Patents by Inventor Sung-Wook Hwang

Sung-Wook Hwang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11173894
    Abstract: An integrated chassis control method may include stability control after avoidance performing stability steering assist control after avoiding a forward collision situation by avoidance steering assist control when the forward collision situation is verified by an integrated chassis controller.
    Type: Grant
    Filed: November 29, 2018
    Date of Patent: November 16, 2021
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Il Park, Sung-Wook Hwang
  • Publication number: 20210338222
    Abstract: A soft tissue fixing anchor includes: an anchor member which is inserted to the bone cavity interior and prevented from moving in the bone cavity interior by the artificial joint when the artificial joint is implanted; and a suture of which one end portion is fixed to the anchor member and the other end portion is exposed to a bone cavity exterior of the bone so as to be sutured to the soft tissue.
    Type: Application
    Filed: April 29, 2020
    Publication date: November 4, 2021
    Inventors: Ho Jong LEE, Sung Wook HWANG
  • Patent number: 11094693
    Abstract: A semiconductor device includes circuit active fin lines and circuit gate lines intersecting each other in a circuit active region, dummy active fin lines and dummy gate lines intersecting each other in a dummy active region, the active fin lines and the dummy active fin lines having same width and pitch, and the circuit gate lines and the dummy gate lines having same width and pitch, wherein at least some of the dummy active fin lines are aligned with and collinear with respective circuit active fin lines, and at least some of the dummy gate lines are aligned with and collinear with respective circuit gate lines.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In Wook Oh, Jae Seok Yang, Jong Hyun Lee, Hyun Jae Lee, Sung Wook Hwang
  • Publication number: 20210162832
    Abstract: A vehicle integrated control method includes determining a road surface status, determining a vehicle status, determining an integrated control mode by determining a control status of an electronic control suspension and a motion of a sprung mass and an unsprung mass based on the determination results of the road surface status and the vehicle status, and controlling the electronic control suspension and an in-wheel system by determining a control amount based on the determined integrated control mode.
    Type: Application
    Filed: May 29, 2020
    Publication date: June 3, 2021
    Inventor: Sung Wook Hwang
  • Patent number: 10953872
    Abstract: A method for emergency steering control may include system cooperation control in which secondary collision avoidance is performed after forward collision avoidance by cooperatively controlling Emergency Steering Assist System (ESA) control through intervention in control of a Lane Keeping Assist System (LKAS) against excessive steering that causes lane departure in the ESA control when emergency steering is detected by an emergency steering controller in a forward collision situation.
    Type: Grant
    Filed: December 6, 2018
    Date of Patent: March 23, 2021
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Jae-Il Park, Sung-Wook Hwang
  • Patent number: 10923420
    Abstract: A semiconductor device includes a plurality of main contact plugs and a plurality of dummy contact plugs which pass through an insulating layer on a substrate. A plurality of upper interconnections is on the insulating layer. The plurality of dummy contact plugs include a first dummy contact plug. The plurality of upper interconnections include a first upper interconnection overlapping the first dummy contact plug. A vertical central axis of the first dummy contact plug is located outside the first upper interconnection.
    Type: Grant
    Filed: January 17, 2018
    Date of Patent: February 16, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: In Wook Oh, Dong Hyun Kim, Doo Hwan Park, Sung Keun Park, Chul Hong Park, Sung Wook Hwang
  • Patent number: 10885244
    Abstract: A test pattern includes first line patterns disposed at a first level, having discontinuous regions spaced apart by a first space, having a first width, and extending in a first direction. The test pattern includes a connection line pattern disposed at a second level and extending in the first direction, second line patterns disposed at the second level, branching from the connection line pattern, having a second width, and extending in a second direction perpendicular to the first direction. The test pattern includes via patterns disposed at a third level, having a third width, and formed around an intersection region having the first width of the first line pattern and the second width of the second line pattern. First pads are connected with the first line patterns. A second pad is connected with the connection line pattern.
