Abstract: A thin axial gap motor includes: a base, a circuit unit installed on the base; a stator module including at least one flat permeable frame and at least one winding, and the permeable frame having at least one support arm and an induced magnetic part connected to the at least one support arm, and the winding being wound around the support arm; a rotor module including a flat permanent magnet installed at the top of the induced magnetic parts and having an orthographic projection range corresponsive to the area of the induced magnetic part, and the at least one winding being disposed on an outer side of the permanent magnet; and a pivoting element installed between the base and the rotor module and including a bearing housing and a spindle plugged into the bearing housing for rotating the rotor module with respect to the base.

Abstract: An external auxiliary heat dissipation device includes an external connection head module, a fluid driving module, a heat dissipation module, and a plurality of first pipes. The external connection head module includes a first carrier body and at least two first fluid connection disposed on the first carrier body. The first pipes connect to the first fluid connection head, the fluid driving module, and the heat dissipation module to form a first fluid pathway. The electronic system includes an internal connection head module and a plurality of second pipes. The second pipes connect to the internal connection head module to form a second fluid pathway. The internal connection head module is detachably connected to the external connection head module, so that the first and the second fluid pathways are in fluid communication with each other to form a loop fluid pathway.

Abstract: The disclosure provides a liquid cooling heat exchanger, comprising a first cover plate, a second cover plate and a fin, the first cover plate and the second cover plate stacked on each other so as to form a chamber therebetween, the fin disposed within the chamber, the first cover plate made of a composite material, wherein there is a bonding layer between the first cover plate and the second cover plate, and the bonding layer has a melting point lower than melting points of the first cover plate, the second cover plate and the fin.

Abstract: A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.

Abstract: An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a transition slot. The connecting member is connected to the liquid cooling system. The connecting member is used for connecting an external device, such that the liquid cooling system performs liquid cooling function for dissipating heat of the external device. The power supply unit is electrically connected to the transition circuit board and the liquid cooling system. The power supply unit includes an electric connector. The electric connector is used for connecting the external device, such that the power supply unit supplies power to the external device.

Abstract: A liquid cooling system includes a liquid cooling head, a support frame, two positioning members and a radiator. The support frame is disposed on the liquid cooling head. The support frame has two side plates opposite to each other. Each of the positioning members is disposed on one of the two side plates. Each of the positioning members has at least two positioning recesses. The radiator is disposed between and pivotally connected to the two side plates. Opposite sides of the radiator have a positioning portion. The positioning portion is engaged with one of the at least two positioning recesses, such that the radiator is capable of rotating with respect to the liquid cooling head between at least two different positions.

Abstract: A liquid cooling system includes a liquid cooling head, a radiator, a first support member and a second support member. The liquid cooling head has at least one first outlet and at least one first inlet. The radiator has a second outlet and a second inlet. The first support member has at least one first end portion connected to the first outlet, a second end portion pivotally connected to the second inlet, and at least one first passage. The second support member has at least one third end portion connected to the first inlet, a fourth end portion pivotally connected to the second outlet, and at least one second passage. The first and second support members support the radiator and the radiator is capable of rotating with respect to the liquid cooling head by the second and fourth end portions.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.

Abstract: A water supply structure of a liquid cooling device, a pump and a liquid cooling device having the water supply structure are disclosed. The water supply structure, disposed on the cooling device or on the pump, includes a lower lid, an upper lid, and a pressure control member. An outlet is in the lower lid and communicates with the cooling device or with the pump. The upper lid is combined on the lower lid. A chamber, formed between the lower lid and the upper lid, communicates with the outlet and accommodates a coolant. The pressure control member is moveable in the chamber and includes a piston and an elastic part controlling the piston to move inside the chamber. The elastic part pushes against the piston to move inside the chamber such that the coolant is injected into the cooling device until hydraulic pressure equilibrium is achieved.

Abstract: The present application provides a heat dissipating module, a heat dissipating system and a circuit module. The heat dissipating module adapted to be used with a heat element. The heat dissipating module comprises a heat exchanger which has a heat exchanging zone contacted with the heat element; a securing structure; and a fluid driving unit which is communicated with the heat exchanger for guiding a working fluid into the heat exchanger and is secured to the heat exchanger by the securing structure, wherein the fluid driving unit and the second heat exchanger are separately installed and communicated with each other.

