Patents by Inventor Stefan Landau
Stefan Landau has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20120306069Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.Type: ApplicationFiled: August 14, 2012Publication date: December 6, 2012Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
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Patent number: 8253241Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.Type: GrantFiled: May 20, 2008Date of Patent: August 28, 2012Assignee: Infineon Technologies AGInventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
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Publication number: 20120187565Abstract: A device includes a first semiconductor chip with a first contact pad on a first face and a second semiconductor chip with a first contact pad on a first face. The second semiconductor chip is placed over the first semiconductor chip, wherein the first face of the first semiconductor chip faces the first face of the second semiconductor chip. Exactly one layer of an electrically conductive material is arranged between the first semiconductor chip and the second semiconductor chip. The exactly one layer of an electrically conductive material electrically couples the first contact pad of the first semiconductor chip to the first contact pad of the second semiconductor chip.Type: ApplicationFiled: January 25, 2011Publication date: July 26, 2012Inventors: Henrik Ewe, Joachim Mahler, Anton Prueckl, Stefan Landau
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Publication number: 20120146201Abstract: A die arrangement includes a carrier having a first side and a second side opposite the first side, the carrier including an opening leading from the first side of the carrier to the second side of the carrier; a first die disposed over the first side of the carrier and electrically contacting the carrier; a second die disposed over the second side of the carrier and electrically contacting the carrier; and an electrical contact structure leading through the opening in the carrier and electrically contacting the second die.Type: ApplicationFiled: December 14, 2010Publication date: June 14, 2012Applicant: INFINEON TECHNOLOGIES AGInventors: Frank Daeche, Joachim Mahler, Anton Prueckl, Stefan Landau, Josef Hoeglauer
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Publication number: 20120061700Abstract: A method and a system for a reliable LED semiconductor device are provided. In one embodiment, the device comprises a carrier, a light emitting diode disposed on the carrier, an encapsulating material disposed over the light emitting diode and the carrier, at least one through connection formed in the encapsulating material, and a metallization layer disposed and structured over the at least one through connection.Type: ApplicationFiled: September 9, 2010Publication date: March 15, 2012Inventors: Andreas EDER, Henrik EWE, Stefan LANDAU, Joachim MAHLER
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Patent number: 8129225Abstract: A method includes providing an integral array of first carriers, arranging first semiconductor chips on the first carriers, and arranging an integral array of second carriers over the semiconductor chips.Type: GrantFiled: August 10, 2007Date of Patent: March 6, 2012Assignee: Infineon Technologies AGInventors: Stefan Landau, Alexander Koenigsberger, Joachim Mahler, Klaus Schiess
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Patent number: 8101463Abstract: A method of manufacturing a semiconductor device includes placing a chip on a carrier, and applying an electrically conducting layer to the chip and the carrier. The method additionally includes converting the electrically conducting layer into an electrically insulating layer.Type: GrantFiled: February 12, 2009Date of Patent: January 24, 2012Assignee: Infineon Technologies AGInventors: Manfred Mengel, Joachim Mahler, Stefan Landau
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Patent number: 8097959Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: GrantFiled: October 18, 2010Date of Patent: January 17, 2012Assignee: Infineon Technologies AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Patent number: 8097944Abstract: A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.Type: GrantFiled: April 30, 2009Date of Patent: January 17, 2012Assignee: Infineon Technologies AGInventors: Stefan Landau, Ralf Otremba, Uwe Kirchner, Andreas Schloegl, Christian Fachmann, Joachim Mahler
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Patent number: 7955901Abstract: A method for producing a power semiconductor module having surface mountable flat external contact areas is disclosed. At least one power semiconductor chip is fixed by its rear side on a drain external contact. An insulation layer covers the top side over the side edges of the semiconductor chip as far as the inner housing plane was a leaving free the source and gate contact areas on the top side of the semiconductor chip and also was partly leaving free the top sides of the corresponding external contacts.Type: GrantFiled: October 4, 2007Date of Patent: June 7, 2011Assignee: Infineon Technologies AGInventors: Henrik Ewe, Stefan Landau, Klaus Schiess, Robert Bergmann, Alvin Wee Beng Tatt, Soon Lock Goh, Joachim Mahler, Boris Plikat, Reimund Engl
