaning agent in a cleaning tank with a condensate of the vapor of the cleaning agent in a soil separating tank, to thereby continuously separate and remove a soil contained in the cleaning agent; and a cleaning apparatus.

Abstract: One end of a sub transmission line of which an impedance value is equal to or higher than a parallel impedance value of an output impedance value of a transmission circuit and an impedance value of a transmission line is connected to a connection point between the transmission circuit and the transmission line, and a correction resistor of which resistance is lower than an impedance value of the sub transmission line is connected to the other end of the sub transmission line. A length of the sub transmission line is set to satisfy a condition of 0.5×Tr (signal rise time)?Td (signal propagation time of sub transmission line)?0.5×Tmin (signal minimum pulse width), thereby achieving a de-emphasis function by a passive component, correcting a high-frequency component of a signal attenuated on the transmission line, and thus reducing timing jitters caused by intersymbol interference.

Abstract: The present invention provides an oil and fat composition that can prevent not only coloring caused by heating and cooked odor during heat cooking, but also increase in acid value, as well as that can endure long-term use. The oil and fat composition, which can prevent coloring caused by heating, cooked odor, and increase in acid value, can be obtained by incorporating 0.1 ppm or more and 10 ppm or less of a phosphorus component, and ascorbic acid and/or an ascorbic acid derivative in an ascorbic acid equivalent of 2 ppm or more and 130 ppm or less into an edible oil and fat.

Abstract: One end of a sub transmission line of which an impedance value is equal to or higher than a parallel impedance value of an output impedance value of a transmission circuit and an impedance value of a transmission line is connected to a connection point between the transmission circuit and the transmission line, and a correction resistor of which resistance is lower than an impedance value of the sub transmission line is connected to the other end of the sub transmission line. A length of the sub transmission line is set to satisfy a condition of 0.5×Tr (signal rise time)?Td (signal propagation time of sub transmission line)?0.5×Tmin (signal minimum pulse width), thereby achieving a de-emphasis function by a passive component, correcting a high-frequency component of a signal attenuated on the transmission line, and thus reducing timing jitters caused by intersymbol interference.

Abstract: A printed circuit board includes signal transmitting units that transmit signals, signal receiving units that receive signals, and a plurality of signal lines that connect the signal transmitting units and the signal receiving units. A resistor having a value Rp [?] of resistance with a first tolerance is provided between two signal lines that are adjacent to each other. In addition, a capacitor element that is connected in series to the resistor and that has a value Cp [F] of capacitance with a second tolerance is also connected between the two signal lines. In relation to the rise time tr [s] of the signals output from the signal transmitting units, the value Rp of resistance of the resistor and the value Cp of capacitance of the capacitor element are set such that an expression (Cp×Rp)×0.9 tr/3?(Cp×Rp)×1.1 is satisfied.

Abstract: There is provided a fat composition that makes possible to prepare stir-fried food, deep-fried food or mayonnaise. The fat composition contains an emulsifier having an HLB of not more than 5 in an amount of 0.1 to 3% by weight.

Abstract: Disclosed is a monofilament allowing contrast X-ray radiography. At least part of the monofilament is formed of a thermoplastic resin containing a radiopaque agent. The monofilament contains the radiopaque agent in the thermoplastic resin in a content of 30 to 80% by mass, and has a Young's modulus of 0.1 to 5.0 cN/dtex and a fineness of 500 to 20000 dtex.

Abstract: In connecting flexible printed circuits, a structure with improved connection strength of the connection portion is provided. In this structure in which a first flexible printed circuit and a second flexible printed circuit are connected to each other, a through-hole is provided on the second flexible printed circuit, and a resin member passes through the through-hole and is adhered to the wires of a connection surface of the first flexible printed circuit and the side of the second flexible printed circuit opposite to the connection surface, whereby impact is absorbed by the elasticity of the resin; as for the first flexible printed circuit, adhesion is performed on a metal in a wiring layer with high adhesion strength, while as for the second flexible printed circuit, adhesion is performed on the back side upon which no peeling stress is exerted, improving joining strength to prevent peeling.

Abstract: Disclosed is a monofilament allowing contrast X-ray radiography. At least part of the monofilament is formed of a thermoplastic resin containing a radiopaque agent. The monofilament contains the radiopaque agent in the thermoplastic resin in a content of 30 to 80% by mass, and has a Young's modulus of 0.1 to 5.0 cN/dtex and a fineness of 500 to 20000 dtex.

Abstract: Impedance mismatching points such as a VIA and a connector on a differential line between a differential driver element and a differential receiver element are arranged in predetermined positions. That is, the impedance mismatching points are arranged in such positions that a transmission time of a digital signal transmitted through a main differential line becomes (integral multiple of UI)±0.5×Trf, whereby noises are generated within the rise and fall times of a signal to be able to maintain an excellent waveform of the signal.

Abstract: A cleaning agent or a rinsing agent having no flash point which comprises a chlorine-free fluorine-containing compound have a vapor pressure at 20° C. of 1.33×103 Pa or more and one or more components having a vapor pressure at 20° C. less than 1.33×103 Pa and optionally an additive such as an antioxidant; a method for cleaning which comprises cleaning with the cleaning agent and rinsing and/or vapor cleaning utilizing a vapor being generated by boiling the cleaning agent or a condensate thereof; a method for separating a soil which comprises contacting a cleaning agent in a cleaning tank with a condensate of the vapor of the cleaning agent in a soil separating tank, to thereby continuously separate and remove a soil contained in the cleaning agent; and a cleaning apparatus.