Abstract: A pump assembly includes a plurality of pumps. Each of the pumps includes a pump body, a first opening, a second opening, a first connecting member and a second connecting member. The first opening and the second opening are located at a periphery of the pump body. The first connecting member is disposed on the first opening and the second connecting member is disposed on the second opening. The first connecting member of one of the pumps is detachably connected to the second connecting member of another of the pumps, such that each of the pumps can be connected to any of the pumps.

Abstract: An external function extension device includes a casing, a transition circuit board, a liquid cooling system, at least one connecting member and a power supply unit. The transition circuit board, the liquid cooling system and the power supply unit are disposed in the casing. The transition circuit board has a transition slot. The connecting member is connected to the liquid cooling system. The connecting member is used for connecting an external device, such that the liquid cooling system performs liquid cooling function for dissipating heat of the external device. The power supply unit is electrically connected to the transition circuit board and the liquid cooling system. The power supply unit includes an electric connector. The electric connector is used for connecting the external device, such that the power supply unit supplies power to the external device.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.

Abstract: A liquid cooling heat dissipation device includes a heat-dissipating module and a liquid supply module. The liquid supply module includes an outer cover body disposed on the heat-dissipating module and at least one pump disposed inside the outer cover body. The outer cover body has an inner space divided into a first independent space adjacent to the heat-dissipating module and a second independent space far away from the heat-dissipating module and insulated from the first independent space, the at least one pump includes a stator disposed inside the first independent space and a rotator disposed inside the second independent space, and the stator is closer to the heat-dissipating module than the rotator. The instant disclosure further provides an electronic device using the liquid cooling heat dissipation device.

Abstract: A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.

Abstract: Disclosed is a water cooling system for a circuit board with heat generating components. The water cooling system includes a fin module, a water block, a liquid guiding tube and a fan. The fin module is installed on the circuit board and has a through hole; the water block is clamped between the fin module and the circuit board and has a side thermally coupled to the heat generating components, and further has a liquid inlet end and a liquid outlet end; the liquid guiding tube communicates with the liquid inlet end and the liquid outlet end and passes and is fixed into the through hole and thermally coupled to an inner wall of the through hole; and the fan is configured to be corresponsive to the fin module. Therefore, the water cooling system has the advantages of reduced volume and high cooling efficiency.

Abstract: A cooling apparatus that includes a base plate including two heat exchange units and a cover coupled to the base plate and enclosing the two heat exchange units. A recess is defined in the base plate and between the two heat exchange units. The cover and the base plate define a heat exchange chamber that includes the two heat exchange units. The cover has a first set of openings and a second set of openings, and is coupled to the base plate such that the first set of openings is above a first heat exchange unit and the second set of openings is above a second heat exchange unit. The cooling apparatus further includes a first pumping unit on the cover and over the first set of openings and a second pumping unit on the cover and over the second set of openings.

Abstract: A heat dissipation device applied to a heat source includes a heat conduction unit and a power generation unit. A fluid chamber and a rotor chamber are configured inside the heat conduction unit. The fluid chamber and the rotor chamber are communicated with each other. A working fluid is configured in the fluid chamber. The power generation unit has a rotor and a power generation module. The rotor is connected to the power generation module and is configured in the rotor chamber. The rotor is driven by the working fluid so as to enable the power generation unit to output electrical energy. An electronic system with the heat dissipation device is also disclosed.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: An integrated fan blade and a fan having the same are provided. The fan includes a stator (1) and a fan blade (2); the stator (1) is provided with a stator pivoting member (10) and disposed on and electrically connected to a circuit board (11); the fan blade (2) includes a blade wheel (20), a fan blade pivoting member (21) formed at the center of the blade wheel (20) and axially extended; and a plurality of blade pieces (22) annularly formed at the outer periphery of the blade wheel (20), and the fan blade pivoting member (21) is pivoted with the stator pivoting member (10), wherein the fan blade (2) is formed with a magnetic material area and formed through an integrally forming means. With the fan blade (2) being integrally formed, the fan operating property can be effectively improved.