    Type: Grant
    Filed: January 10, 2020
    Date of Patent: January 5, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Wook Hwang, Jong-Hyun Lee, Min-Soo Kang
  • Publication number: 20200151377
    Abstract: A test pattern includes first line patterns disposed at a first level, having discontinuous regions spaced apart by a first space, having a first width, and extending in a first direction. The test pattern includes a connection line pattern disposed at a second level and extending in the first direction, second line patterns disposed at the second level, branching from the connection line pattern, having a second width, and extending in a second direction perpendicular to the first direction. The test pattern includes via patterns disposed at a third level, having a third width, and formed around an intersection region having the first width of the first line pattern and the second width of the second line pattern. First pads are connected with the first line patterns. A second pad is connected with the connection line pattern.
    Type: Application
    Filed: January 10, 2020
    Publication date: May 14, 2020
    Inventors: SUNG-WOOK HWANG, JONG-HYUN LEE, MIN-SOO KANG
  • Publication number: 20200101955
    Abstract: A method of controlling driving of a vehicle using an in-wheel system includes: calculating a time to collision (TTC) by dividing a distance between the vehicle and an obstacle located in front of the vehicle by relative velocity; determining whether the vehicle enters a braking avoidance section, based on the calculated TTC; and generating, by a motor mounted in each wheel, braking force of a brake by an amount of shortage of braking force of the brake compared with a demanded braking force if the vehicle enters the braking avoidance section.
    Type: Application
    Filed: December 2, 2019
    Publication date: April 2, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Sung Wook Hwang
  • Publication number: 20200086856
    Abstract: A method for emergency steering control may include system cooperation control in which secondary collision avoidance is performed after forward collision avoidance by cooperatively controlling Emergency Steering Assist System (ESA) control through intervention in control of a Lane Keeping Assist System (LKAS) against excessive steering that causes lane departure in the ESA control when emergency steering is detected by an emergency steering controller in a forward collision situation.
    Type: Application
    Filed: December 6, 2018
    Publication date: March 19, 2020
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: JAE-II PARK, SUNG-WOOK HWANG
  • Patent number: 10572616
    Abstract: A test pattern includes first line patterns disposed at a first level, having discontinuous regions spaced apart by a first space, having a first width, and extending in a first direction. The test pattern includes a connection line pattern disposed at a second level and extending in the first direction, second line patterns disposed at the second level, branching from the connection line pattern, having a second width, and extending in a second direction perpendicular to the first direction. The test pattern includes via patterns disposed at a third level, having a third width, and formed around an intersection region having the first width of the first line pattern and the second width of the second line pattern. First pads are connected with the first line patterns. A second pad is connected with the connection line pattern.
    Type: Grant
    Filed: September 8, 2016
    Date of Patent: February 25, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sung-Wook Hwang, Jong-Hyun Lee, Min-Soo Kang
  • Patent number: 10562502
    Abstract: A method of controlling driving of a vehicle using an in-wheel system includes determining whether the vehicle enters a steering avoidance section, based on driving information of the vehicle, verifying a detailed or specific section in the steering avoidance section in which the vehicle is located when the vehicle enters the steering avoidance section, and controlling torque of a motor mounted in each wheel to satisfy a yaw moment required in the verified detailed section.
    Type: Grant
    Filed: May 28, 2017
    Date of Patent: February 18, 2020
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventor: Sung Wook Hwang
  • Patent number: 10549781
    Abstract: A vehicle according to an exemplary embodiment of the present invention includes an electronic chassis control system configured for an electronic control suspension (ECS), a motor driven power steering system (MDPS), an electronic stability control (ESC), and an all wheel drive (AWD), and an integrated controller implementing an integrated avoidance control in which controls for each of the MDPS, the ESC, and the AWD according to an emergency avoidance control of the ECS in the forward collision situation, wherein it is possible to safely and rapidly avoid risk of forward collision, and cooperative control performance of the ECS and the AWD, the ESC and the MDPS is optimized by applying an emergency grade to the integrated avoidance control.
    Type: Grant
    Filed: November 10, 2017
    Date of Patent: February 4, 2020
    Assignees: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Il Park, Sung-Wook Hwang
  • Publication number: 20190198496
    Abstract: A semiconductor device includes circuit active fin lines and circuit gate lines intersecting each other in a circuit active region, dummy active fin lines and dummy gate lines intersecting each other in a dummy active region, the active fin lines and the dummy active fin lines having same width and pitch, and the circuit gate lines and the dummy gate lines having same width and pitch, wherein at least some of the dummy active fin lines are aligned with and collinear with respective circuit active fin lines, and at least some of the dummy gate lines are aligned with and collinear with respective circuit gate lines.
