Abstract: A method of manufacturing a mask includes aligning a mask substrate comprising a thin film at a processing position, forming a coating layer comprising a cleaning solution material on a first surface of the mask substrate, forming a deposition pattern on a second surface of the mask substrate, and removing the coating layer from the mask substrate comprising the deposition pattern.

Abstract: An apparatus for forming an optical pattern includes a vacuum chamber, a mount on which a substrate to be prepared using a mask is to be supported, a diffusion unit adjacent the mask, spaced apart from the mask by a preset interval, and facing the mask, the diffusion unit to diffuse light incident thereon as uniform surface light and transmit the uniform surface light to the mask, and a light source unit spaced in a lateral direction from the diffusion unit, the light source unit to generate light to be incident on the diffusion unit.

Abstract: A semiconductor package includes an adhesive member disposed on a package substrate to have a trapezoid cross-section view, and a semiconductor chip disposed on the adhesive member and attached to the package substrate by the adhesive member. The semiconductor chip has a first surface and a second surface facing the first surface, and the second surface of the semiconductor chip contacts the adhesive member. The semiconductor chip includes a tension supplement pattern attached to the second surface and spaced apart from the package substrate.

Abstract: A laser irradiation device includes a laser generator for patterning and a laser generator for preheating. A laser induced thermal imaging (LITI) method, includes preparing an acceptor substrate, laminating a donor substrate on the acceptor substrate, and irradiating a laser beam onto a predetermined region of the donor substrate and carrying out transfer using a laser irradiation device having a laser generator for patterning and a laser generator for preheating. Advantageously, a laser beam having high intensity generated by the laser generator for patterning is used to prevent the transfer layer from being degraded, and a laser beam generated by the laser generator for preheating is simultaneously used for preheating so that an edge open failure does not occur and the transfer can be readily carried out even in a portion having a step of the acceptor substrate.

Abstract: A method of manufacturing a mask includes: providing a base substrate including light-absorbing layer patterns on a first surface thereof; providing a reflective layer on the light-absorbing layer patterns and the first surface of the base substrate; and providing reflective patterns by partially removing the reflective layer. The providing the reflective patterns includes removing the light-absorbing layer patterns and a portion of the reflective layer, by irradiating the light-absorbing layer patterns with laser light.

Abstract: A semiconductor chip includes a semiconductor substrate having a front surface, a circuit unit formed within the semiconductor substrate and extending from the front surface into the semiconductor substrate, and a rear surface opposite the front surface, and a girder beam disposed outside of the circuit unit and within the semiconductor substrate.

Abstract: An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device has a structure including an organic layer between a pixel electrode and an opposite electrode, the organic layer including a emissive layer and an insulating layer defining a light emission area. Accordingly, the insulating layer included in the organic layer functions as a pixel-defining layer, and thus, “edge open”, which is generated when forming an emissive layer on a thick pixel-defining layer according to the comparable art, may be reduced or prevented.

Abstract: Provided are a laser induced thermal imaging (LITI) mask, a laser irradiation apparatus including the LITI mask, and a method of manufacturing an organic light emitting device by using the LITI mask. The LITI mask including an opening corresponding to a pixel region and an opening corresponding to an edge of a pixel is used to form an organic layer in an upper portion of a substrate of an organic light emitting device, thereby transferring the organic layer to an edge of the pixel region.

Abstract: In a flat panel display and a method of fabricating the same, the flat panel display includes a substrate having a pixel region and alignment mark regions. The alignment mark regions are disposed at opposite sides of the pixel region and along the pixel region. A unit pixel array is arranged on the pixel region in a matrix manner. The alignment mark regions have at least one pair of alignment marks disposed thereon in an opposing manner. The alignment mark pairs are located in correspondence with respective columns of the unit pixel array.

Abstract: In a laser irradiation device, a patterning method and a method of fabricating an Organic Light Emitting Display (OLED) using the same. The laser irradiation device includes a light source, a mask, a projection lens, and a Fresnel lens formed at a predetermined portion of the mask to change an optical path. When an organic layer pattern is formed using the laser irradiation device, laser radiation is irradiated onto a region of an organic layer, which is to be cut, and the laser radiation is appropriately irradiated onto a region of the organic layer, which is to be separated from a donor substrate. The laser radiation irradiated onto an edge of the organic layer pattern has a laser energy density greater than that of the laser radiation irradiated onto other portions of the organic layer pattern. As a result, it is possible to form a uniform organic layer pattern and reduce damage of the organic layer.

