Abstract: A liquid cooling heat sink structure and its cooling circulation system include a thermal conduction module, and a liquid supply module, and the liquid supply module is installed on the thermal conduction module and has a containing space for receiving plural fins of the thermal conduction module, and the liquid supply module has a continuous surrounding peripheral wall oriented in a plurality of directions facing towards the outside of the liquid supply module, and the peripheral wall has two first liquid opening and a second liquid opening, and the two first liquid opening are disposed at positions of the peripheral wall in any two facing directions respectively.

Abstract: A liquid cooling system includes a liquid cooling head, a fixing member and a radiator. The fixing member is disposed on the liquid cooling head. The radiator is disposed on the liquid cooling head through the fixing member. The radiator moves with respect to the liquid cooling head between at least two different positions through the fixing member.

Abstract: A liquid cooling heat exchange apparatus has a water block set and a liquid pump module. The water block set has a heat transfer surface configured to exchange heat with a cooling liquid. The liquid pump module is securely mounted on the water block set and has a flow-directing containment area and pumps. The flow-directing containment area forms flow-directing containment recesses and the pumps correspond to the flow-directing containment recesses. Therefore, pumps are connected in series or parallel so that the pumps can juxtapose with each other, which lessens the entire thickness and allows the liquid cooling heat exchange apparatus to be utilized in a narrow space. Besides, with the connected pumps, an amount and a speed of the flow may be increased and dissipate more heat. Even if part of the pumps malfunctions, the remaining pump(s) can maintain a basic amount and speed of the flow.

Abstract: A liquid cooling device is provided with a heat dissipating assembly and a pump assembly. The heat dissipating assembly has a plate and a cover. The plate has a connecting surface and a sinking surface opposite each other. The connecting surface has a connecting portion configured to attach to a heat source. The sinking surface has multiple fins corresponding to the connecting portion in location. The cover is mounted on the sinking surface. The pump assembly juxtaposes the heat dissipating assembly. A graphics card is also provided. The graphics card has a graphics card main body and the liquid cooling device. Therefore, functions of the conventional water block and the conventional pump are integrated in one liquid cooling device, which reducing an amount of connecting parts and the probability of leakage of the working fluid.

Abstract: A pump assembly includes a plurality of pumps. Each of the pumps includes a pump body, a first opening, a second opening, a first connecting member and a second connecting member. The first opening and the second opening are located at a periphery of the pump body. The first connecting member is disposed on the first opening and the second connecting member is disposed on the second opening. The first connecting member of one of the pumps is detachably connected to the second connecting member of another of the pumps, such that each of the pumps can be connected to any of the pumps.

Abstract: A liquid-cooled heat sink head includes a metal substrate, a first cover, and a plurality of heat dissipation fins. The first cover covers the metal substrate to form a heat exchange chamber and includes a first liquid inlet and a liquid outlet to allow a working fluid to flow in the heat exchange chamber. The heat dissipation fins are disposed on the metal substrate, are placed between the first liquid inlet and the liquid outlet, and are arranged sequentially from the first liquid inlet toward the liquid outlet. A liquid passage is disposed between each two adjacent heat dissipation fins. A portion of the heat dissipation fins are connected to the heat exchange portion, and at least one heat dissipation fin includes one opening to communicate with the liquid passages at two sides of the at least one heat dissipation fin.

Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: A liquid cooling device having a diversion mechanism, connected with a heat source, includes a thermoelectric cooler, a first water block, a second water block and a pump. The thermoelectric cooler has a cold end and a hot end. The first water block is disposed between the heat source and the cold end of the thermoelectric cooler. The second water block is disposed on one side of the hot end of the thermoelectric cooler. The pump connects the first water block and the second water block via a water pipe. Thereby, the temperature of an inner fluid is reduced and the overall heat dissipation effect of the device is improved.

Abstract: A fluid leak detector which is configured to be disposed on a flow tube. The fluid leak detector includes an insulation sleeve and at least one wire set. The insulation sleeve has water absorption property. The insulation sleeve is configured to be sleeved on the flow tube. The at least one wire set includes a first electrode wire and a second electrode wire. The first electrode wire and the second electrode wire are disposed on the insulation sleeve. The first electrode wire and the second electrode wire are separated from each other but are connected to each other via the insulation sleeve.

Abstract: An impeller for used in a fluid pump device includes a shaft controlled to revolve in a first direction; an impeller body coupled to the shaft and driven by the revolving shaft to rotate, the impeller body having a top surface, a bottom surface and a circumferential surface; a first set of fluid-guiding members disposed on the top surface of the impeller body for driving a fluid to flow along a centrifugal direction of the revolving shaft; and a second set of fluid-guiding members disposed on the circumferential surface of the impeller body. Each or at least one of the second set of fluid-guiding members has a titling structure for driving the fluid to flow from the top to the bottom of the impeller along a designated path on the circumferential surface.

Abstract: A radiator includes a main body, two connecting members and two taps. The two connecting members are disposed on opposite sides of the main body. Each of the two taps is rotatably connected to one of the two connecting members, such that the two taps are rotatably disposed on opposite sides of the main body.

