Abstract: A semiconductor package includes a first semiconductor chip formed with a first through-silicon via; a second semiconductor chip stacked over the first semiconductor chip and formed with a second through-silicon via; and a cantilever formed over the first semiconductor chip and electrically connected to the first through-silicon via or the second through-silicon via according to an electrical signal.

Abstract: Provided are a laser induced thermal imaging (LITI) mask, a laser irradiation apparatus including the LITI mask, and a method of manufacturing an organic light emitting device by using the LITI mask. The LITI mask including an opening corresponding to a pixel region and an opening corresponding to an edge of a pixel is used to form an organic layer in an upper portion of a substrate of an organic light emitting device, thereby transferring the organic layer to an edge of the pixel region.

Abstract: A stack semiconductor package includes a first insulation member having engagement projections and a second insulation member formed having engagement grooves into which the engagement projections are to be engaged. First conductive members are disposed in the first insulation member and have portions which are exposed on the engagement projections. Second conductive members are disposed in the second insulation member in such a way as to face the first conductive members and have portions which are exposed in the engagement grooves. A first semiconductor chip is disposed within the first insulation member and is electrically connected to the first conductive members. A second semiconductor chip is disposed in the second insulation member and is electrically connected to the second conductive members.

Abstract: A semiconductor package having an improved connection structure and a method for manufacturing the same is described. The semiconductor package includes a substrate having a substrate body, connection pads that are located on one surface of the substrate body, and ball lands that are located on the other surface of the substrate body opposite the one surface. The ball lands are electrically connected to the connection pads. A semiconductor chip having bumps that are formed to correspond to the connection pads is connected to the substrate. An anisotropic conductive member having an insulation element is interposed between the substrate and the semiconductor chip to connect the substrate and the semiconductor chip. Electrically flowable conductive particles within the insulation element flow in the insulation element according to applied electric fields so as to arrange the electrically flowable conductive particles between the connection pads and the bumps.

Abstract: A method for fabricating a display device includes providing a substrate, forming an underlying layer over the substrate, forming an insulating layer over the substrate exposing the underlying layer, and forming an organic EL layer on the exposed portion of the underlying layer by a Laser Induced Thermal Imaging (LITI) method, wherein a thickness of the insulating layer is less than 500 nm.

Abstract: A display device includes an underlying layer formed over a substrate; an insulating layer formed over the substrate to expose the underlying layer; and an organic EL layer formed on the exposed portion of the underlying layer, wherein a thickness of the insulating layer is formed to a predetermined thickness to prevent defects in the organic EL layer that can occur in an edge portion of the exposed portion.

Abstract: A semiconductor chip includes a silicon wafer formed with a via hole, a metal wire disposed in the via hole, and a filler that exposes a part of an upper portion of the metal wire while filing the via hole.

Abstract: An organic light emitting diode (OLED) display is disclosed. In one embodiment, the OLED display includes i) a plurality of pixels comprising a blue light emitting region, a green light emitting region, and a red light emitting region on a substrate and formed by stacking a lower electrode, an organic layer, and an upper electrode. In one embodiment, the blue and green light emitting regions are formed in a microcavity structure, and the red light emitting region is formed in a non-microcavity structure.

Abstract: A manufacturing method of an active matrix organic light emitting diode (AMOLED) display and an apparatus for manufacturing the AMOLED display, where the display has improved surface flatness and thickness uniformity as well as an improved image quality at edge regions of a pattern. According to the exemplary embodiment of the present invention, an anode electrode is formed on a lower structure of a substrate, an organic layer is formed on the anode electrode by imaging a complex laser beam on a donor film disposed on the substrate having light emitting materials, the complex laser beam having energy distribution inclination over 2%/?m at a threshold energy. The donor film is removed, and a cathode electrode is formed on the organic layer.

Abstract: A crucible heating apparatus and a deposition apparatus including the same. The crucible heating apparatus includes: a crucible including a main body to house a deposition material, and a cover disposed on the main body, having a nozzle; a band coupled to the crucible, through contact parts; a thermocouple coupled to the band; a housing to house the crucible and the band; and a heater disposed inside the housing, to heat the deposition material.