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Patent number: 7955954Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: GrantFiled: April 14, 2008Date of Patent: June 7, 2011Assignee: Infineon Technologies AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Publication number: 20110127675Abstract: A method of manufacturing a laminate electronic device is disclosed. One embodiment provides a carrier, the carrier defining a first main surface and a second main surface opposite to the first main surface. The carrier has a recess pattern formed in the first main surface. A first semiconductor chip is attached on one of the first and second main surface. A first insulating layer overlying the main surface of the carrier on which the first semiconductor chip is attached and the first semiconductor chip is formed. The carrier is then separated into a plurality of parts along the recess pattern.Type: ApplicationFiled: December 1, 2009Publication date: June 2, 2011Applicant: INFINEON TECHNOLOGIES AGInventors: Henrik Ewe, Joachim Mahler, Anton Prueckl, Stefan Landau
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Publication number: 20110031597Abstract: A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The integral array of second carriers is arranged over the first semiconductor chips.Type: ApplicationFiled: October 18, 2010Publication date: February 10, 2011Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Joachim Mahler, Thomas Wowra
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Patent number: 7872350Abstract: A multi-chip module includes at least one integrated circuit chip that is electrically connected to first external terminals of the multi-chip module and at least one power semiconductor chip that is electrically connected to second external terminals of the multi-chip module. All first external terminals of the multi-chip module are arranged in a contiguous region of an terminal area of the multi-chip module.Type: GrantFiled: April 10, 2007Date of Patent: January 18, 2011Assignee: Qimonda AGInventors: Ralf Otremba, Josef Hoeglauer, Stefan Landau, Erwin Huber
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Publication number: 20100276797Abstract: A semiconductor device includes a substrate having a chip island, a chip attached to the chip island, and encapsulation material deposited on the chip and part of the chip island. The chip island includes a first main face to which the chip is attached opposite a second main face, with the second main face of the chip island defining at least one cavity.Type: ApplicationFiled: April 30, 2009Publication date: November 4, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Ralf Otremba, Uwe Kirchner, Andreas Schloegl, Christian Fachmann, Joachim Mahler
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Publication number: 20100200978Abstract: A method of manufacturing a semiconductor device includes placing a chip on a carrier, and applying an electrically conducting layer to the chip and the carrier. The method additionally includes converting the electrically conducting layer into an electrically insulating layer.Type: ApplicationFiled: February 12, 2009Publication date: August 12, 2010Applicant: INFINEON TECHNOLOGIES AGInventors: Manfred Mengel, Joachim Mahler, Stefan Landau
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Publication number: 20100044841Abstract: A semiconductor device includes a carrier, a chip attached to the carrier, a sealant vapor deposited over the chip and the carrier, and encapsulation material deposited over the sealed chip and the sealed carrier.Type: ApplicationFiled: August 20, 2008Publication date: February 25, 2010Applicant: Infineon Technologies AGInventors: Joachim Mahler, Michael Juerss, Stefan Landau
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Patent number: 7667337Abstract: A semiconductor device includes a carrier such as a lead frame, a semiconductor die and an attachment member affixing the semiconductor die to the carrier. The attachment device includes an electrically conductive organic material.Type: GrantFiled: September 20, 2007Date of Patent: February 23, 2010Assignee: Infineon Technologies AGInventors: Joachim Mahler, Thomas Behrens, Stefan Landau, Eduard Knauer, Rupert Fischer
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Publication number: 20090289354Abstract: An electronic module. One embodiment includes a carrier. A first transistor is attached to the carrier. A second transistor is attached to the carrier. A first connection element includes a first planar region. The first connection element electrically connects the first transistor to the carrier. A second connection element includes a second planar region. The second connection element electrically connects the second transistor to the carrier. In one embodiment, a distance between the first planar region and the second planar region is smaller than 100 ?m.Type: ApplicationFiled: May 20, 2008Publication date: November 26, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Stefan Landau, Erwin Huber, Josef Hoeglauer, Joachim Mahler, Tino Karczeweski
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Publication number: 20090273066Abstract: An electronic device and fabrication of an electronic device. One embodiment provides applying a paste including electrically conductive particles to a surface of a semiconductor wafer. The semiconductor wafer is singulated with the electrically conductive particles for obtaining a plurality of semiconductor chips. At least one of the plurality of semiconductor chips is placed over a carrier with the electrically conductive particles facing the carrier. The electrically conductive particles are heated until the at least one semiconductor chip adheres to the carrier.Type: ApplicationFiled: April 30, 2008Publication date: November 5, 2009Applicant: INFINEON TECHNOLOGIES AGInventors: Ivan Nikitin, Alexander Heinrich, Stefan Landau