Patents by Inventor Shui-Fa Tsai

Shui-Fa Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11943895
    Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: March 26, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Tsung-Wei Lin, Yu-Jyun Chen
  • Publication number: 20240074105
    Abstract: A liquid cooling pumping unit including a cover, rotor, housing, driver, flow spray plate, and thermal plate is provided. The cover is configured above the housing, the housing above the base, and the base above the thermal plate. A first fluid chamber is defined by a chamber of the cover and an annular chamber of the housing. An inlet of the housing is in fluid connection with the first fluid chamber. A second fluid chamber is defined by the flow spray plate and a recess of the thermal base. An outlet of the base is in fluid connection with the second fluid chamber. An impeller of the rotor is rotatable in the first fluid chamber. The driver is configured above the base and under the housing, driving the rotor to rotate with respect to the housing. The first fluid chamber is in fluid communication with the second fluid chamber.
    Type: Application
    Filed: July 12, 2023
    Publication date: February 29, 2024
    Inventors: Shui-Fa TSAI, Yu-Jyun Chen
  • Patent number: 11871538
    Abstract: A liquid cooling device is configured to be in fluid communication with a heat absorbing component. The liquid cooling device includes a first tank, a second tank, a third tank, and a channel structure. The second tank has a first connector, the third tank has a second connector, and the first connector and the second connector are configured to be in fluid communication with the heat absorbing component via pipes. The second tank and the third tank are in fluid communication with the first tank via the channel structure. Orthogonal projections of the second tank and the third tank onto the first tank do not overlap with each other.
    Type: Grant
    Filed: March 18, 2021
    Date of Patent: January 9, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shun-Yu Shih, Shui-Fa Tsai
  • Patent number: 11859619
    Abstract: A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flow in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved due to the lower operating speeds required.
    Type: Grant
    Filed: August 25, 2022
    Date of Patent: January 2, 2024
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Ting-Chun Huang
  • Publication number: 20230403828
    Abstract: A water cooling assembly is configured to be mounted at an electrical connector of a circuit board. The water cooling assembly includes a mounting plate and a water cooling radiator. The mounting plate includes a mounting portion and a plugging portion. The plugging portion is connected to a side of the mounting portion, and the plugging portion is configured to be inserted into the electrical connector of the circuit board. The water cooling radiator is fastened to the mounting portion of the mounting plate.
    Type: Application
    Filed: June 8, 2023
    Publication date: December 14, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chien-Liang LIN, Shui-Fa TSAI
  • Patent number: 11821439
    Abstract: A liquid cooling heat exchange apparatus comprising a water block set and pump unit is provided. The water block set has a water block cover having an inlet port, cover diversion channel, cover diversion opening, cover outlet through hole and outlet port, surge directing plate having a plate cover end, and water block. The pump unit has a rotor housing having an impeller cavity comprising an inlet and outlet. The inlet and outlet ports and the cover diversion opening is at a same side, the cover outlet through hole is at an opposite side. During operation, working fluid is sucked via the inlet port, pass the cover diversion channel covered by the plate cover end, through the cover diversion opening and impeller cavity inlet, through the impeller cavity, and outlet, and cover outlet through hole, and through the water block, before exiting through the outlet port.
    Type: Grant
    Filed: September 2, 2021
    Date of Patent: November 21, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventor: Shui-fa Tsai
  • Patent number: 11818865
    Abstract: This disclosure relates to a liquid-cooling device that includes a liquid block and a radiator. The liquid block is in thermal contact with an interface card. The radiator includes a first tank, a second tank, and a heat dissipation channel structure. The first tank and the second tank respectively have a first chamber and a second chamber. The heat dissipation channel structure includes a plurality of liquid transmission components. The first chamber and the second chamber are respectively connected to two opposite sides of the heat dissipation channel structure. Each of the liquid transmission components has an end in fluid communication with the first chamber of the first tank and another end in fluid communication with the second chamber of the second tank. The first chamber and the second chamber are in fluid communication with the liquid block to form a cooling cycle.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: November 14, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shun-Yu Shih, Shui-Fa Tsai
  • Patent number: 11809243
    Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.
    Type: Grant
    Filed: May 4, 2021
    Date of Patent: November 7, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Publication number: 20230328925
    Abstract: A liquid cooling heat exchange casing including a chassis having a first side is provided. The first side includes a first inlet flow passageway system having a first inlet liquid coolant opening, a first outlet flow passageway system having a first outlet liquid coolant opening, a plurality of adapters, and at least one radiator. The at least one radiator is mounted to the first inlet flow passageway system via a radiator inlet and one of the plurality of adapters and to the first outlet flow passageway system via a radiator outlet and another of the plurality of adapters. A cooling fluid flows from the first inlet liquid coolant opening, through the first inlet flow passageway system, through the at least one radiator, and through the first outlet flow passageway system, to the first outlet liquid coolant opening, before being circulated to repeat the flow process again.