    Type: Application
    Filed: January 23, 2019
    Publication date: June 27, 2019
    Inventors: In Wook OH, Jae Seok YANG, Jong Hyun LEE, Hyun Jae LEE, Sung Wook HWANG
  • Publication number: 20190184978
    Abstract: An integrated chassis control method may include stability control after avoidance performing stability steering assist control after avoiding a forward collision situation by avoidance steering assist control when the forward collision situation is verified by an integrated chassis controller.
    Type: Application
    Filed: November 29, 2018
    Publication date: June 20, 2019
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Il Park, Sung-Wook Hwang
  • Publication number: 20190176811
    Abstract: An integrated chassis control method to improve driving stability may include mountain-road integrated chassis control allowing, when a road on which a vehicle drives is checked to be the route of a mountain road by an integrated chassis controller, electronic control suspension (ECS) damping force and all wheel drive (AWD) driving force distribution to be controlled in a different manner according to uphill and downhill roads due to a difference of elevation of the mountain road.
    Type: Application
    Filed: November 14, 2018
    Publication date: June 13, 2019
    Applicants: Hyundai Motor Company, Kia Motors Corporation
    Inventors: Jae-Sung Cho, Sung-Wook Hwang
  • Patent number: 10291023
    Abstract: The present invention relates to an inverter device for a microgrid, and a method for controlling the same, the inverter device including: a waveform detector detecting a voltage waveform and a current waveform applied to a load; a control unit determining whether a sine wave appears based on the detected voltage waveform and the detected current waveform and performing voltage control or low order harmonic compensation depending on a determination result; and a switch generating a voltage waveform in a form of the sine wave by being turned on/off depending on a control signal received from the control unit and supplying the generated voltage waveform in the form of the sine wave to the load.
    Type: Grant
    Filed: July 14, 2016
    Date of Patent: May 14, 2019
    Assignee: KOREA ELECTRIC POWER CORPORATION
    Inventors: Woo-Kyu Chae, Hak-Ju Lee, Jong-Nam Won, Il-Keun Song, Jung-Sung Park, Sung-Wook Hwang
  • Patent number: 10217742
    Abstract: A semiconductor device includes circuit active fin lines and circuit gate lines intersecting each other in a circuit active region, dummy active fin lines and dummy gate lines intersecting each other in a dummy active region, the active fin lines and the dummy active fin lines having same width and pitch, and the circuit gate lines and the dummy gate lines having same width and pitch, wherein at least some of the dummy active fin lines are aligned with and collinear with respective circuit active fin lines, and at least some of the dummy gate lines are aligned with and collinear with respective circuit gate lines.
    Type: Grant
    Filed: February 22, 2018
    Date of Patent: February 26, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: In Wook Oh, Jae Seok Yang, Jong Hyun Lee, Hyun Jae Lee, Sung Wook Hwang
  • Publication number: 20190051600
    Abstract: A semiconductor device includes a plurality of main contact plugs and a plurality of dummy contact plugs which pass through an insulating layer on a substrate. A plurality of upper interconnections is on the insulating layer. The plurality of dummy contact plugs include a first dummy contact plug. The plurality of upper interconnections include a first upper interconnection overlapping the first dummy contact plug. A vertical central axis of the first dummy contact plug is located outside the first upper interconnection.
    Type: Application
    Filed: January 17, 2018
    Publication date: February 14, 2019
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: In Wook OH, Dong Hyun KIM, Doo Hwan PARK, Sung Keun PARK, Chul Hong PARK, Sung Wook HWANG
  • Patent number: 10204892
    Abstract: A semiconductor package may be composed of a variety of different types of semiconductor chips of different sizes and support structures stacked within the semiconductor package. Semiconductor chips having a larger chip size may be stacked above smaller semiconductor chips. Smaller chips may be included in a layer of the semiconductor package along with a support structure which may assist supporting upper semiconductor chips, such as during a wire bonding process connecting bonding wires to chip pads of the semiconductor chips above the support structure. Use of different thicknesses of die attach film may allow for a further reduction in height of the semiconductor package.
    Type: Grant
    Filed: June 14, 2017
    Date of Patent: February 12, 2019
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Tae-young Lee, Joon-young Oh, Sung-wook Hwang, Yeoung-jun Cho