Abstract: A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Abstract: An organic light-emitting display apparatus includes: a plurality of thin film transistors (TFTs); a planarization layer covering the plurality of TFTs; a plurality of pixel electrodes formed on the planarization layer, each of the pixel electrodes being connected to a corresponding one of the plurality of TFTs using a via-hole passing through the planarization layer and having a light-emitting portion and a non-emitting portion, and each of the via-holes being located at a point farthest from each of the light-emitting portions surrounding the via-hole; a pixel defining layer formed on the planarization layer to respectively cover each of the via-holes and the non-emitting portions; organic layers, each organic layer including an emission layer and being disposed in a corresponding one of the light-emitting portions; and a counter electrode disposed on each of the organic layers.

Abstract: A stack package includes a first package having a first semiconductor chip and a first encapsulation member which seals the first semiconductor chip. A second package is stacked on the first package, and includes a second semiconductor chip and a second encapsulation member which seals the second semiconductor chip. Flexible conductors are disposed within the first encapsulation member of the first package in such a way as to electrically connect the first package and the second package.

Abstract: An organic light-emitting display apparatus is disclosed.

Abstract: A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

Abstract: The invention is directed to an organic electroluminescent (EL) display device having an improved light extracting efficiency due to a photonic crystal layer formed proximate one side of a stack. Among other elements, the stack may include a first electrode formed on a substrate, an organic light emitting layer formed above the first electrode, and a second electrode formed above the organic light emitting layer. Additionally, the photonic crystal layer may be configured to correspond to a wavelength of colored light. An organic EL display device having an improved light extracting efficiency may be manufactured using a thermal transfer donor film to adhere the photonic crystal layer to the stack.

Abstract: A semiconductor package includes an electromagnetic shielding member for shielding electromagnetic waves. An antenna is disposed on an upper face of the electromagnetic shielding member and includes an antenna part with a plurality of conductive particles electrically connected with each other and an insulation part disposed on the upper face of the electromagnetic shielding member and insulating the antenna part. Ball lands are disposed on the electromagnetic shielding member and are electrically connected with the antenna part. A Radio Frequency Identification (RFID) chip is electrically connected to the ball lands.

Abstract: A laser irradiation apparatus and method of fabricating an organic light emitting display using the same are provided. The laser irradiation apparatus includes: a laser generator; a mask having means for changing a propagation path of a laser beam; and a projection lens. The method of fabricating an organic light emitting display includes: irradiating a laser beam on an edge of an irradiated region of a donor substrate using the laser irradiation apparatus with high intensity to form an organic layer pattern on a substrate. The laser beam having low intensity can perform a transfer process to improve laser beam efficiency. In addition, it is possible to reduce damage on the organic layer, and improve quality of the transferred organic layer pattern.

Abstract: Provided are a laser irradiation apparatus and method of fabricating an organic light emitting display using the same. The laser irradiation apparatus includes a mask positioned below the laser generator, and the mask is patterned such that lengths of an upper portion and a lower portion of a mask pattern are patterned longer than a length of a middle portion of the mask pattern with respect to the scanning direction. The method of fabricating an organic light emitting display includes scanning a laser beam on a predetermined region of the donor substrate using the laser irradiation apparatus to form an organic layer pattern on the substrate. When the organic layer pattern is formed using a laser induced thermal imaging (LITI) method, the transfer may be carried out using a laser beam having low energy, laser beam efficiency may be enhanced, the organic layer may be less damaged, and the quality of the organic layer pattern to be transferred may also be enhanced.

Abstract: A substrate includes a substrate; a number of pad redistribution chips stacked on the substrate and on one another after being rotated 90° in a predetermined direction relative to one another, the pad redistribution chips having a number of center pads positioned at the center thereof, a number of (+) edge pads positioned on an end thereof while corresponding to those of the center pads lying in (+) direction from a middle center pad located in the middle of the center pads, a number of (?) edge pads positioned on the other end thereof while corresponding to those of the center pads lying in (?) direction with symmetry to those of the center pads lying in the (+) direction, and a number of traces for electrically connecting the center pads to the corresponding (±) edge pads, respectively; a flexible PCB for electrically connecting the substrate to the pad redistribution chips; and an anisotropic dielectric film for electrically connecting the pad redistribution chips to the flexible PCB and the substrate to t