    Type: Application
    Filed: April 2, 2023
    Publication date: October 12, 2023
    Inventors: Tsung-Wei LIN, Shui-Fa TSAI
  • Publication number: 20230323960
    Abstract: The disclosure provides a control valve which includes a valve body and a valve gate. The valve gate is movably located inside the inner space. The control valve has a lower flow rate limit which is greater than zero. That is, the lower flow rate limit has no necessary to be zero, thus it is acceptable to have a cylindrical valve gate but not a spherical valve gate, and a diameter of the cylindrical valve gate is be smaller than a caliber of an opening of the valve body. Therefore, the valve gate can be directly installed into the valve body via the opening, which allows the valve body to be made of a single piece so as to simplify the processes of manufacturing and assembly.
    Type: Application
    Filed: June 13, 2023
    Publication date: October 12, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa TSAI, Sy-Chi KUO, Hsin-Hung CHEN
  • Publication number: 20230285892
    Abstract: A water replenishment device includes a water generator and a container. The water generator includes a seat body, a heat exchanger, and a thermoelectric cooler. The seat body has a fluid channel and a catchment hole. The catchment hole is in fluid communication with the fluid channel, and the fluid channel is configured for an environment airflow to pass therethrough. The heat exchanger is partially located in the fluid channel. The thermoelectric cooler has a cold surface and a hot surface. The cold surface of the thermoelectric cooler is thermally coupled to the heat exchanger. The container has a storage space. The storage space is in fluid communication with the fluid channel via the catchment hole. The thermoelectric cooler is configured to condense the environment airflow to a liquid, and the liquid is configured to be stored in the storage space via the catchment hole.
    Type: Application
    Filed: April 27, 2022
    Publication date: September 14, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Chien-Liang LIN, Shui-Fa TSAI
  • Patent number: 11719347
    Abstract: A control valve includes a valve body and a valve gate, the valve body has an inner space, first fluid inlets, second fluid inlets, and a fluid outlet, the valve gate is movably located inside the inner space, the first fluid inlets are located at a side of the fluid outlet, the second fluid inlets are located at another side of the fluid outlet, the first fluid inlets and the second fluid inlets are arranged along a radial direction of the valve gate, the valve gate has a main channel having a first inlet end, a second inlet end, and an outlet end, the first inlet end is connected to the first fluid inlets, the second inlet end is connected to the second fluid inlets, and the outlet end is connected to the fluid outlet.
    Type: Grant
    Filed: March 1, 2021
    Date of Patent: August 8, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa Tsai, Sy-Chi Kuo, Hsin-Hung Chen
  • Patent number: 11659690
    Abstract: A fixing structure of a heat dissipation device is provided. The fixing structure has a plate portion and at least one fixing set. The plate portion forms an opening and at least one groove. The opening and the groove form through the plate portion. The opening is configured to fix a heat dissipation assembly. The fixing set is mounted through the groove and can be moved in an extending direction of the groove and a direction perpendicular to the plate portion. The shape of the groove may correspond to various locations of the fixing hole on the various substrates. The fixing set can be moved in the groove to align various fixing holes of the substrate. In other words, with the movable fixing sets, the fixing structure can be mounted on various substrates or correspond to the electronic component in various shapes and dimensions.
    Type: Grant
    Filed: July 22, 2021
    Date of Patent: May 23, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventors: Jen-Chih Cheng, Shui-Fa Tsai
  • Patent number: 11627686
    Abstract: The disclosure relates to a flow-rate adjustment component and a liquid cooling device. The flow-rate adjustment component is configured to be in contact with a plurality fins, and every two adjacent fins are spaced by a passageway. The flow-rate adjustment component includes a covering portion and at least one blocking portion. The covering portion has at least one through slot. The covering portion is in contact with the fins to cover the passageways. The through slot is connected to the passageways. The at least one blocking portion is to block one end of at least one of the passageways.
    Type: Grant
    Filed: September 7, 2021
    Date of Patent: April 11, 2023
    Assignee: COOLER MASTER CO., LTD.
    Inventor: Shui-Fa Tsai
  • Patent number: 11622472
    Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.
    Type: Grant
    Filed: February 5, 2021
    Date of Patent: April 4, 2023
    Assignee: Cooler Master Co., Ltd.
