Abstract: A laser irradiation device and a method of manufacturing an organic light emitting diode display device using the same. The laser radiation device prevents the scattering of the laser light into portions of the donor substrate that correspond to non-transmissive regions of a mask pattern. To reduce the scattering, the mask pattern is designed so that 1) non-transmissive regions of a surface of the mask pattern that faces the laser source have a reflective layer, 2) the surface of the mask pattern that faces the laser source is oriented to have a certain angle with respect to the laser beam axis, and 3) a surface of the mask pattern that faces the donor substrate has an anti-reflective layer. Each of these design aspects of the mask pattern prevents laser light from being scattered and prevents irradiating portions of the donor substrate that corresponds to a non-transmissive region of the mask pattern.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: Provided is a method of fabricating an organic light emitting display. The method includes forming an organic layer pattern on a substrate by irradiating a predetermined region of a donor substrate with a laser beam using a laser irradiation apparatus, the laser irradiation apparatus having a spatial light modulator (SLM). The spatial light modulator is used to form the organic layer pattern using the LITI method. Accordingly, it is possible to adjust various types of incident light to homogeneous and to have a desired profile. Therefore, there is provided a method of fabricating an organic light emitting display which is capable of forming an organic layer pattern without using a mask.

Abstract: A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.

Abstract: An organic light-emitting display apparatus is disclosed.

Abstract: Electronic device packages and related methods are provided. The electronic device package includes a first substrate having a first contact portion disposed thereon, a bump having a first contact surface connected to the first contact portion and a second contact surface disposed opposite to the first contact surface, and a buffer spring pad portion between the first contact portion of the first substrate and the first contact surface of the bump. The buffer spring pad portion includes at least two different conductive material layers which are stacked.

Abstract: A donor substrate for laser induced thermal imaging and a method of fabricating an organic light emitting diode (OLED) using the donor substrate are disclosed. In one embodiment, the donor substrate includes a base film, a light-to-heat conversion layer formed on the base film, a buffer layer formed on the light-to-heat conversion layer, and a transfer layer formed on the buffer layer. The buffer layer is formed of magnesium (Mg), an Mg alloy, or magnesium oxide. In the donor substrate for laser induced thermal imaging, the buffer layer is formed between the interlayer and the transfer layer or between the light-to-heat conversion layer and the transfer layer, so that surface characteristics between the donor substrate and the transfer layer can be improved.

Abstract: A laser irradiation device and a method of fabricating an organic light emitting display device (OLED) using the same are disclosed. The laser irradiation device includes: a laser source generating a laser beam; a mask disposed below the laser source and patterning the beam and a projection lens disposed below the mask and determining magnification of the laser beam through the mask, wherein the laser beam penetrating the mask has different doses in at least two regions. Thus, the laser irradiation device can maximize emission efficiency and enhance the quality of a transfer layer pattern when an organic layer of the OLED is formed using the laser irradiation device.

Abstract: An organic electro luminescent display with auxiliary layers on a cathode contact and an encapsulating junction region to easily remove polymer organic layers of the junction. The organic electro luminescent display has the first electrode formed on a lower insulating substrate, a pixel defining layer formed to make some portions of the first electrode opened over the entire surface of the lower insulating substrate, an organic emission layer formed on an opening of the first electrode, the second electrode formed on the organic emission layer, an upper substrate for encapsulating the first electrode, the organic emission layer and the second electrode, and auxiliary layers formed on the cathode contact and the encapsulating junction region of the lower insulating substrate.

Abstract: A laser irradiation device and a method of fabricating an organic light emitting display device (OLED) using the same are disclosed. The laser irradiation device includes: a laser source generating a laser beam; a mask disposed below the laser source and patterning the beam and a projection lens disposed below the mask and determining magnification of the laser beam through the mask, wherein the laser beam penetrating the mask has different doses in at least two regions. Thus, the laser irradiation device can maximize emission efficiency and enhance the quality of a transfer layer pattern when an organic layer of the OLED is formed using the laser irradiation device.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a plurality of pixels comprising a blue light emitting region, a green light emitting region, and a red light emitting region on a substrate and formed by stacking a lower electrode, an organic layer, and an upper electrode. In one embodiment, the blue and green light emitting regions are formed in a microcavity structure, and the red light emitting region is formed in a non-microcavity structure.

Abstract: A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: An organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device has a structure including an organic layer between a pixel electrode and an opposite electrode, the organic layer including a emissive layer and an insulating layer defining a light emission area. Accordingly, the insulating layer included in the organic layer functions as a pixel-defining layer, and thus, “edge open”, which is generated when forming an emissive layer on a thick pixel-defining layer according to the comparable art, may be reduced or prevented.

Abstract: An organic layer of an organic light emitting diode (OLED) display device is formed by transferring a transfer layer of a donor film to aligned pixel openings in a pixel defining region of the OLED display device such that the organic layer is formed in the pixel openings. Each aligned pixel opening has a pair of long sides and a pair of short sides, and the transferring of the transfer layer is performed by applying tensile force to the donor film in a direction perpendicular to the short sides of the pixel openings.

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: A laser induced thermal imaging (LITI) apparatus and a method of making an electronic device using the same are disclosed. The LITI apparatus includes a chamber, a substrate support, a contact frame, and a laser source or oscillator. The LITI apparatus transfers a transferable layer from a film donor device onto a surface of an intermediate electronic device. The LITI apparatus uses a magnetic force to provide a close contact between the transferable layer and the surface of the intermediate device. The magnetic force is generated by magnetic materials formed in two components of the LITI apparatus that are spaced apart interposing transferable layer and the surface of the intermediate device. Magnets or magnetic materials are formed in the two following components of the LITI apparatus: 1) the intermediate device and the film donor device; 2) the intermediate device and the contact frame; 3) the substrate support and the film donor device; or 4) the substrate support and the contact frame.

Abstract: A stack package having stacked chips includes first voltage dropping units respectively formed in the chips; second voltage dropping units respectively formed in the chips; first signal generation units connected in parallel to a first line formed by connecting the first voltage dropping units in series, respectively formed in the chips, and configured to apply high level signals according to a voltage of the first line; second signal generation units connected in parallel to a second line formed by connecting in series the second voltage dropping units, respectively formed in the chips, and configured to apply high level signals according to a voltage of the second line; and chip selection signal generation units respectively formed in the chips, and configured to combine signals outputted from the first signal generation units and the second signal generation units and generate chip selection signals.