Abstract: The present invention provides a liquid cooling heat sink device for cooling a heat source. The liquid cooling heat sink device includes a heat conduction module, a liquid supply module, and a liquid guiding module. The heat conduction module includes a vapor chamber and at least one heat conducting column. The vapor chamber has at least one space and one side of the vapor chamber contacts the heat source. The heat conducting column is mounted on one side of the vapor chamber, and the side of the vapor chamber is distal from the heat source. The liquid supply module is mounted on one side of the vapor chamber and has a casing and a pump. The casing has a liquid entrance terminal and a liquid exit terminal out of the casing. The liquid guiding module is mounted on one side of the vapor chamber and a receiving space is formed between the vapor chamber and the liquid guiding module.

Abstract: A serial pump includes a pump body, a first impeller and a second impeller. A first rotor chamber, a second rotor chamber and a connecting channel are formed in the pump body. The first rotor chamber has a first outlet opening, the second rotor chamber has a second inlet opening, and the connecting channel is communicated between the first outlet opening and the second inlet opening. The first impeller is pivotally arranged in the first rotor chamber, and an outer periphery of the first impeller is arranged corresponding to the first outlet opening. The second impeller is pivotally arranged in the second rotor chamber, and a center of the second impeller is arranged corresponding to the second inlet opening. Accordingly, the first impeller and the second impeller are serially arranged.

Abstract: A liquid cooling apparatus has a chassis, a cover mounted on the chassis, and a dividing structure disposed in an inner chamber defined between the chassis and the cover. The dividing structure divides the inner chamber into a liquid inlet compartment and a liquid outlet compartment. The liquid inlet compartment communicates with the liquid outlet compartment via the recess. The liquid cooling apparatus can be installed on a first panel with the boss of the chassis mounted through a through hole of the first panel and thermally attached to a heat source on a second panel. A working fluid that flows into the liquid inlet compartment is forced to flow into the recess before flowing to the liquid outlet compartment by the dividing structure. Accordingly, heat generated by the heat source can be effectively dissipated.

Abstract: A liquid cooling heat sink structure includes a thermal conduction module configured to dissipate heat and including a heat exchange unit; a cover coupled to the thermal conduction module and enclosing the heat exchange unit, the cover and the thermal conduction module defining a heat exchange chamber that includes the heat exchange unit, the cover defining a first opening and a second opening, and the cover being coupled to the thermal conduction module such that at least one of the first and second openings is above the heat exchange unit; a flow guidance plate disposed on the cover; and a housing disposed on the flow guidance plate and defining a first cavity and a second cavity fluidly isolated from each other, wherein the housing includes two fluid inlets each in fluid communication with the first cavity, and a fluid outlet in fluid communication with the second cavity.

Abstract: A liquid cooling device includes body. The body has liquid inlet and liquid outlet. The liquid outlet has first internal thread on its inner wall. The liquid inlet has second internal thread on its inner wall. Another liquid cooling device has body, first thread adapter and second thread adapter. The first thread adapter is movably disposed on the liquid outlet, and has a first internal thread on its inner wall. The second thread adapter is movably disposed on the liquid inlet, and has a second internal thread on its inner wall. Still another liquid cooling device has a body. The body has a liquid passage. The liquid passage has internal thread on its inner wall. Yet another liquid cooling device has body and thread adapter. The body has a liquid passage. The thread adapter is movably disposed on the liquid passage, and has internal thread on its inner wall.

Abstract: A thin fan with an axial airgap includes a base having a bottom plate, a circuit unit, a stator set, and a rotor set. The stator set includes at least one winding part, plural induced magnets connected to the winding part, and at least one winding set wound on the winding part. The rotor set includes a hub, plural blades disposed around the hub, and a permanent magnet disposed around a bottom side of the hub and above the induced magnets. The winding set is outside of the permanent magnet. A pivot shaft is between the hub and the bottom plate and includes a bearing sleeve and a rotating shaft inserted in the bearing sleeve. The winding sets are moved outside of the permanent magnet, which reduces the heights occupied by the winding sets and the PCB, facilitating the thinning of the fan.

Abstract: A liquid-cooling heat dissipation device includes: a flow guiding shell body (1) formed with a first flow channel (13), a second flow channel (14) and a third flow channel (15), wherein a heat dissipation space (16) is defined by the above-mentioned three flow channels (13, 14, 15); a primary pipe (2) disposed in the heat dissipation space (16) and extended from the first flow channel (13) towards the second flow channel (14), wherein the primary pipe (2) is communicated with the first flow channel (13); a plurality of secondary pipes (3) disposed in the heat dissipation space (16) and extended from the primary pipe (2) towards the third flow channel (15), wherein each of the secondary pipes (3) is respectively communicated with the primary pipe (2) and the third flow channel (15). Accordingly, advantages of lowering the flow resistance and increasing the heat dissipation performance can be achieved.

Abstract: A portable electronic device using a fixed main heat-dissipating module and a detachable auxiliary heat-dissipating module for contacting the fixed main heat-dissipating module. The detachable auxiliary heat-dissipating module includes an outer casing structure and an inside mounted heat-dissipating structure. The outer casing structure includes a detachable casing detachably disposed inside a predetermined receiving groove of the portable electronic device and an electrical connector electrically connected to the portable electronic device. The inside mounted heat-dissipating structure is disposed inside the detachable casing. The inside mounted heat-dissipating structure includes an inside mounted heat-dissipating fan, a plurality of inside mounted heat-dissipating fins, a pump, and a circulation pipe.