    Inventor: Shui-Fa Tsai
  • Publication number: 20230056832
    Abstract: A variable-part liquid cooling pumping unit comprising a water block unit having a water block set, flow guiding plate, and water block cover, and a pump unit having a pump housing assembly is provided. The pump housing assembly comprises an impeller cavity inlet, flow adjusting disc, impeller cavity, and impeller cavity outlet opening. Inlet and outlet ports are positioned on a same side of and plane as the pump housing assembly. More than one water block unit and pump unit are provided and interchangeable. During operation, working fluid is sucked via the inlet port through the impeller cavity inlet, pass the flow adjusting disc, into the impeller cavity, to a plurality of curved blades of a rotor assembly unit impeller. From there, the working fluid travels through the impeller cavity outlet opening, flow guiding plate, and water block set, before exiting through the flow guiding plate, and outlet port.
    Type: Application
    Filed: August 22, 2021
    Publication date: February 23, 2023
    Inventors: Shui-fa Tsai, Tsung-wei Lin
  • Publication number: 20230025258
    Abstract: A cooling apparatus includes a casing, pumping unit, and heat exchange unit. The pumping unit includes a body and housing. The body includes a wishbone-shaped indentation and lollipop shaped indentation separate from the wishbone-shaped indentation. The housing includes a wishbone-shaped flow path and lollipop-shaped flow path separate from the wishbone-shaped flow path. The body is coupled to the housing such that the wishbone-shaped indentation and the wishbone-shaped flow path define a first flow path and the lollipop-shaped indentation and the lollipop-shaped flow path define a second flow path. The pumping unit is coupled to the heat exchange chamber such that the first flow path and the second flow path is in fluid communication with the heat exchange chamber via a first end opening and second end opening, and third opening, respectively.
    Type: Application
    Filed: September 30, 2022
    Publication date: January 26, 2023
    Inventors: Shui Fa TSAI, Yuan Wu, Wei Ju Lin
  • Publication number: 20230019711
    Abstract: A liquid cooling multi-pumping unit comprising a main body and first and second pumps arranged in series is provided. During operation, cooling fluid is sucked via a cooling fluid inlet into a first fluid chamber and then into a first central chamber opening to a plurality of curved blades of a first impeller assembled in a first pump chamber. From there, the cooling fluid travels and is sucked through a fluid distribution channel into a second fluid chamber and then into a second central chamber opening to a plurality of curved blades of a second impeller assembled in a second pump chamber, before exiting through a fluid outlet. The series arrangement of the first and second pumps increases head pressure, and provides sufficient liquid flow in the case where one liquid cooling pump fails. Additionally, lower energy consumption is achieved due to the lower operating speeds required.
    Type: Application
    Filed: August 25, 2022
    Publication date: January 19, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa TSAI, Ting-Chun HUANG
  • Publication number: 20230018736
    Abstract: A liquid cooled server chassis comprising a chassis, at least one electronics module having at least one heat generating component mounted thereon, and a liquid cooling unit, having at least one liquid plate heat exchanger, a liquid row heat sink, an inlet chassis manifold, and an outlet chassis manifold, is provided. The at least one liquid plate heat exchanger, mounted and thermally coupled to the at least one heat generating component, is in fluid communication with the inlet chassis manifold and outlet chassis manifold, transporting heat away from the at least one heat generating component. The liquid row heat sink, in fluid communication with the inlet chassis manifold and outlet chassis manifold, is configured to lower a flowthrough temperature of ambient airflow flowing through the liquid row heat sink. The at least one electronics module and liquid row heat sink are parallel arranged, whereby cooling power is evenly distributed thereamong.
    Type: Application
    Filed: May 18, 2022
    Publication date: January 19, 2023
    Inventors: Shui-fa Tsai, Tsung-wei Lin
  • Publication number: 20230007812
    Abstract: This disclosure relates to a liquid cooling device including a first heat exchanger that has a first inlet and a first outlet, a second heat exchanger that has a second inlet and a second outlet, a heat dissipation component that has a first heat inlet, a second heat inlet, and a heat outlet, and a fluid driving component that has a fluid inlet, a first fluid outlet, and a second fluid outlet. The first heat inlet and the second heat inlet are in fluid communication with the heat outlet. The first heat inlet is in fluid communication with the first outlet. The second heat inlet is in fluid communication with the second outlet. The fluid inlet is in fluid communication with the heat outlet. The first fluid outlet and the second fluid outlet are respectively in fluid communication with the first heat inlet and the second heat inlet.
    Type: Application
    Filed: April 27, 2022
    Publication date: January 5, 2023
    Applicant: COOLER MASTER CO., LTD.
    Inventors: Shui-Fa TSAI, Tsung-Wei LIN, Yu-Jyun CHEN