Abstract: An organic light-emitting display apparatus includes: a plurality of thin film transistors (TFTs); a planarization layer covering the plurality of TFTs; a plurality of pixel electrodes formed on the planarization layer, each of the pixel electrodes being connected to a corresponding one of the plurality of TFTs using a via-hole passing through the planarization layer and having a light-emitting portion and a non-emitting portion, and each of the via-holes being located at a point farthest from each of the light-emitting portions surrounding the via-hole; a pixel defining layer formed on the planarization layer to respectively cover each of the via-holes and the non-emitting portions; organic layers, each organic layer including an emission layer and being disposed in a corresponding one of the light-emitting portions; and a counter electrode disposed on each of the organic layers.

Abstract: A method of manufacturing a mask includes: providing a base substrate including light-absorbing layer patterns on a first surface thereof; providing a reflective layer on the light-absorbing layer patterns and the first surface of the base substrate; and providing reflective patterns by partially removing the reflective layer. The providing the reflective patterns includes removing the light-absorbing layer patterns and a portion of the reflective layer, by irradiating the light-absorbing layer patterns with laser light.

Abstract: A laser irradiation device includes a light source, a laser induced thermal imaging (LITI) mask, and a stage. The light source may emit a laser beam at constant output energy. The LITI mask may be disposed under the light source. The stage may be disposed under the LITI mask, and an acceptor substrate including a pixel area is disposed on the stage. The LITI mask may include a transmissive part and a blocking part. The transmissive part has a plurality of slits. The laser beam passes through the slits. The transmissive part corresponds to the pixel area. The blocking part may reflect and block the laser beam.

Abstract: A laser induced thermal imaging apparatus comprises a substrate support configured to support a substrate, a donor film holder configured to hold a donor film at a position over the substrate support, and a press unit comprising a first elastic member and a second elastic member disposed over the substrate support. The press unit is configured to move the first and second elastic members in a pressing direction toward the substrate support for pressing the donor film to the substrate to laminate the donor film onto the substrate. The second elastic member surrounds the first elastic member when viewed in the pressing direction and is more rigid than the first elastic member.

Abstract: Provided are a laminating apparatus and a laminating method using the same. In an aspect, the laminating apparatus includes a stage, a heating bar, and a press part. In an aspect, the laminating may be performed in a state where the donor film is closely attached to the substrate to prevent defects of the donor film from occurring during the laminating, thereby improving reliability of the laminating apparatus.

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract: Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked.

Abstract: A stack package having a plurality of stacked chips includes first voltage dropping units respectively formed in the plurality of chips, the first voltage dropping units are electrically coupled by a first line; second voltage dropping units respectively formed in the plurality of chips, the second dropping units are electrically coupled by a second line; first signal generation units respectively formed in the plurality of chips, each of the first signal generation units is connected to an output node of the first voltage dropping units, respectively; and second signal generation units respectively formed in the plurality of chips, each of the second signal generation units is connected to an input node of the second voltage dropping units, respectively.

Abstract: A laser irradiation device and a method of fabricating an organic light emitting display device (OLED) using the same are disclosed. The laser irradiation device includes: a laser source generating a laser beam; a mask disposed below the laser source and patterning the beam and a projection lens disposed below the mask and determining magnification of the laser beam through the mask, wherein the laser beam penetrating the mask has different doses in at least two regions. Thus, the laser irradiation device can maximize emission efficiency and enhance the quality of a transfer layer pattern when an organic layer of the OLED is formed using the laser irradiation device.

Abstract: A semiconductor package includes a first semiconductor chip formed with a first through-silicon via; a second semiconductor chip stacked over the first semiconductor chip and formed with a second through-silicon via; and a cantilever formed over the first semiconductor chip and electrically connected to the first through-silicon via or the second through-silicon via according to an electrical signal.