Abstract: A light emitting device package includes: a package body having a first cavity; an electrode layer comprising a first electrode and a second electrode which are electrically isolated from each other; a light emitting device electrically connected to the electrode layer on the package body; a protective device disposed in a second cavity formed at the package body and electrically connected to the electrode layer; a reflective layer on the protective device; and a molding part on the light emitting device, wherein at least one of the first electrode and the second electrode is disposed on the package body.

Abstract: A light-emitting device, a method of fabricating the light-emitting device, a light-emitting device package and a lighting system are provided. The light-emitting device may include a substrate 105; a first conductivity type semiconductor layer 12 disposed on the substrate 105; an active layer 114 disposed on the first conductivity type semiconductor layer 12; a second conductivity type semiconductor layer 16 disposed on the active layer 114; a first electrode 131 disposed on the first conductivity type semiconductor layer 112; a second electrode 132 disposed on the second conductivity type semiconductor layer 116; a first light extraction pattern P provided on a top surface of the substrate 105; and a second light extraction pattern 150 provided on sides of the substrate 105.

Abstract: A light emitting device package includes: a package body having a first cavity; an electrode layer comprising a first electrode and a second electrode which are electrically isolated from each other; a light emitting device electrically connected to the electrode layer on the package body; a protective device disposed in a second cavity formed at the package body and electrically connected to the electrode layer; a reflective layer on the protective device; and a molding part on the light emitting device, wherein at least one of the first electrode and the second electrode is disposed on the package body.